TI ASSEMBLY CODE Search Results

DS1620 C2

Abstract: 9814 DS1621 P22328 DS2165Q
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti

cl126

Abstract: cu125 cu257 cl253 CL257 TI CU253 CU126 TI YEAR OF MANUFACTURE cl125 CL257
Contextual Info: TEXAS INSTRUMENTS Initial Notification for the Manufacture of the DBQ 16 - Pin SSOP Package in TI Mexico Assembly/Test Facility (TMX) May 18, 1999 Abstract Texas Instruments Standard Linear and Logic (SLL) is pleased to announce plans to qualify the TI Mexico Assembly/Test Facility (TMX) as a manufacturing site for the 16 - pin DBQ (SSOP) package.

997E-07

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY

DS1232L

Abstract: DS1620 C2 ti 9815
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:

TI date code

Abstract: 271-14
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103

DS2175D1

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA

218E-08

Abstract: ti 9919
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL

TI date code

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA

DN901118AAB

Abstract: c5 99 sot223 dk91
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA

ti 9919

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA

dlp dmd chip

Abstract: chip dmd ti dlp digital micromirror chip dmd dlp mirror chip projector QL2009 micromirror
Contextual Info: QuickLogic and Texas Instruments: FPGAs for Controlling Digital Light Processing Products BACKGROUND Exploded view of an individual micromirror assembly. TI is partnered with several leading video projection companies to produce DLP products. These products are aimed at the professional,

Architecture of TMS320C4X FLOATING POINT PROCESSOR

Abstract: sti 5580 spra493 Architecture of TMS320C4X FLOATING POINT PROCESS FP 801 INSTRUCTION SET of TMS320C4X TMS320 TMS320C30 dsp processor Architecture of TMS320C4X
Contextual Info: Application Report SPRA493 How to Interface C and Assembly Language with the TMS320 Floating Point C Compiler Yves Gagniere and Dirk Langmesser Digital Signal Processing Solutions Abstract The Texas Instruments TI TMS320 digital signal processor (DSP) floating-point ANSI C

LA 76810

Abstract: TMS320C60 SPRU189 TMS320C6X architecture
Contextual Info: TMS320C6x Assembly Language Tools User’s Guide Literature Number: SPRU186B Manufacturing Part Number: D426003-9761 revision B June 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

SFP connector

Abstract: Mq05 A438 EIA-364-52
Contextual Info: ti/ca/Electronics Small Form-Factor Pluggable SFP Connector and Cage Assembly * NOTE 114-13017 Application Specification 10 sep 01 Rev b All numericai values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

SHINKO

Abstract: KMC-166 EN-4065 EN-4088Z 50B40
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of TVSOP and TSSOP in all pin variations to TI Mexico Assembly/Test Facility TMX September 5, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the TVSOP and

TMS320C62xx

Abstract: transistor manual substitution
Contextual Info: TMS320C6x Assembly Language Tools User’s Guide Preliminary Literature Number: SPRU186A Manufacturing Part Number: D426003-9761 revision A January 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

SPRA021

Abstract: TMS320 TMS320C32
Contextual Info: TMS320C3x/C4x Assembly Language Tools User’s Guide Literature Number: SPRU035C Manufacturing Part Number: 2576328-9761 revision C March 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

SPRU186A

Abstract: tmp 8823 TMS3206X
Contextual Info: TMS320C6x Assembly Language Tools User’s Guide Preliminary Literature Number: SPRU186A Manufacturing Part Number: D426003-9761 revision A January 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

TMS320C54x, instruction set

Abstract: MCS-86 SPRU011 SPRU052 SPRU099 SPRU103 SPRU131 TMS320
Contextual Info: TMS320C54x Assembly Language Tools User’s Guide Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest

10KACN

Abstract: LVC112A EN-4088Z SN74LVC112AD
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of SOIC Narrow Body D and SSOP (DL) in all pin variations to TI Mexico Assembly/Test Facility (TMX) December 3, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the SOIC and

la 78141

Abstract: DSP TMS320F240 program code for assembly language dc motor control with LA 78141 data 78141 555 timer rs232 16V8 assembly language program code dc motor control with XDS510PP variable PWM by using dsp TMS320F240
Contextual Info: 1145 - TI signland 26/03/98 19:29 Page 2 What’s in the kit: • ‘C24x evaluation board Product Bulletin • XDS510PP in-circuit emulator • ‘C24x EVM debugger • Fixed-point assembly language tools TMS320C24x Evaluation Module EVM The new TMS320C24x Evaluation

SPRU102f

Abstract: LA 76810 B INTERNAL DATA LA 76810 OR EQUALANT HEX500 LT 542 seven segment display data sheet MCS 4040 transistor manual substitution FREE DOWNLOAD F495 LNK500 lnk500 to equivalent ic
Contextual Info: TMS320C54x Assembly Language Tools User’s Guide Literature Number: SPRU102F October 2002 Printed on Recycled Paper -1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at

SPRU014

Abstract: sti 5202 TMS320C1X TMS320C26BFN TMS32025 6E20 a00a tms320c50 mnemonic description SPRU011 SPRU052
Contextual Info: TMS320C1x/C2x/C2xx/C5x Assembly Language Tools User’s Guide Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest