BK-4
Abstract: qfp304 QFP304-P-4040-0
Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 12.37 TYP. 2/Nov. 28, 1996
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QFP304
Contextual Info: QFP304-P-4040-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 12.37 TYP. 2 版/96.11.28
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4040
Abstract: QFP304 4040 datasheet QFP304-P-4040-0
Contextual Info: QFP304-P-4040-0.50-BK4 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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qfp304-p-4040-050-bk44040qfp304+14040 datasheet
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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dip8-p-300-2dip14-p-300-2dip16-p-300-2dip18-p-300-2+12mil-m-38510mil-std-883lga 1156 pin out diagramqsj-44403lga 1150 socket pin diagramlga 1155 socket pin diagramic107-26035-20-glga 1151 pin diagramreflow lga socket 1155ic107-3204-gtb 2929 h alternativelga 1155 pin diagram
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qfp144p
Abstract: 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80
Contextual Info: J2N0016-38-81 作成：1998年 8月 前回作成：1996年10月 パッケージ l n パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI／Oピン数等からお客様の 要求に合ったパッケージをお選びください。
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j2n0016-38-81ssop32-p-430-1qfp44-p-910-080-2k+16qfp56-p-910-065-2kqfp60-p-1519-1qfp64-p-1414-080-bkqfp128-p-2828-0qfp144p425mqfp208-p-2828-0qfp144-p-2828qfp128qfp144qfp160qfp44qfp60qfp80
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2035 zilog
Abstract: zilog 2035 TC81221F set top box block diagram TX3904 QFP304 LSI ASIC MIPS R3000A toshiba semiconductor catalog TX39
Contextual Info: SYSTEM CATALOG FOR DIGITAL SET TOP BOXES Set Top Box Block Diagram Example of Digital Satellite Broadcast Set Top Box for Japanese Systems Tuner TD7627FN TA1248F F-Syn. I/Q Demo. Modem Codec TC90A48F TC90A32F QPSK System MPU TX39 Software Modem Video Encoder
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td7627fnta1248ftc90a48ftc90a32f+13tc81220cftc90a43ftc9293af2035 zilogzilog 2035tc81221fset top box block diagramtx3904qfp304lsi asicmips r3000atoshiba semiconductor catalogtx39
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PBGA352 35
Abstract: QFP44-P-910-0 QFP64-P-1414-0 QFP80-P-1420-0 SSOP32-P-430-1 mirror P-LFBGA224-1515-0 160-28X
Contextual Info: FJXLSC-PKG-04 作成：2000 年 9 月 前回作成：1998 年 8 月 パッケージ ● • パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI ／O ピン数等からお客様の御要求に合ったパ
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fjxlsc-pkg-04ssop32-p-430-1qfp44-p-910-080-2k+10qfp56-p-910-065-2kqfp60-p-1519-1qfp64-p-1414-080-bkqfp80-p-1420-0pbga352 35mirrorp-lfbga224-1515-0160-28x
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Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite
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qfp64qfp80qfp100bqfp100+5tqfp100qfp120tqfp120bqfp132qfp160
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425M
Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3
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p-lfbga144-1313-0p-bga256-2727-1p-bga352-3535-1p-bga420-3535-1+12p-bga560-3535-1p-tflga32-0806-0425mdip18dip20dip28dip32dip40soj28-p-400-1pga wire bondingipga400-c-s33u-1pga240
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Contextual Info: G—QFP304—4040—0.50 Uniti nn 42, 6±0. 2 39, 2±0, 4 228 153 ?!?!?!?!?!?!?!?!?! !?!?!?!?!?!?!?!?!?!?!?!?!?!? 229 152 31013101310131013101310131013101310131
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QSJ-50074
Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4
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Contextual Info: HCT-900 HCT-900 Hand Held Convection Tool SMT Component Rework A Versatile Hot Air Tool for SMT Soldering and De-soldering The OK International HCT-900 Hand Held Convection Tool offers a low cost versatile rework solution for a wide variety of production and rework
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hct-900hct-900-11hct-900-21hct-900-10+4h-sl16h-p20plcc-28h-p32
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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ic 50061lfbga50-p-400qfp128-p-1420-0+6qfp304qfp304 tray sizeqsj-44440p-lfbga84-0909-0p-lfbga224-1515-0soj32-p-400-1
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QSJ52627
Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 7 章 包装 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 7 章部分とな ります。
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R50-E2Y2-24
Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
Contextual Info: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.
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pc-zip/dip20-01pc-zip/dip28-01pc-zip/dip28-02pc-zip20/dip18-01+10r50-e2y2-24sk 808584 pin plcc ic basearomat tq2e-24vut1553bcrtmintel 486 dx2soic40plcc44 pinout numbersxe4006e68hc001
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Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite
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3360D
Abstract: 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP18 DIP20 DIP28 DIP32 SDIP30
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4
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TSOP 173 g
Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
Contextual Info: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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lga 1156 pin out diagramqfp11t144-002lga 1156 socket diagram216-lqfp+6wells-cti 36 lead flat packsmd aaaswells-cti lcc socketwells-cti 880 020bga136enplas drawings
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sac 326
Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要
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Contextual Info: G—QFP304—4040—0.50 Uniti nn Nov.2003
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QF 09002
Abstract: QMF 10713 QFP16 QMF 10725 QFP11 QMF 10748 QF 01602 QMF 10726 Hy-Q international crystal filter QF 45001
Contextual Info: International Quartz Crystal Filter Product Guide INDEX Product Application 16.9 MHz Channel Filters 25 kHz Channel Spacing Terms and Definitions Ordering Information 10.7 MHz Channel Filters 12.5 kHz Channel Spacing 20 kHz Channel Spacing 25 kHz Channel Spacing
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koki solder paste
Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY
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ju-11tkoki solder pastebga256koki ju-11t+6qfp128-p-1420-0the package information document consisting of 8 chapters in totalqfp128-p-2828-0ssop20-p-250-0ssop30-p-56-0ssop32-p-430-1
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QFP160-P-2828-0
Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE
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qfp160-p-2828-0qfp304tsop 66 pin package thermal resistancetsop 48 thermal resistance+6bga 208 packageqfj32-p-r450-1sdip64-p-750-1soj28-p-400-1qfp208-p-2828-0tsop 48 thermal resistance junction to case
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