DIP32 Search Results

DIP32

Abstract: dip32 package
Contextual Info: PACKAGE DIMENSIONS DIP32 41.9 ± 0.3 17 1 16 14.0 ± 0.3 32 1.27 2.54 GD-D03201H-2 Ver.2004-03-10 15.24 3.3 4.83M AX 0.45 ± 0.1 0.64M IN 1.91 0 to 15° 0.25 ± 0.13 UNIT : mm

PLCC32

Abstract: PLCC32 SOCKET AE-P32U-Z PLCC-32
Contextual Info: AE-P32U-Z Page 1 of 2 AE-P32U-Z DIP32/PLCC32 universal adapter with clam shell socket. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter analogues supplied by third-party vendors:

plcc 32 socket

Abstract: PLCC32 PLCC32 socket dip32 programmer P32 23 transistor P32 PLCC-32 plcc32 dip socket DIP32
Contextual Info: AE-P32-CP49 Page 1 of 2 AE-P32-CP49 DIP32/PLCC32 specialized adapter for EPROM/FLASH with open top socket. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z ChipProg-40 Adapter Connection Table: DIP-32 PLCC-32

DIP32

Abstract: LC33864M LC33864P LC33864P-80 en4701 EN4701A
Contextual Info: Ordering number : EN4701A CMOS LSI LC33864P-80, M-70/80/10 512 K 65536 words x 8 bits Pseudo-SRAM Overview Package Dimensions The LC33864 series is com posed o f pseudo static RAM unit: mm that operate on a single 5 V pow er supply and is organized 3192-DIP32

Contextual Info: DIP32-P-600-2.54 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 4.70 TYP. 3 版/96.12.11

DIP32-P-400

Contextual Info: DIP32—P—400—2.54 Unit: m Sep,2000

DIP32-P-400-2

Abstract: DIP32-P-400
Contextual Info: 32P4F Plastic 32pin 400mil DIP Weight g 3.24 Lead Material Alloy 42 17 1 16 E 32 c JEDEC Code – e1 EIAJ Package Code DIP32-P-400-2.54 Symbol L A1 A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08

32P4

Abstract: JEDEC 600Mil dip
Contextual Info: 32P4 Plastic 32pin 600mil DIP JEDEC Code – Lead Material Alloy 42 17 1 16 E 32 e1 c EIAJ Package Code DIP32-P-600-2.54 Weight g 4.08 D L A1 A A2 Symbol SEATING PLANE e b1 b A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.1 0.51

sot201

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: AE-TS32W Page 1 of 2 AE-TS32W DIP32/TSOP32 specialized adapter for Flash memory. Device package dimensions: 8 x 20 mm, 0.5 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40

Contextual Info: 32P4Y Plastic 32pin 300mil DIP 17 1 16 E 32 c JEDEC Code – Lead Material Alloy 42 e1 EIAJ Package Code DIP32-P-300-2.54 Weight g Symbol L A1 A A2 D SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.75 0.51

P32 transistor

Abstract: PLCC32 transistor P32 PLCC-32 PLCC32 socket dip32 programmer plcc 32 socket P32 23 transistor P32 23 DIP32
Contextual Info: AE-P32-CP49-Z Page 1 of 2 AE-P32-CP49-Z DIP32/PLCC32 specialized adapter for EPROM/FLASH with clam shell socket. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z ChipProg-40 Adapter Connection Table: DIP-32 PLCC-32

dip32

Contextual Info: パッケージ外形図 DIP32 41.9 ± 0.3 17 1 16 14.0 ± 0.3 32 1.27 2.54 GD-D03201H-2 Ver.2004-03-10 15.24 3.3 4.83M AX 0.45 ± 0.1 0.64M IN 1.91 0 to 15° 0.25 ± 0.13 単位 : mm

Contextual Info: DIP32-P-600-2.54 Unit: nn

DIP32

Contextual Info: SANYO Semiconductor Dual In-line Package 32Pin Plastic DIP32 600mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: DIP32-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.70 TYP. 3/Dec. 11, 1996

PLCC-32

Abstract: PA32-32 AE-P32U plcc32 dip socket
Contextual Info: AE-P32U Page 1 of 2 AE-P32U DIP32/PLCC32 universal adapter with open top socket. Click the programmer model below to get an appropriate list of the devices supported by the adapter: z z z ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter analogues supplied by third-party vendors:

JEDEC 600Mil dip

Abstract: "lead material" DIP 32P4
Contextual Info: EIAJ Package Code DIP32-P-600-2.54 32P4 e b 16 1 D 17 Lead Material Alloy 42 32 JEDEC Code – Weight g 4.08 SEATING PLANE b1 A L E A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 32pin 600mil DIP c Mar.’98 Dimension in Millimeters Min Nom Max – – 5.1

DIP32

Abstract: diode databook dip32 package
Contextual Info: DIP32-P-600-2.54 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: DIP32-P-400-2.54 Unit! m Aug,2000

Contextual Info: DIP32-P-300-2.54 Unit: nei Aug,2000

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-Q32U DIP32/QFP32 universal adapter. Device Search Description:

SOT201

Abstract: DIP32 package DIP32
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP32: plastic dual in-line package; 32 leads 600 mil SOT201-1 ME D A2 L A A1 c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A18D0

Abstract: TC534000AP
Contextual Info: Slsllllf I I I ! llllll ¡11 4M BIT 512K W O R D x 8 B IT CMOS MASK ROM DESCRIPTION The TC534000AP/AF is a 4,194,304 bits read only memory organized as 524,288words by 8bits. The TC534000AP / AF is fabricated using Toshiba’s advanced CMOS technology which provides the