SOT431 Search Results

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2

Contextual Info: Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ Lp bp pin 1 index L detail X

sot431

Abstract: SOT431-1
Contextual Info: PDF: 2000 Feb 24 Philips Semiconductors Package outline HSQFP208: plastic, heatsink shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ

b0345

Abstract: B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N1711B 2SC1419 2SC1419 2Nl085 2S0330 2S0331 BSS1S NSOS179 ~~g~~~oo 25 30 SK32SS 2S011S0Y 92GU45A 2S0288 2S0289 KT9340 KT934V B0827-10 ~~~~~~7 35 40 SML5512 SML5902 SML5907 SML5912 ST440 ST450 2S013

but46a

Abstract: PEC730
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 20 25 -30 2SC251SM 2SC2535 2SC2535 2SC3570 STI401 STI413 IR413 BU129 BUT11 SPT3439 BUT11F BUT11F 2SC2518L MJ425 MJ425 MJ425 BUT46 BU120 ~~6~~1SK 35 40 2S09S7 PMS5K425 SOT1015 BUS11A BUT11A BUW11AF BUX46A

B0813

Abstract: PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 NA31KY NA31MH NA31 MY SK3248 NA31KI NA31MI NA31KJ NA31MJ ~~~~g: 25 30 2NS204 S15-28 SMl5501 SMl550S SMl5511 SMl5901 SMl590S SMl5911 ~~~j~~ 35 40 80Y10 80Y10 PT9787 PT9787A 2N4431 2S022S 2S0226 SOT4301

b0349

Abstract: B0817 1/transistor b0349 to-53 2N3577 blx10 diode 300U 2S078 B0379 b0371
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 SOT5512 SOT5512 SOT5912 B0377-25 2S01083 2S0975 B0321 B0321 ~g~~~ 25 30 2S01779 2N3138 2N3140 2N3142 2N3144 BOY11 BOY11 2S012A ~~~1~8U 35 40 BSS15 2N5320 NS06178 2N6179 S2N4150 S2N4150-1 BOB29-10 BOB29-6

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors