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    SOJ PACKAGE MSL Search Results

    SOJ PACKAGE MSL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet

    SOJ PACKAGE MSL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EME-7351

    Abstract: Compound sumitomo epoxy
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99112 VERSION 1.0 April, 2000 32 Lead 400mil SOJ Package Level 2 Omedata CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor Package: 32 Lead (400mil) SOJ


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    400mil32leademe7351cy7c109-vc+5cy7c109-vib85c/60eme-7351compoundsumitomo epoxy PDF

    SOJ package MSL

    Abstract: 8361H Cypress soj 36 140C JESD22
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 98148 VERSION 1.0 July, 1998 36 Ld, 400-mil SOJ Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 36 Ld, 400-mil SOJ QTP# 98148, V. 1.0 Page 2 of 4 July, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


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    400-mil8361hjesd22-a11230c/60+6cy7c1049-vcsoj package mslcypresssoj 36140cjesd22 PDF

    cel 9200

    Abstract: hitachi mold cel CY7C199-VC cda 199 Hitachi CEL 9200 9200 hitachi 8361H JESD22
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000405 VERSION 1.1 July, 2000 SOJ 28 Leads Hitachi Cel 9200 Molding Compound Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069


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    85c/85cy7c199-vccel 9200hitachi mold cel+6cda 199hitachi cel92009200 hitachi8361hjesd22 PDF

    QMI509

    Abstract: epoxy qualification CY7C199 JESD22 cda 199 Dexter SOJ package MSL
    Contextual Info: Cypress Semiconductor Snap Cure Epoxy Qualification Report QTP# 002602 VERSION 1.1 January, 2001 28-lead SOJ and Narrow SOIC Package Level 3 Cypress Philippines CSPI-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


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    28-leadcy7c199cy6264-snc619907866m+7619907866m1qmi509epoxy qualificationjesd22cda 199dextersoj package msl PDF

    CEL9200

    Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 97416 VERSION 1.0 June, 1998 1 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1021V 64K x 16 Static RAM CY7C1019V 128K x 8 Static RAM Cypress Semiconductor, Inc. 1 Meg SRAM - R42D Technology - Fab 4 Device: CY7C1021V/CY7C1019V 7C1321D/7C1319D


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    cy7c1021vcy7c1019vcy7c1021v/cy7c1019v7c1321d/7c1319d+644-pincy7c102132-pincy7c1019cel9200sumitomo silver epoxy PDF

    Hitachi 32k static RAM

    Abstract: CY7C192 CY7C197 CY7C199 top markings on hitachi 256k Static RAM SOJ package MSL
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 99011 VERSION 1.0 April, 1999 256K Static RAM, R28 Technology, Fab 2 CY7C191/192 64K x 4 Static RAM With Separate I/O CY7C194/195/196 64K x 4 Static RAM CY7C197 256K x 1 Static RAM CY7C199 32K x 9 Static RAM


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    cy7c191/192cy7c194/195/196cy7c197cy7c199+9cy7c1927c192h28-pin300-milcy7c0251-achitachi 32k static ramtop markings on hitachi256k static ramsoj package msl PDF

    7C1341A

    Abstract: CY7C1041V33 CY7C1049V33 CY7C1049V33-VC
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 97396 VERSION 1.2 June, 1999 4 Meg SRAM, R42D Technology, Fab 4 Qualification CY7C1049V33 512K x 8 Static RAM CY7C1041V33 256K x 16 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Marc Hartranft


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    cy7c1049v33cy7c1041v33cy7c1049v/cy7c1041v7c1349d/7c1341d+5cy7c1049v33/cy7c1041v3336/44-pin0ccy7c1049v33-vc30c/607c1341a PDF

    CY62256LL-PC

    Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
    Contextual Info: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2


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    palce22v10-jcflash-fl22dcy62256ll-pcvic068a-gc+8vic64-ncvic64-umbpalce22v10-jipalc16l8qpld vmea113cy7b923jesd22-a113 PDF

    SOJ package MSL

    Abstract: 7C109A CY7C109 JESD22 R42HD R42HD FAB4
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 98085 VERSION 1.0 June, 1998 1 Meg SRAM, R42HD Technology, Hot Aluminum CY7C109/CY7C1009 128K x 8 SRAM 5V Operation Cypress Semiconductor, Inc. 1 Meg SRAM - R42HD Technology, Hot Al - Fab 4 Device: CY7C109 (7C109H)


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    r42hdcy7c109/cy7c1009cy7c1097c109h+632-pin400-milsoj package msl7c109ajesd22r42hd fab4 PDF

    CY7C1049

    Abstract: CY7C1041 JESD22 9200 hitachi 98248
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 98248 VERSION 1.0 June, 1998 4 Meg SRAM, R42HD Technology 5V operation CY7C1049 512K x 8 Static RAM CY7C1041 256K x 16 Static RAM Cypress Semiconductor, Inc. 4 Meg SRAM - R42HD Technology - Fab 4 Device: CY7C1049 (7C1549A)


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    r42hdcy7c1049cy7c10417c1549a+536-pin400-miljesd229200 hitachi98248 PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


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    land pattern for tsop 2 86 pinland pattern for tsop 2 54 pinland pattern for tsop 56 pinoki naming+6qfp 64 0.4 mm pitch land patterntsop 54 land patternic packagestsop 66 pin package thermal resistancesoj 44 pcb landed730 PDF

    CY7C1041BV33

    Abstract: CY7C1046BV33 CY7C1049BV33
    Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 000305 VERSION 1.0 March, 2000 4 Meg Asynchronous SRAM R52D-3 Technology at Fab 4 CY7C1041BV33 256K x 16 Static RAM CY7C1046BV33 1M x 4 Static RAM CY7C1049BV33 512K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


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    r52d-3cy7c1041bv33cy7c1046bv33cy7c1049bv33+4cy7c1041bv33/cy7c1046bv33/cy7c1049bv33r52-3dcy7c1049b-----------------------stresscy7c1329-ac PDF

    SOJ 44 PCB land

    Abstract: SOJ package MSL QFP 128 bonding tsop package MSL 48 pin ic qfj HQFP208 R400 S115 ED-7401-2 TSOP II 54 Package
    Contextual Info: 1. パッケージの分類 1. パッケージの分類 1 1-1. パッケージの動向 - 2 1-2. パッケージの分類 - 5 1-3. パッケージの種類と特徴 - 7


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    soj 44 pcb landsoj package mslqfp 128 bondingtsop package msl+648 pin ic qfjhqfp208r400s115ed-7401-2tsop ii 54 package PDF

    ba732

    Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
    Contextual Info: 作成: 前回作成: 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 1 章 パッケージの分類 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 1 章部分とな


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    ba732cobchip on boarded-7303qfp 128 bonding PDF

    QMI 509 epoxy

    Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer


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    32-lead6600hr28-44lead635mils+1201bll-si610221877mcy62128bll-siqmi 509 epoxysumitomo eme-6600hrsoj package mslqmi 509 epoxy datasheetcy7c63001a-scjesd22eme6600hrmold compoundeme 6600hr PDF

    mil-std 883d method 1010

    Contextual Info: QUALITY & RELIABILITY CYPRESS 2001 Q1 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    mil-std 883d method 1010 PDF

    tsop 928

    Contextual Info: QUALITY & RELIABILITY CYPRESS 2001 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    tsop 928 PDF

    Contextual Info: QUALITY & RELIABILITY CYPRESS 2000 Q4 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    PDF

    cmos tsmc 0.18

    Abstract: reliability data analysis report failure test report
    Contextual Info: QUALITY & RELIABILITY CYPRESS 2000 Q3 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    cmos tsmc 0.18reliability data analysis reportfailure test report PDF

    cmos tsmc 0.18

    Contextual Info: CYPRESS QUALITY & RELIABILITY 2000 Q2 RELIABILITY REPORT TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS MANAGEMENT SYSTEM SEMICONDUCTOR 2.0 EARLY FAILURE RATE SUMMARY 2.1 Early Failure Rate Determination 3.0 LONG TERM FAILURE RATE SUMMARY 3.1 Long Term Failure Rate Determination


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    cmos tsmc 0.18 PDF

    Contextual Info:  Mounting Conditions Date: 2013.10.03 The following information is used for the reflow conditions of Lyontek Products, and please follows the package type to choose the suitable conditions. All the conditions are compliant with JEDEC J-STD-020 and IPC-1066.


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    j-std-020ipc-1066 PDF

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Contextual Info: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


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    tqfp 10x10 traytqfp 14x14 trayqfn traytube 4-400+6tray tqfp 14x14 1.4156 qfn 12x12lqfp 48 package boxa7 sot-89hs-2000-1qfn shipping trays PDF

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


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    j2t0011-38-60copyright1998okielectricindustrycoj2t0002-38-60bga-388+14bga-4202144-9028-01-x5x1mil-m-38510mil-std-883smd ic 2025 blssop64d560mk 50075 nqfp package 128 lead .5mmdip16-c-300-2r400s115960ffpq20 PDF

    Contextual Info: MI TS UB IS HI L S I s MH2 M3 6 C J - 8 , —1 O 7 5 4 9 7 4 7 2 - B I T a 0 9 7 l5 2 - W 0 n D B Y 3 6 -B IT D Y N A M lC RAM DESCRIPTION The M1I2M36CJ is 2097152 vordX36bit dynamic RAM. This consists ehight industry standard 1MX1 dy­ namic RAXis in SOJ and sixteen industry standard


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    mh2m36cm1i2m36cjvordx36bitmii2m36cj-8+1mh2m36cj PDF