BGA576 Search Results

Contextual Info: T-BGA576-4040-1.27B6

S 576 B

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC To Top / Package Lineup / Package Index BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ

Contextual Info: P—BGA576—4040—1.27A6 Unit: m July 2005

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

BGA-576

Abstract: BGA576 576-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)

BGA576

Abstract: NM6404 BGA-576 risc NM6403 60Mbyte
Contextual Info: Press-Release Contact person: Ekaterina Lazutkina E-mail: sales@module.ru Ph: +7 495 152-9698 Fax: +7 495 152-4661 http://www.module.ru FOR IMMEDIATE RELEASE NeuroMatrix NM6404 RISC/DSP Processor Moscow, Russia, May 22, 2006 - Research Center Module RC Module announces

CE51484

Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
Contextual Info: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.

TR6878

Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
Contextual Info: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC234-1004-023P YAMAICHI ic234 IC51-0484-806 648-0482211 QP1-120050-272 IC51-1004-809 IC234-1444-053P
Contextual Info: FUJITSU SEMICONDUCTOR DATA SHEET Socket 1. Socket .2 2 List of Test Sockets .3

BGA576

Abstract: BGA-576 9698 NM6403 VLIW architecture COLLISION AVOIDANCE
Contextual Info: Press Release Editorial contact person: Ms. Elena Yakovleva E-mail: eyakovl@module.ru Ph: +7 095 152-9698 Fax: +7 095 152-4661 Web: http://www.module.ru FOR IMMEDIATE RELEASE Digital Signal Memory SoC with Industry’s Highest Performance ADCs/DACs. Moscow, Russia, October 21, 2002 – Research Center “Module”, a leading developer of

4040

Abstract: P-BGA576-4040-1
Contextual Info: U n it m P—BGA576—4040—1.27A6 ►— [A] mm 0. 635 1, 585 ^-0 -0 O O O O O O O O O O 0-01 o o o o o o o o o o o o o o f ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo ooooooooooooooo oooooooooooooo ooooooooooooooo oooooooooooooo

wavecom Q24 plus

Abstract: wavecom q24 classic Q2438F Q24 plus sim 300 processor gsm modem Wavecom Q24 WMP150 M1306B wavecom WMP100 WMP100
Contextual Info: Designed by Franklin Partners Groupe Mediagérance. Wavecom S.A. may, at any time and without notice, make changes or improvements to the products and services offered and/or cease producing or commercializing them. 97414 WIRELESS CPUs v3.qxd 4/09/06 9:31