BGA25 Search Results

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e

BGA256 17 X 17

Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Contextual Info: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape

PB-BGA256J-Z-01

Abstract: SF-BGA256J-B-01 SF-BGA232A-B-01
Contextual Info: U.S. PATENT 6,351,392 78.64mm [3.096"] 2.54mmtyp. [0.100"] 19.23mm [0.757"] 50.8mm [2.000"] Top View 1 * This height variable depends on the screw position. * 2 9.97mm [0.393"] 12.6mm [0.496"] 6mm [0.236"] Side View For Probing BGA256J use SF-BGA256J-B-01

BGA256

Abstract: sot466 BGA256 17 X 17
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

P-BGA256-17x17-1

Abstract: P-BGA-256-1 PRBG0256FB-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e

P-BGA256-27x27-1

Abstract: PRBG0256DA-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

LA-BGA-740-S-B-02

Abstract: LS-BGA255A-02
Contextual Info: 2.840" 37 J4-1 38 2 2 38 J1-1 37 37 38 37 2 J5-1 38 J3-1 2 37 38 J2-1 2 1.188" 2.770" Top View 0.748" Side View LS-BGA255A-02 0.827" Plugged 0.233" 0.150" 1 0.236" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01 1 2 3 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material.

BGA256

Abstract: BGA256 17 X 17
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

PRBG0256DD-A

Abstract: 2.5G P-BGA-256-2
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BP-256

Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5

BGA256

Contextual Info: P-BGA256-1717-1.00AZ Uniti nn Jul.2003

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

BGA25

Abstract: TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm A' 7 25.50 27.50 20.00 25.50 135°C MAX. 26.70 BGA25x25ESP 27.50 NEC 82.5 135.9 4×11=44 PPE A 275.0 315.0 322.6 SECTION A – A' 25.50 (6.01) (6.35) 7.62 25.00 Applied Package Quantity (pcs) 240-pin Plastic BGA (25×25) (CAVITY DOWN ADVANCED TYPE)

sm 0038

Abstract: SF-BGA256B-B-11
Contextual Info: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

BGA360

Abstract: PPC603 bga255 PPC750
Contextual Info: 1.060" 1.000" 0.984" PPC603 BGA255 PPC750 (BGA360) A1 A1 0.900" 0.984" 0.050" Ø 0.025" pad 0.051" Top View Bottom View Removeable Pins to Aid In Alignment. 3 0.048" 1 1 2 2 Side View 3 0.024"±0.005" Substrate: 0.0480"±0.007" FR4/G10 or equivalent high

BGA256

Abstract: P-BGA-256-2
Contextual Info: P-BGA256-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

16X16

Abstract: SF-BGA256F-B-11
Contextual Info: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

16x16 bga

Abstract: logic analyzer 16X16 LA-BGA-740-Z-B-02 BGA zif socket DASF00504
Contextual Info: 38 37 J5-1 2 J2-1 37 2 2 38 J3-1 J4-1 38 37 2 2.840" 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A B C D E F G H J K L M N P R T 2.770" Top View 38 37 2 38 J1-1 37 Side View 0.897" Plugged 0.233" 0.150" 1 0.237" 2 1.266" 0.725" 0.140" Plugged 3 SF-BGA255A-B-01

16x16 bga

Abstract: 16X16 SF-BGA256G-B-11
Contextual Info: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

BGA256

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

SF-BGA256C-B-11

Abstract: BGA 23 x 23 array
Contextual Info: D C Package Code: BGA256C See BGA pattern code to the right for actual pattern layout Y 27.94mm [1.100"] 0.64mm [0.025"] 0.89mm [0.035"] X Top View reference only 27.94mm [1.100"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

180 ohm resistor

Abstract: Tektronix LA-BGA-740-S-B-01
Contextual Info: 2.550" 0.845" 8 16 Hi_A A1 1 H 2.525" 15 T JTAG Lo_D Lo_E 0.845" 0.853" Side View LS-BGA255A-02 0.858" Each Mictor connection contains a 180 ohm resistor to source. 0.480" 0.827" Plugged PROPRIETARY INFORMATION Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD

Contextual Info: P-BGA256-2727-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 2.22 TYP. 2/Oct. 28, 1996