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    DK031452AB Search Results

    DK031452AB Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    997E-07

    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY


    Original     		dk031452abds21352dm941230agdn041061aae+4dk007198aafdk016058aads2108997e-07 PDF

    25821

    Abstract: dallas date code ds12887 25854
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC


    Original     		ds1621ds1869de940040aacdh833210aab+8ds2181ads5002de004552abddn012259aaldn028766aad25821dallas date code ds1288725854 PDF

    25804

    Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		ds1000z-25ds1000de009456ace150x1+4ds87c520de029195aab650x6525804 PDF