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    DH833210AAB Search Results

    DH833210AAB Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    25821

    Abstract: dallas date code ds12887 25854
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC


    Original     		ds1621ds1869de940040aacdh833210aab+8ds2181ads5002de004552abddn012259aaldn028766aad25821dallas date code ds1288725854 PDF

    25814

    Contextual Info: RELIABILITY MONITOR DS1230Y-200 APR '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-Y 0005 720 118511 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25412 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 25413 PHYSICAL DIMENSIONS MIL-STD-883-2016


    Original     		ds1230y-200ds1230mil-std-883-2003mil-std-883-2016+560c/90ds1230ab-200ds5000tds500025814 PDF

    JSTD-020

    Abstract: DM035 26438
    Contextual Info: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		ds1232ldk038265aacds1232j-std-020+785c/8514x20xds80ch11dn034351aajstd-020dm03526438 PDF

    dallas date code ds1230

    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00


    Original     		dh046190aaids1620ds1869dh833210aab+6ds5002dn028766aaddn030363aaaj-std-020ds1302dallas date code ds1230 PDF

    dallas date code ds1230

    Abstract: dallas ds1230 25919 DS1230
    Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:


    Original     		ds1621de940040aacds5002ds87c520+9dm925587aafdk935356aabdk933191aajde952427aadde014522adbdallas date code ds1230dallas ds123025919ds1230 PDF

    997E-07

    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS21352 A4 DK031452AB LQFP STRESS: HIGH VOLTAGE LIFE MONITOR DATE ASSEMBLY


    Original     		dk031452abds21352dm941230agdn041061aae+4dk007198aafdk016058aads2108997e-07 PDF

    25804

    Contextual Info: RELIABILITY MONITOR DS1000Z-25 OCT '00 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 150x1.4 OSEP 0033 PROCESS Single Poly, Single Metal DE009456ACE 8 SOIC 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1


    Original     		ds1000z-25ds1000de009456ace150x1+4ds87c520de029195aab650x6525804 PDF

    TI date code

    Abstract: 271-14
    Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Double Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS21352 A4 DN033071AAA LQFP STRESS: HIGH VOLTAGE LIFE MAR '01 26769 0103


    Original     		ds21352dn033071aaads2108dn041061aae+2ti date code271-14 PDF