SP12 PACKAGE TYPE 6 Search Results

transistor sp 772

Contextual Info: Power Transistor RT232 Product Features Application • Frequency Range = 50MHz ~ 6GHz • High Output Power P1dB = 33dBm Typ. @2.5GHz P3dB = 36dBm(Typ.)@2.5GHz • High Efficiency • High In/Out Impedance • High Power Gain G1dB = 19dB(Typ.)@900MHz G1dB = 15dB(Typ.)@2.14GHz

Contextual Info: Power Transistor RT232 Product Features Application • Frequency Range = 50MHz ~ 6GHz • High Output Power P1dB = 33dBm Typ. @2.5GHz P3dB = 36dBm(Typ.)@2.5GHz • High Efficiency • High In/Out Impedance • High Power Gain G1dB = 19dB(Typ.)@900MHz G1dB = 15dB(Typ.)@2.14GHz

Contextual Info: Weller Marksman Mini Iron 12 Watt Product Details Catalog No. SP12 UPC Code 037103479716 Type Non-temperature Controlled Wattage 12 W Temperature 750° F Range Cord Length 6 ft. Components MT70 Supplied Packaging Peg Hook/Retail Packaging Tech. Spec. Solder_Safety_Warnings.pdf

6AM12

Abstract: SP12TA 2sk970 SP12 PACKAGE TYPE 6 2SK971 4AK16 2SK972 2SK973 2SK97-1 4AK15
Contextual Info: 14 HITACHI 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

SP24L

Abstract: SP12 PACKAGE TYPE 6
Contextual Info: RWDUIT Grounding Connectors Bronze Service Post Connectors Type SP1 MEW / Male-One Cable • For grounding one conductor to steel structures, fence posts or transformers • For tapping from bus bar • Made from hard drawn copper rod • UL LISTED per 467 for

transistor z3

Abstract: TRANSISTOR Z4
Contextual Info: Power Transistor RT230PD Product Features Application • 50 ~ 4000 MHz • 18dB Gain@900MHz • 34.5dBm P1dB@900MHz • 47dBm Output IP3 • GaAs HFET • CDMA,W-CDMA Medium Power Amplifier • High Linearity Drive Amplifier • ISM • MMDS • Wi-Fi, Wi-max

2SK1778

Abstract: 2SK971 2SK970 2SK972 2SK973 2SK975 4AK15 4AK16 4AK17 4AK18
Contextual Info: 14 HITACHI 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

2SK1275

Abstract: 4AM14 6am12 2SK970 2SK971 2SK972 2SK973 2SK975 4AK15 4AK16
Contextual Info: 14 HITACHI 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

2SK1778

Abstract: 2sk1299 4AM12 transistor 2sk1304 2sj177 4AK22 2SK1919 2SK971 transistor 2sk 2SK972
Contextual Info: HITACHI 14 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

HITACHI Power MOSFET Arrays

Abstract: 2sk1299 2SK975 2sk1306 2SK1919 2SK970 2SK971 2SK972 2SK973 4AK15
Contextual Info: HITACHI 14 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

2SK1254

Abstract: 2sj177 2SK970 2SK971 2SK972 2SK973 2SK975 4AK15 4AK16 4AK17
Contextual Info: HITACHI 14 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully m oulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching

2SC 8550

Abstract: 6020v4 6030v4 HITACHI 08122B 2SC 8050 HITACHI 08123B transistor h945 H945 TRANSISTOR c 6030v4 2sk3545
Contextual Info: Status List HITACHI TRANSISTOR/GaAsIC Vol.16-4 2002.11 Topic - Hitachi High Frequency Bipolar Transistors . 2 Index . 3, 4

transistor C4

Contextual Info: Power Transistor RT230PD Product Features Application • 50 ~ 4000 MHz • 18dB Gain@900MHz • 34.5dBm P1dB@900MHz • 47dBm Output IP3 • GaAs HFET • CDMA,W-CDMA Medium Power Amplifier • High Linearity Drive Amplifier • ISM • MMDS • Wi-Fi, Wi-Max

Contextual Info: MMIC AP2301 `Product Features Application • Small size • SMD Type Package • NO matching circuit needed • High efficiency • Dual supply voltage • Higher linearity • 12 pin Air cavity package • Higher productivity • Lower manufacturing cost

MSM63V89C

Abstract: MSM6595A MSM6596A MSM6597A MSM6685 MSM7708-02 TQFP64-P-1010-0 ST12 encoder ST12 encoder decoder
Contextual Info: E2U0044-16-X2 ¡ Semiconductor MSM7708-02 ¡ Semiconductor This version: Jan. 1998 MSM7708-02 Previous version: Nov. 1996 Serial Register Interface ADPCM CODEC for Telephone Recording GENERAL DESCRIPTION The MSM7708-02 is a CMOS IC developed for applying to PHS Personal Handyphone System .

MPC8260

Abstract: MPC860 SPEC95 SP10
Contextual Info: Advance Information MPC8260EC/D Rev. 0.7, 11/2001 MPC8260 HiP3 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the HiP3 version of the PowerQUICC II

TQFP80 package oki

Abstract: TQFP64-P-1010-0 MSM63V89C MSM6595A MSM6596A MSM6597A MSM6685 MSM7708-02 MSM7708-02TS-K K2424
Contextual Info: E2U0044-16-X2 O K I Semiconductor MSM7708-02 _ Serial Register Interface ADPCM CODEC for Telephone Recording GEN ERAL DESCRIPTION The MSM7708-02 is a CMOS IC developed for applying to PHS Personal H andyphone System . This device provides a CODEC function which performs transcoding between the voice band

MPC8255

Abstract: MPC8260 MPC860 SPEC95
Contextual Info: Advance Information MPC8255EC/D Rev. 0.1, 2/2002 MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II communications processor.

Contextual Info: Advance Information MPC8255EC/D Rev. 0, 11/2001 MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II communications processor.

Contextual Info: Advance Information MPC8260AEC/D Rev. 0.5 3/2002 MPC826xA HiP4 Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for HiP4-enhanced derivatives of the

AD291

Abstract: AD161 AD151
Contextual Info: Advance Information MPC826xAEC/D Rev. 0.3, 11/2001 MPC826xA HiP4 Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for HiP4-enhanced derivatives of the

MPC8255

Abstract: MPC8260 MPC860 SPEC95
Contextual Info: Freescale Semiconductor, Inc. Advance Information MPC8255EC/D Rev. 0.4, 5/2002 Freescale Semiconductor, Inc. MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II

AG102

Abstract: ah222 AD282 AD252 aj122 af202 AF172 AF102 AH142 ad292
Contextual Info: Freescale Semiconductor Document Number: MPC8260EC Rev. 2, 05/2010 Technical Data MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC

90c100

Abstract: CLCC84 93C100 90C101 80C51 93C101 P90C100ABA P90C100ABB P90C100AFA P90C100AFB
Contextual Info: Philips Semiconductors 711Qß5b DOSHbGT bT2 M P H IN 16/32-bit microcontrollers — Preliminary specification P9xC1xx Family bOE » PHILIPS INTERNATIONAL FOR DETAILED INFORMATION SEE THE LATEST ISSUE OF HANDBOOK IC21 OR DATA SHEET 1. FEATURES 2. GENERAL DESCRIPTION