DE940040AAC Search Results

dallas date code ds1230

Abstract: dallas ds1230 25919 DS1230
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:

25821

Abstract: dallas date code ds12887 25854
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC

dallas date code ds1230

Abstract: 25091 e8 sot223 24446
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC

TI date code

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG

DALLAS DS80C320

Abstract: 25863
Contextual Info: RELIABILITY MONITOR DS1232L JAN '00 Monitor DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232 C2-L 150 9948 PROCESS Single Poly, Single Metal DK933191AAJ 8 SOIC ATP Anam, PI 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA

DS-1000

Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%

dallas date code ds1230

Abstract: dallas date code dallas ds1230 code 25807
Contextual Info: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K

997E-07

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY

25804

Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1