LFBGA Search Results

Contextual Info: 3.3V CMOS 32-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS AND BUS-HOLD FE A T U R E S : - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 96 balls

Contextual Info: 3.3V CMOS 36-BIT UNIVERSAL BUS TRANS­ CEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD FEATURES: - 0.5 MICRON CMOS Technology Typical tSK o (Output Skew) < 250ps ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) 0.8mm pitch LFBGA package, 114 balls

STA2500D

Abstract: 3DH-5 sta2500 bluetooth test mode sta2500d bt Coexistence wire STLC2500D uart 16750 baud rate 2500D7 bluetooth transmitter receiver parallel chip E1500
Contextual Info: STA2500D Bluetooth V2.1 + EDR "Lisbon" for automotive applications Features • Based on Ericsson technology licensing baseband core (EBC) LFBGA48 (6x6x1.4mm; 0.8mm Pitch) ■ Bluetooth™ specification compliance: V2.1 + EDR (“Lisbon”) – Point-to-point, point-to-multipoint (up to 7

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA169 package SOT1024-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

AD5532-2

Abstract: AD5532 AD5532-1 AD5532-3 AD5532-5 AD5532ABC-1 AD5532ABC-2 AD780 diagram of dac interfacing with 8051 SSPcon
Contextual Info: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 mm ؋ 12 mm LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Read-Back Capability DSP/Microcontroller Compatible Serial Interface

Contextual Info: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline LFBGA169: plastic low profile fine-pitch ball grid array package; 169 balls B D SOT1024-1 A ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-1 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b M M C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e

Contextual Info: Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X C e1 e AB AA Y W V U T R P N M L K J H G F E D C B A ball A1 index area ∅v ∅w b 1/2 e

Contextual Info: Package outline LFBGA216: plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm SOT715-1 A B D ball A1 index area A A2 A1 E detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C V e U T R P N M L K e2 J H 1/2 e G F E D C

Contextual Info: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls B D SOT1019-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 3

Contextual Info: 32-Channel 14-Bit DAC with High-Speed 3-Wire Serial Interface AD5532HS a FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Guaranteed Monotonic DSP-/Microcontroller-Compatible Serial Interface Channel Update Rate 1.1 MHz Output Impedance 0.5 ⍀

C3744

Contextual Info: a 32-Channel, 14-Bit Voltage-Output DAC AD5532* GENERAL DESCRIPTION FEATURES High Integration: 32-Channel DAC in 12 ؋ 12 mm2 LFBGA Adjustable Voltage Output Range Guaranteed Monotonic Readback Capability DSP-/Microcontroller-Compatible Serial Interface Output Impedance

sot751

Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J

Contextual Info: MAS 3587F Short Information MAS 3587F MPEG 1/2 Layer 3 Encoder/Decoder PLQFP64 or LFBGA81 Package The MAS 3587F is a single-chip MPEG layer 3 audio encoder/decoder designed for use in portable memory-based recording/playback applications. The MAS 3587F contains the DSP engine with embedded

AD5517

Abstract: AD5517-1 AD5517-2 AD5517-3
Contextual Info: PRELIMINARY TECHNICAL DATA a 16-Channel 14-Bit Voltage-Output DAC AD5517-1/AD5517-2/AD5517-3* Preliminary Technical Data FEATURES High Integration: 16-channel DAC in 12x12 mm 2 LFBGA Guaranteed Monotonic Low Power, SPI TM, MICROWIRETM and DSP-Compatible 3-Wire Serial Interface

sot894

Contextual Info: Package outline Philips Semiconductors LFBGA280: plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm B D SOT894-1 A ball A1 index area A E A2 A1 detail X e1 e C 1/2 e ∅v ∅w b M M y1 C C A B C y Y W V e U T R P N M L e2

sot862

Contextual Info: Package outline Philips Semiconductors LFBGA336: plastic low profile fine-pitch ball grid array package; 336 balls; body 12 x 12 x 1.05 mm D SOT862-1 B A ball A1 index area A E A2 A1 detail X C e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D

LFBGA324

Abstract: MO-205
Contextual Info: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls; body 16 x 16 x 1.2 mm A B D SOT571-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y1 C y ∅w M C V U

MO-205

Abstract: LFBGA180
Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U