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Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2
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Contextual Info: Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ Lp bp pin 1 index L detail X
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sot431
Abstract: SOT431-1
Contextual Info: PDF: 2000 Feb 24 Philips Semiconductors Package outline HSQFP208: plastic, heatsink shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ
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CE51484
Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Contextual Info: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.
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cg/ce46cg/ce51s-19176asic-tb-20033-9/95+10ce51484micron 100 ball bgabga256bga 256 package power dissipationcg51114bga352bga576ce51364cg51284bga-576
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NAD-32
Abstract: R5000 mips TLO64 TX49 mips r5000 thyristor handbook C-16 Toshiba Power and Industrial Semiconductors RT024 TX49Core
Contextual Info: 64-Bit TX System RISC TX49/H2 Core Architecture JAN. 2002 R4000/R4400/R5000 are a trademark of MIPS Technologies, Inc. The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our
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64-bittx49/h2r4000/r4400/r500032-bit+14pqfp-160pqfp-120pga-179hsqfp-208nad-32r5000 mipstlo64tx49mips r5000thyristor handbookc-16toshiba power and industrial semiconductorsrt024tx49core
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86tqfp80ot357tqfp64+12ot543tfbga64jedec tray dimensionshssop20ic packagestray tssop20 14 x 35so16 package traysbga304hlqfp100msd504lqfp64 reel sizeplcc84 package
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