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    SP12 PACKAGE TYPE 6 Search Results

    SP12 PACKAGE TYPE 6 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    5474/BCA
    Rochester Electronics LLC 5474 - Flip-Flop, D-Type, Dual - Dual marked (M38510/00205BCA) PDF Buy
    54L74/BCA
    Rochester Electronics LLC 54L74 - Flip-Flop, D-Type, Dual - Dual marked (M38510/02105BCA) PDF Buy
    54F374/BRA
    Rochester Electronics LLC 54F374 - Octal D-Type Flip-Flop with TRI-STATE Outputs PDF Buy
    54175/BEA
    Rochester Electronics LLC 54175 - Flip-Flop, D-Type, 4-Bit - Dual marked (M38510/01702BEA) PDF Buy

    SP12 PACKAGE TYPE 6 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Power Transistor RT232 Product Features Application • Frequency Range = 50MHz ~ 6GHz • High Output Power P1dB = 33dBm Typ. @2.5GHz P3dB = 36dBm(Typ.)@2.5GHz • High Efficiency • High In/Out Impedance • High Power Gain G1dB = 19dB(Typ.)@900MHz G1dB = 15dB(Typ.)@2.14GHz


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    RT232 50MHz 33dBm 36dBm 900MHz 14GHz IMT-2000 SP-12 RT232 IMT-2000, PDF

    Contextual Info: Weller Marksman Mini Iron 12 Watt Product Details Catalog No. SP12 UPC Code 037103479716 Type Non-temperature Controlled Wattage 12 W Temperature 750° F Range Cord Length 6 ft. Components MT70 Supplied Packaging Peg Hook/Retail Packaging Tech. Spec. Solder_Safety_Warnings.pdf


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    /178mm PDF

    2SK1778

    Abstract: 2SK971 2SK970 2SK972 2SK973 2SK975 4AK15 4AK16 4AK17 4AK18
    Contextual Info: 14 HITACHI 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching


    OCR Scan
    10-pin 12-pin 4AK17 2SK972 4AK15 2SK971 2SK1665 2SJ215 2SJ217 2SK1303 2SK1778 2SK971 2SK970 2SK972 2SK973 2SK975 4AK16 4AK17 4AK18 PDF

    2SK1275

    Abstract: 4AM14 6am12 2SK970 2SK971 2SK972 2SK973 2SK975 4AK15 4AK16
    Contextual Info: 14 HITACHI 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching


    OCR Scan
    10-pin 12-pin 4AK17 2SK972 4AK15 2SK971 2SK1202 2SK1203 2SK1204 2SK696 2SK1275 4AM14 6am12 2SK970 2SK971 2SK972 2SK973 2SK975 4AK16 PDF

    2SK1778

    Abstract: 2sk1299 4AM12 transistor 2sk1304 2sj177 4AK22 2SK1919 2SK971 transistor 2sk 2SK972
    Contextual Info: HITACHI 14 1.6 Power MOSFET Arrays For the ultimate in high density packaging, Hitachi produces both fully moulded 10-pin SIL array containing 4 logic level DUI-Series MOSFETs and in condensed 12-pin SIL array containing 6 logic level Dm-Series MOSFETs. These are very suitable for full bridge switching


    OCR Scan
    10-pin 12-pin 4AK17 2SK972 4AK15 2SK971 2SK1665 2SJ215 2SJ217 2SK1303 2SK1778 2sk1299 4AM12 transistor 2sk1304 2sj177 4AK22 2SK1919 2SK971 transistor 2sk 2SK972 PDF

    Contextual Info: MMIC AP2301 `Product Features Application • Small size • SMD Type Package • NO matching circuit needed • High efficiency • Dual supply voltage • Higher linearity • 12 pin Air cavity package • Higher productivity • Lower manufacturing cost


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    AP2301 2000MHz -63dBc 37dBmV -60dBc 30ent PDF

    TLE4941-1C

    Abstract: piezo air pressure sensor IC hall sensor smd 80 L TLE4990 Programming Guide shock sensor airbag siemens 4 Pin SMD Hall sensors KP110 P-SOT-23 TLE4942-1C tle4941c
    Contextual Info: 2003191_Selection_Guide_16 21.07.2004 17:50 Uhr Seite 3 Pressure Sensor ICs – Hall ICs – Temperature Sensors Converting ENVIRONMENT to Data Complete AUTOMOTIVE Sensor Solutions w w w. i n f i n e o n . c o m / s e n s o r s Never stop thinking. 2003191_Selection_Guide_16


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    B138-H8195-G1-X-7600 TLE4941-1C piezo air pressure sensor IC hall sensor smd 80 L TLE4990 Programming Guide shock sensor airbag siemens 4 Pin SMD Hall sensors KP110 P-SOT-23 TLE4942-1C tle4941c PDF

    MSM63V89C

    Abstract: MSM6595A MSM6596A MSM6597A MSM6685 MSM7708-02 TQFP64-P-1010-0 ST12 encoder ST12 encoder decoder
    Contextual Info: E2U0044-16-X2 ¡ Semiconductor MSM7708-02 ¡ Semiconductor This version: Jan. 1998 MSM7708-02 Previous version: Nov. 1996 Serial Register Interface ADPCM CODEC for Telephone Recording GENERAL DESCRIPTION The MSM7708-02 is a CMOS IC developed for applying to PHS Personal Handyphone System .


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    E2U0044-16-X2 MSM7708-02 MSM7708-02 MSM770802 MSM7708 TQFP64-P-1010-0 MSM63V89C MSM6595A MSM6596A MSM6597A MSM6685 ST12 encoder ST12 encoder decoder PDF

    MPC8260

    Abstract: MPC860 SPEC95 SP10
    Contextual Info: Advance Information MPC8260EC/D Rev. 0.7, 11/2001 MPC8260 HiP3 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the HiP3 version of the PowerQUICC II


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    MPC8260EC/D MPC8260 MPC8260 MPC860 SPEC95 SP10 PDF

    MPC8255

    Abstract: MPC8260 MPC860 SPEC95
    Contextual Info: Advance Information MPC8255EC/D Rev. 0.1, 2/2002 MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II communications processor.


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    MPC8255EC/D MPC8255 MPC8255 MPC8260 MPC860 SPEC95 PDF

    Contextual Info: Advance Information MPC8255EC/D Rev. 0, 11/2001 MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II communications processor.


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    MPC8255EC/D MPC8255 MPC8255EC/D PDF

    Contextual Info: Advance Information MPC8260AEC/D Rev. 0.5 3/2002 MPC826xA HiP4 Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for HiP4-enhanced derivatives of the


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    MPC8260AEC/D MPC826xA MPC8260 MPC826xA) MPC8260AEC/D PDF

    MPC8255

    Abstract: MPC8260 MPC860 SPEC95
    Contextual Info: Freescale Semiconductor, Inc. Advance Information MPC8255EC/D Rev. 0.4, 5/2002 Freescale Semiconductor, Inc. MPC8255 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8255 PowerQUICC II


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    MPC8255EC/D MPC8255 MPC8255 MPC8260 MPC860 SPEC95 PDF

    ah222

    Abstract: AE92 AJ262 AJ222 aj122 IC AD282 transistor AC252 sp2310 MPC8260 MPC8280
    Contextual Info: Freescale Semiconductor, Inc. Technical Data MPC8260EC/D Rev. 1.2 8/2003 Freescale Semiconductor, Inc. MPC8260 HiP3 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the .29 µm (HiP3) devices of the


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    MPC8260EC/D MPC8260 MPC8260 MPC8255. MPC8255 MPC8260. MPC82EC/D ah222 AE92 AJ262 AJ222 aj122 IC AD282 transistor AC252 sp2310 MPC8280 PDF

    MPC8250

    Abstract: MPC8260 MPC860 SPEC95
    Contextual Info: Advance Information MPC8250EC/D Rev. 0.1, 2/2002 MPC8250 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II communications processor.


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    MPC8250EC/D MPC8250 MPC8250 MPC8260 MPC860 SPEC95 PDF

    Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8260AEC Rev. 2.0, 06/2009 MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC


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    MPC8260AEC MPC8260A MPC8260 MPC8260, MPC8255, MPC8264, MPC8265, MPC8266. MPC826xA. PDF

    AD161

    Abstract: lcd ae162 ae132 ah222 MPC8255 MPC8260 MPC8260A MPC8260AEC MPC8264 MPC8265
    Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8260AEC Rev. 2.0, 06/2009 MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC


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    MPC8260AEC MPC8260A MPC8260 MPC8260, MPC8255, MPC8264, MPC8265, MPC8266. MPC826xA. AD161 lcd ae162 ae132 ah222 MPC8255 MPC8260A MPC8260AEC MPC8264 MPC8265 PDF

    Contextual Info: Advance Information MPC8250EC/D Rev. 0, 11/2001 MPC8250 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II communications processor.


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    MPC8250EC/D MPC8250 MPC8250EC/D PDF

    MPC8250

    Abstract: MPC8260 MPC860 SPEC95
    Contextual Info: Advance Information MPC8250EC/D Rev. 0.4 5/2002 MPC8250 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II communications processor.


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    MPC8250EC/D MPC8250 MPC8250 MPC8260 MPC860 SPEC95 PDF

    XPC8260ZU166a

    Abstract: XPC8260zu200 XPC8260ZU133A xpc8260zu200a XPC8260CZU133A motorola g29 XPC8260AZUKHBA XPC8260CZUIHBC XPC8260CZUIFBC XPC8260ZUHFB
    Contextual Info: Advance Information MPC826xAEC/D Rev. 0.4 2/2002 MPC826xA HiP4 Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for HiP4-enhanced derivatives of the


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    MPC826xAEC/D MPC826xA MPC8260 MPC826xA) XPC8260ZUIFBB3 XPC8260ZUIFBC XPC8260ZUIGAB3 XPC8260ZUIHBC 200MHz 133MHz XPC8260ZU166a XPC8260zu200 XPC8260ZU133A xpc8260zu200a XPC8260CZU133A motorola g29 XPC8260AZUKHBA XPC8260CZUIHBC XPC8260CZUIFBC XPC8260ZUHFB PDF

    PC8265A

    Abstract: CS10 CS11 PC860 SPEC95 5336B
    Contextual Info: Features • PC603e Microprocessor Embedded PowerPC Core at 133 - 300 MHz • • • • • • • – 280 MIPS at 200 MHz (Dhrystone 2.1) – 520 MIPS at 300 MHz (Dhrystone 2.1) – High-performance, Superscalar Microprocessor – Disable CPU Mode


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    PC603eTM 16-Kbyte 64-bit 32-bit 5336B PC8265A CS10 CS11 PC860 SPEC95 PDF

    Contextual Info: Features • High Performance, Low Power AVR 8-bit Microcontroller • Advanced RISC Architecture • • • • • • • – 123 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation


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    8K/16K PDF

    PC603E

    Abstract: atmel utopia 11 PC8265A PC860 SPEC95 TBGA480
    Contextual Info: Features • PC603e Microprocessor Embedded PowerPC Core at 133 - 300 MHz • • • • • • • – 280 MIPS at 200 MHz (Dhrystone 2.1) – 520 MIPS at 300 MHz (Dhrystone 2.1) – High-performance, Superscalar Microprocessor – Disable CPU Mode


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    PC603e® 16-Kbyte 64-bit 32-bit 5336E PC603E atmel utopia 11 PC8265A PC860 SPEC95 TBGA480 PDF

    AF121

    Abstract: AC261
    Contextual Info: Freescale Semiconductor Document Number: MPC8250EC Rev. 2, 07/2009 MPC8250 Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II


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    MPC8250EC MPC8250 MPC8250 AF121 AC261 PDF