QFP144P Search Results

1414f

Abstract: QFP144-P-2626B QFP44-P-1414F RTC Real Time Clocks TC8521AM TC8512BY MC68B45
Contextual Info: Microcomputer Peripheral Controller LSI RTC Real Time Clocks Group Name Parts Name Function Summary Package TC8521AP DIP18-P-300A TC8521AM SOP20-P-300 RTC-2A Real Time Clock for Micro Computer. Hour, minutes, second, month, day, day of the week and year count with leap year operation. 4-bit I/O CPU Direct.

QFP144

Abstract: QFP Package 144 lead QFP144-P-2828-2
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)

QFP144-P-2020-1

Abstract: QFP144 QFP144-P-2020 SQ108
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M03 EIAJ code :∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing

QFP 144 PACKAGE

Abstract: QFP144-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index FPT-144P-M01 EIAJ code :∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

qfp144p

Abstract: 425M QFP208-P-2828-0 QFP144-P-2828 QFP128 QFP144 QFP160 QFP44 QFP60 QFP80
Contextual Info: J2N0016-38-81 作成：1998年 8月 前回作成：1996年10月 パッケージ l n パッケージ パッケージはシリーズ毎に豊富に用意しています。パッケージタイプやI／Oピン数等からお客様の 要求に合ったパッケージをお選びください。

a144m

Abstract: A144-M 1414D ip 2222A TC8576 ST506 TC8608 note com IBM battery circuit C68B4 765 VFO
Contextual Info: Microcomputer Peripheral Controller LSI PRODUCT GUIDE note * shows new issue updated. RTC NAM E Real Time Clocks PARTS NAM E PACKAGE TC8250P D IP I 6-P-300A TC8250A P DIP16-P-300A TC8521AP DIP18-P-300A TC8521 AM SOP20-P-300 RTC-1 RTC-2A DC Group NAME PRODUCT

TA8823N

Abstract: TA7772P TA8644N TA8618S TA7361AP TA8604N TA8607P TA8632N ta7673 TB1207N
Contextual Info: VCR ICs Stage Switch RF Modulator REC Pre Amp Package Type No. Function Operating Voltage TA7347P SIP7-P-A 2-Input video switch 8 - 10V TA7348P SIP9-P-A 3-Input video switch 8-10V TA7361AP/AF SI P7-P-A/SOP8-P-225 Audio head switch TA8686S/F SIP9-P-A/SSOP10-P-225

Contextual Info: QFP144-P-2626-0.65B o, 1 5 -8 : o s Uniti m Mar,2000

sparclite

Abstract: MB86833 ADR11 ADR14 MB86833PFV-G bit3116 MB8683X
Contextual Info: ASSP CMOS SPARClite Series 32-Bit RISC Embedded Processor MB86833 Package • 144-pin, Plastic LQFP • FPT-144-M08 Features • 66 MHz CPU with on-chip clock multiplier • Bus interface support for 8-, 16-, or 32-bit wide memory • SPARC high performance RISC architecture

Contextual Info: TOSHIBA TC35815CF Flow Control 10/100Mbps Ethernet Controller 1 9 9 9 P R E L I M I N A R Y D A T A TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. S H E E T 1999 Toshiba America Electronic Components, Inc. Published in April, 1999 Toshiba products described in this document are not authorized for use as critical components in life support systems without the written consent of the appropriate officer of Toshiba

QFP144

Abstract: QFP144-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)

QFP144-P-2828-2

Abstract: qfp144p
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M02 EIAJ code :∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02

QFP 144 PACKAGE

Abstract: QFP144-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M01 EIAJ code : ∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01 144-pin plastic QFP (FPT-144P-M01)

FND LT 542

Abstract: RBL 43 P 530 SE TMPZ84C00 pins of FND LT 542 dsasl
Contextual Info: HARD DISK CONTROLLER TC8561F TENTATIVE Hard Disk Controller 1. GENERAL DESCRIPTION T h e T C 8 5 6 1 F H D C is a h i g h efficiency 108 73 h a rd disk c o n tro lle r w ith a b u ilt-in disk c o n tro lle r , s y s te m i n te r f a c e , b u f f e r m e m o r y

murata REEL label

Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E07 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not

LCD 320 x 240 mono stn

Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E07 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not

i351

Abstract: LOGIC FCT BT 342 project
Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33E08 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not

ITT ZD15

Abstract: transistor 6cn P018-P-0300A itt ZD20 SSOP-016-P diode i321 ZD21 B91 02 diode TSOP044-P0400A h322
Contextual Info: utlines MOS LSIs • D I P I 'a c K a g e s L1 (8-DIP). Unit: mm DIPQ08-P-0300 L2 (8-DIP (Special), *DIP014-P-0300C j .7 ip; I ]6|° 1Ü 2L 3C 4[ I ]7 i i ]5 (12-DIP(Special), *DIP012-P-0300(Special) lc - ? 6 .4 ” 0 . 2 È — ls 3. ¿ u. i '0 . 7 m in. ¡

QFP144-P-2828-1

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M01 EIAJ code :∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01

QFP144-P-2020-1

Abstract: FPT-144P-M03 QFP144 qfp144p
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M03 EIAJ code :∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03

sparclite

Abstract: ADR11 ADR14 MB86833 MB86833PFV-G MB86930 cs2105
Contextual Info: ASSP CMOS SPARClite Series 32-Bit RISC Embedded Processor MB86833 Package ¥ 144-pin, Plastic LQFP ¥ FPT-144-M08 Features • 66 MHz CPU with on-chip clock multiplier • Bus interface support for 8-, 16-, or 32-bit wide memory • SPARC high performance RISC architecture

TC8606F

Abstract: 1414f TC8606F-000 battery 1414D TC8521 Battery Charging Controller ST506 FLOPPY DISK DRIVE FDMC ibm scsi hard disk drive
Contextual Info: Microcomputer Peripheral Controller LSI PRODUCT GUIDE note * shows new issue updated. RTC Group NAME Real Time Clocks PARTS NAME PACKAGE TC8250P DIP16-P-300A TC8250AP DIP16-P-300A TC8521AP DIP18-P-300A TC8521 AM SOP20-P-300 RTC-1 RTC-2A DC Group NAME TECHNICAL

tc8511

Abstract: QFP144-P-2626B TC8511F BY03A K 176 LE, K 561 LN BY-03A
Contextual Info: DISPLAY CONTROLLER TC8511F Font G rap h ics A ccelerato r 1. G EN ERA L DESCRIPTION T h e F o n t G ra p h ic s A c c e le ra to r F G A is a high-speed L S I th a t en a b le s hardw are-b ased processing. E f f ic ie n t com m an ds a re provided to c o n v e r t d is p la y

TMP95C063FG

Abstract: TMP95C063
Contextual Info: TOSHIBA Original CMOS 16-Bit Microcontroller TLCS-900/H Series TMP95C063FG TMP95C063DFG Semiconductor Company TMP95C063 Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this