LFBGA141 Search Results
LFBGA141 Datasheets Context Search
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Contextual Info: Package outline LFBGA141: plastic low profile fine-pitch ball grid array package; 141 balls A B D SOT1079-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 |
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lfbga141ot1079-1 | |
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Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA141 package SOT1079-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
lfbga141ot1079-1 |