SOJ PACKAGE MSL Search Results
SOJ PACKAGE MSL Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 54ACT825/QKA | Rochester Electronics LLC | 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP |
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| TPH1R306PL | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQH | Toshiba Electronic Devices & Storage Corporation | MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPHR8504PL | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) | Datasheet | ||
| TPH9R00CQ5 | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) | Datasheet |
SOJ PACKAGE MSL Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
EME-7351
Abstract: Compound sumitomo epoxy
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400mil32leademe7351cy7c109-vc+5 | |
SOJ package MSL
Abstract: 8361H Cypress soj 36 140C JESD22
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400-mil8361hjesd22-a11230c/60+6 | |
cel 9200
Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
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85c/85cy7c199-vccel 9200hitachi mold cel+6 | |
QMI509
Abstract: epoxy qualification CY7C199 JESD22 cda 199 Dexter SOJ package MSL
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28-leadcy7c199cy6264-snc619907866m+7 | |
CEL9200
Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
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cy7c1021vcy7c1019vcy7c1021v/cy7c1019v7c1321d/7c1319d+6 | |
Hitachi 32k static RAM
Abstract: CY7C192 CY7C197 CY7C199 top markings on hitachi 256k Static RAM SOJ package MSL
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cy7c191/192cy7c194/195/196cy7c197cy7c199+9 | |
7C1341A
Abstract: CY7C1041V33 CY7C1049V33 CY7C1049V33-VC
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cy7c1049v33cy7c1041v33cy7c1049v/cy7c1041v7c1349d/7c1341d+5 | |
CY62256LL-PC
Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
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palce22v10-jcflash-fl22dcy62256ll-pcvic068a-gc+8 | |
SOJ package MSL
Abstract: 7C109A CY7C109 JESD22 R42HD R42HD FAB4
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r42hdcy7c109/cy7c1009cy7c1097c109h+6 | |
CY7C1049
Abstract: CY7C1041 JESD22 9200 hitachi 98248
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r42hdcy7c1049cy7c10417c1549a+5 | |
land pattern for TSOP 2 86 PIN
Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
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land pattern for tsop 2 86 pinland pattern for tsop 2 54 pinland pattern for tsop 56 pinoki naming+6 | |
CY7C1041BV33
Abstract: CY7C1046BV33 CY7C1049BV33
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r52d-3cy7c1041bv33cy7c1046bv33cy7c1049bv33+4 | |
SOJ 44 PCB land
Abstract: SOJ package MSL QFP 128 bonding tsop package MSL 48 pin ic qfj HQFP208 R400 S115 ED-7401-2 TSOP II 54 Package
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soj 44 pcb landsoj package mslqfp 128 bondingtsop package msl+6 | |
ba732
Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
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ba732cobchip on boarded-7303qfp 128 bonding | |
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QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
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32-lead6600hr28-44lead635mils+12 | |
mil-std 883d method 1010Contextual Info: QUALITY & RELIABILITY CYPRESS 2001 Q1 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination |
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mil-std 883d method 1010 | |
tsop 928Contextual Info: QUALITY & RELIABILITY CYPRESS 2001 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination |
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tsop 928 | |
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Contextual Info: QUALITY & RELIABILITY CYPRESS 2000 Q4 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination |
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cmos tsmc 0.18
Abstract: reliability data analysis report failure test report
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cmos tsmc 0.18reliability data analysis reportfailure test report | |
cmos tsmc 0.18Contextual Info: CYPRESS QUALITY & RELIABILITY 2000 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination |
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cmos tsmc 0.18 | |
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Contextual Info: Mounting Conditions Date: 2013.10.03 The following information is used for the reflow conditions of Lyontek Products, and please follows the package type to choose the suitable conditions. All the conditions are compliant with JEDEC J-STD-020 and IPC-1066. |
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j-std-020ipc-1066 | |
tqfp 10x10 tray
Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
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tqfp 10x10 traytqfp 14x14 trayqfn traytube 4-400+6 | |
SMD IC 2025 bl
Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
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j2t0011-38-60copyright1998okielectricindustrycoj2t0002-38-60bga-388+14 | |
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Contextual Info: MI TS UB IS HI L S I s MH2 M3 6 C J - 8 , —1 O 7 5 4 9 7 4 7 2 - B I T a 0 9 7 l5 2 - W 0 n D B Y 3 6 -B IT D Y N A M lC RAM DESCRIPTION The M1I2M36CJ is 2097152 vordX36bit dynamic RAM. This consists ehight industry standard 1MX1 dy namic RAXis in SOJ and sixteen industry standard |
OCR Scan |
mh2m36cm1i2m36cjvordx36bitmii2m36cj-8+1 | |