BGA31 Search Results

Contextual Info: SIE M E N S BGA318 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • • Cascadable 50 Q-Gain Block 16 dB typical Gain at 1.0 GH2 12 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidth: DC to 1.2 GHz Plastic Package Type Marking Ordering Code 8-mm taped

Contextual Info: Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 2 shape optional 4x

PBGA-316

Abstract: PRBG0316DB-A 316F
Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DB-A D Previous Code 316F7A MASS[Typ.] 2.6g A ZD A B D1 φb φx M S AB e y S Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 1011121314151617181920 S Index mark Reference Symbol

BGA312

Abstract: Q62702-G0042 mmic-amplifier BMS 13-58 Type 01
Contextual Info: BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data l Cascadable 50 Ω-Gain Block l 11 dB typical Gain at 1.0 GHz l 9 dBm typical P at 1.0 GHz l 3 dB-Bandwidth: DC to 2.0 GHz l Plastic Package -1dB Type Marking BGA312 BMs Ordering Code 8-mm taped Q62702-G0042

PRBG0316DA-A

Contextual Info: JEITA Package Code P-BGA316-27x27-1.27 RENESAS Code PRBG0316DA-A D Previous Code 316F7X-A A MASS[Typ.] 2.6g A B D1 ZD b S AB e y S 1pin corner S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

SOT143 marking A01

Abstract: BGA310 Q62702-G0041
Contextual Info: SIE M E N S • ä2 3 StOS 0 0 ^ 0 5 2 0 240 ■ BGA310 SiliconBipolarMMIC-Amplifier Preliminary Data • • • • Cascadable 50 Q-Gain Block 9 dB typical Gain at 1.0 GHz 9 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidth: DC to 2.4 GHz Plastic Package Type

nec 2505

Abstract: tray datasheet bga BGA 927 tray bga nec 3131
Contextual Info: TRAY CONTAINER UNIT : mm 3 x 9=27 85.8 NEC 135° C MAX. 31.25 25.05 BGA31 × 31A-1 42.90 135.9 PPE A A' 31.25 33.90 21.90 271.2 315.0 322.6 SECTION A-A' 4.32 (6.35) 7.62 31.25 Applied Package Quantity (pcs) 840-pin Plastic BGA (31×31) (FLIP CHIP TYPE)

BGA310

Abstract: Q62702-G0041
Contextual Info: BGA310 Silicon Bipolar MMIC-Amplifier Preliminary Data l Cascadable 50 Ω-Gain Block l 9 dB typical Gain at 1.0 GHz l 9 dBm typical P at 1.0 GHz l 3 dB-Bandwidth: DC to 2.4 GHz l Plastic Package -1dB Type Marking BGA310 BLs Ordering Code 8-mm taped Q62702-G0041

BGA318

Abstract: Q62702-G0043
Contextual Info: BGA318 Silicon Bipolar MMIC-Amplifier Preliminary Data l Cascadable 50 Ω-Gain Block l 16 dB typical Gain at 1.0 GHz l 12 dBm typical P at 1.0 GHz l 3 dB-Bandwidth: DC to 1.2 GHz l Plastic Package -1dB Type Marking BGA318 BNs Ordering Code 8-mm taped Q62702-G0043

BGA316

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C Y W V U T R P N M L K

Contextual Info: S IE M E N S • f l2 3 S b O S 2 HQ 00^0520 m BGA310 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • Cascadable 50 fl-Gain Block 9 dB typical Gain at 1.0 GHz 9 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidth: DC to 2.4 GHz Plastic Package Type

Contextual Info: SIEMENS BGA310 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 i2-gain block • 9 dB typical gain at 1.0 GHz • 9 dBm typical P.-idB at 1 0 Gl • 3 dB-bandwidth: DC to 2.4 G RF IN o- Circuit Diagram EHA07312 Type Marking Ordering Code

BGA316

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M Y W V U T R P N M L K J H G F E D C B A

marking bms

Contextual Info: SIE M E N S BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • • Cascadable 50 Q-Gain Block 11 dB typical Gain at 1.0 GHz 9 dBm typical P.1dB at 1.0 GHz 3 dB-8andwidth: DC to 2.0 GHz Plastic Package Type Marking Ordering Code 8-mm taped

Contextual Info: SIEMENS BGA318 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 i2-gain block • 16 dB typical gain at 1.0 GHz • 12 dBm typical P.-idB at 1.0 G • 3 dB-bandwidth: DC to 1.2 Gf RF IN o- Circuit Diagram EHA07312 Type Marking Ordering Code

Contextual Info: S IE M E N S BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • • Cascadable 50 £2-Gain Block 11 dB typical Gain at 1.0 GHz 9 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidttv. DC to 2.0 GHz Plastic Package Type Marking BGA312 BMs Ordering Code

SF-BGA316B-B-11

Abstract: BGA316 FR4 substrate with 0.762mm thickness
Contextual Info: D Package Code: BGA316B C 0.635mm See BGA pattern code to the right for actual pattern layout Y .0225" dia. tooling holes X2 non plated (optional) 0.762mm 0.025" dia. pad X Top View (reference only) 24.13mm 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

NF 841

Abstract: BGA312 Q62702-G0042 IS21K 2400 siemens
Contextual Info: SIE M E N S BGA312 Silicon Bipolar MMIC-Amplifier Preliminary Data Cascadable 50 i2-Gain Block 11 dB typical Gain at 1.0 GHz 9 dBm typical at 1.0 GHz 3 dB-Bandwidth: DC to 2.0 GHz Plastic Package T ype M arking BGA312 BMs O rde rin g c o d e 8-mm taped Q62702-G0042

544 code marking amplifier

Abstract: 544 mmic marking 53B marking 544 amplifier SOT143 marking A01 BGA318 Q62702-G0043
Contextual Info: • Û235b05 0 0 ^ 0 5 3 4 SM4 S IE M E N S BGA318 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • • Cascadable 50 £2-Gain Block 16 dB typical Gain at 1.0 GHz 12 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidth: DC to 1.2 GHz Plastic Package

Contextual Info: SIEMENS BGA312 Silicon Bipolar MMIC-Amplifier Preliminary data • Cascadable 50 i2-gain block • 11 dB typical gain at 1.0 GHz • 9 dBm typical P.-idB at 1 0 Gl• 3 dB-bandwidth: DC to 2.0 Gl RF IN o- Circuit Diagram EHA07312 Type Marking Ordering Code

PBGA313

Contextual Info: P-BGA313-3535-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

SF-BGA319A-B-11

Contextual Info: D Package Code: BGA319A C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]

BGA316

Abstract: sot531
Contextual Info: PDF: 1999 Sep 14 Philips Semiconductors Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P N M L K J H G F E D C B A e 1 2

Contextual Info: fi235tj05 0 0 ^ 0 5 3 4 544 S IE M E N S BGA318 Silicon Bipolar MMIC-Amplifier Preliminary Data • • • • • Cascadable 50 il-Gain Block 16 dB typical Gain at 1.0 GHz 12 dBm typical P.1dB at 1.0 GHz 3 dB-Bandwidth: DC to 1.2 GHz Plastic Package Type