BGA29 Search Results

MD-001A

Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)

JEDEC TRAY DIMENSIONS

Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)

0.3mm pitch BGA

Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Contextual Info: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1

P-BGA-292

Abstract: PBGA292
Contextual Info: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

C BGA292

Abstract: BGA292 MS-034 BGA-292 sot881
Contextual Info: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G

BGA-292

Abstract: BGA292 C BGA292 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K

SF-BGA292A-B-11

Contextual Info: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

SD2608

Abstract: IEEE754 MN103E010HRA MN103E040HYB
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

PRBG0297FA-A

Abstract: P-BGA297-23x23-1
Contextual Info: JEITA Package Code P-BGA297-23x23-1.00 RENESAS Code PRBG0297FA-A B D1 D Previous Code 297F7X-A MASS[Typ.] 1.7g A A ZD b S AB e ZE AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

sd2608

Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

jedec bga tray

Abstract: 784-pin 12Surface tray bga BGA package tray
Contextual Info: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)

SF-BGA296A-B-11

Contextual Info: D Package Code: BGA296A 26.67mm [1.050"] C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X 26.67mm [1.050"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

MO-151

Abstract: BGA292 transistor t 04 27 C BGA292
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

BGA292

Abstract: SF-BGA292B-B-11
Contextual Info: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

BGA292

Abstract: BGA-292
Contextual Info: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1

Contextual Info: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x

Contextual Info: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5

VDD18

Abstract: CLK48
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

SAMSUNG MCP

Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
Contextual Info: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)

Contextual Info: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised

BGA292

Abstract: RGMII to SGMII RJ45 1000M PHY
Contextual Info: DP83864 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer Literature Number: SNLS172B September 2003 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer General Description Features bs ol e te The DP83864 is an extremely efficient full featured Quad • IEEE compliant 10BASE-T,100BASE-TX, 1000BASE-T

Nexus S JTAG pins

Abstract: mPC5746m Nexus S camera
Contextual Info: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

A4H1

Abstract: HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement
Contextual Info: REJ09B0366-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7750, SH7750S, SH7750R Group 32