SMALL Search Results

54HC573

Contextual Info: SN54HC573, SN74HC573 OCTAL D-TYPE TRANSPARENT LATCHES WITH 3-STATE OUTPUTS D26B4. DECEMBER 1982-REVISED SEPTEMBER 1987 • High-Current 3-State Output Drive Bus-Lines Directly or Up to 15 LSTTL Loads • Bus-Structured Pinout Package Options Include Plastic "Small

Contextual Info: GaAs IRED S PHOTO-TRANSISTOR TLP126 T IP I2 6 P R O G R A M M A B L E C O N TR O LLERS A C /D C -IN P U T M O D U L E T E L E C O M M U N IC A T IO N The TOSHIBA MINI FLAT COUPLER TLP126 is a small outline coupler, suitable for surface mount assembly.

C 34 F

Abstract: 1SV274 D234
Contextual Info: SILICON EPITAXIAL PLANAR TYPE VARIABLE CAPACITANCE DIODE 1SV274 C A T V T U N IN G . • • • • High Capacitance Ratio : C2V / C25V = 12.5 Typ. Low Series Resistance : rs = 0.6f2 (Typ.) Excellent C-V Characteristics, and Small Tracking Error. Small Package

SN74HC74

Contextual Info: SN54HC74, SN74HC74 DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET _ SCLS094A - DECEMBER 1982 - REVISED JANUARY 1996 Package Options Include Plastic Small-Outline D , Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and

MP4007

Contextual Info: SILICON NPN EPITAXIAL TYPE POWER TRANSISTOR 4 IN 1 MP4007 HIGH POWER SWITCHING APPLICATIONS. INDUSTRIAL APPLICATIONS Unit in mm HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE 25.2 ± 0.2 LOAD SWITCHING. . Small Package by Full Molding. (SIP 10 Pin) . High Collector Power Dissipation.

IC-524

Abstract: 74as
Contextual Info: SN 54AS881A, S N 74AS 8 8 1A ARITH M ETIC LOGIC UNITS/FUNCTION G ENERATORS D 2 6 6 1 , DECEMBER 1 9 8 2 - • Package Options Include Plastic "Small Outline" Packages, Both Plastic and Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs •

Contextual Info: SN54ALS05A, SN74ALS05A HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS S D A S 1 9 0 A - APRIL 1982 - R EVISED DECEMBER 1994 Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mll DIPs

Contextual Info: SILICON MONOLITHIC BIPOLAR LINEAR INTEGRATED CIRCUIT TA4000F VHF-UHF WIDE BAND AMPLIFIER APPLICATIONS FEATURES • Band W id th 700MHz M in. @ 3 dB dow n • Low Noise 4dB (Typ.) @ f = 400MHz • Small Package M A X IM U M RATINGS (Ta = 25°C) CHARACTERISTIC

IC SN74HC

Abstract: SN74HCTOO SN74HC
Contextual Info: SN54HCT00, SN74HCT00 QUADRUPLE 2-INPUT POSITIVE NANO GATES D 3 2 4 3 , NOVEMBER 1968 Inputs are TTL-Voftage Compatible S N 54H C T00 S N 74H C T00 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil

Contextual Info: SN54ALS1034, SN54AS1034A, SN74ALS1034, SN74AS1034A HEX DRIVERS SDAS063B - APRIL 19S2 - REVISED JANUARY 1995 'AS1034A Offer High Capacltlve-Dri ve Capability Noninverting Drivers Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and

Contextual Info: SN74LVC540 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS JA N U A R Y 1993 • Space-Saving Package Option: Shrink Small-Outline Package DB Features EIAJ 0.65-mm Lead Pitch DB, DW, OR PW PACKAGE (TOP VIEW) • EPIC (Enhanced-Performance implanted CMOS) Submicron Process

logic diagram of 7432

Abstract: Texas Instruments TTL 7432
Contextual Info: SN5432, SN 54LS32, SN54S32. SN7432, SN74LS32, SN74S32 QUADRUPLE 2-INPUT POSITIVE-OR GATES DECEMBER 1983-REVISED MARCH 1988 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs • SN 5432. SN 54LS32, SN 54S 32 . . . J OR W PACKAGE

Contextual Info: SN54F20, SN74F20 DUAL 4-INPUT POSITIVE-NAND GATES D2932, MARCH 1987-REVISED JANUARY 1989 • Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs S N 5 4 F 2 0 . . . J PACKAGE S N 7 4 F 2 0 . . . 0 OR N PACKAGE

Contextual Info: SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11 TRIPLE 3-INPUT POSITIVE-AND GATES SDAS009C - MARCH 1984 - REVISED DECEMBER 1994 • Package Options Include Plastic Small-Outline D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

TD-172

Abstract: 3B3 diode TOLD9151MB
Contextual Info: TOSHIBA VLD Technical Data TOLD9151MB Units in: mm • Small package high power index guided type M Q W InGaAlP V L D ■ Package flange: 05.6m m ■ Applications include: Read/write optical disk systems *5 .6 Surface ^ Pin Connection 0.03 * 4 .4 M A X 5 i

Contextual Info: SN74ALS166 PARALLEL-LOAD 8-BIT SHIFT REGISTERS D2«»1, APRIL 1982 - REVISED OCTOBER 1988 Synchronous Load Direct Overriding Clear Parallel to Serial Conversion SN74ALS106 D O R N PACKAGE TOP VIEW U i 6 ] v Cc SE F » C Package Options Include Plastic 'Small

2n3820 transistor

Abstract: TIC 106b 2n3820
Contextual Info: TYPE 2N3820 P-CHANNEL SILICON JUNCTION FIELD-EFFECT TRANSISTOR B U L L E T IN N O . D L -S 6 8 7 9 4 7 , A U G U S T 1 9 6 5 -R E V IS E D J U L Y 1968 SILECTf FIELD-EFFECT TRANSISTOR * For Industrial and Consumer Small-Signal Applications m e c h a n ic a l d a t a

Contextual Info: GaAs IRED a PHOTO-TRANSISTOR TLP130 TLP130 U nit in mm P R O G R A M M A B L E CO NTRO LLER S A C /D C - IN P U T M O D U L E T E L E C O M M U N I C A T IO N The TOSHIBA MINI FLAT COUPLER TLP130 is a small outline coupler, suitable for surface m ount assembly.

BYV27-50

Abstract: BYV27-100 BYV27-150 UES1103 UES1101 UES1100
Contextual Info: RECTIFIERS High Efficiency, 2.5A UES1101 UES1102 UES1103 FEATURES • Very Fast Recovery Times • Very Low Forward Voltage • Small Size • Convenient Package BYV27-50 BYV27-100 BYV27-150 DESCRIPTION An axial leaded power rectifier useful in many switching applications.

Contextual Info: SN74F2244 25Q OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS _ SDFS095 - NOVEMBER 1993 • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers * Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic

Contextual Info: SN74LVC841 10-BIT BUS-INTERFACE D-TYPE LATCH WITH 3-STATE OUTPUTS M ARCH 1993 OB, DW, OR PW PACKAGE TOP VIEW • Space-Saving Package Option: Shrink Small-Outline Package (DB) Features EIAJ 0.65-mm Lead Pitch • EPIC (Enhanced-Performance Implanted

Contextual Info: SN54HC832, SN74HC832 HEX 2-INPUT OR DRIVERS D 2804, MARCH 1 9 8 4 -R E V IS E D SEPTEM BER 1987 SN 54H C 832 . . . J PACKAGE SN 7 4 H C 8 3 2 . . . D W O R N P A C K A G E High-Current Outputs Can Drive Up to 15 LSTTL Loads TO P V IEW Package Options Include Plastic "Small

IC 7422

Abstract: 7422 74LS22D as 5422 T3228
Contextual Info: SN5422, SN 54LS22, SN54S22, S N 7422 , S N 74 LS 2 2 , SN 74S22 D U A L 4-INPUT POSITIVE N A N D G A TES W ITH O P EN C O LLEC TO R O U TPU TS DECEMBER 1983 - REVISED MARCH 19B8 Package Options Include Plastic "Small Outline” Packages, Ceramic Chip Carriers

2SA1145

Contextual Info: 2SA1145 SILICON PNP EPITAXIAL TYPE PCT PROCESS Unit in mm A U D IO FREQUENCY AMPLIFIER APPLICATIONS. • • • Complementary to 2SC2705. Small Collector Output Capacitance : C0b = 2.5pF (Typ.) High Transition Frequency : f'r = 200MHz (Typ.) M A X IM U M RATING S (Ta = 25°C)