LFBGA487 Search Results

Contextual Info: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-1 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b M M C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of LFBGA487 package SOT1077-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA487 package SOT1077-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA487: plastic low profile fine-pitch ball grid array package; 487 balls A B D SOT1077-2 ball A1 index area E A A2 A1 detail X e1 e AG AD 1/2 e ∅v ∅w b C C A B C y y1 C AH AF AC AA V R M J Y U P L H F C E B AE AB e W T e2 N 1/2 e K G

TEA5990

Abstract: PNX6710 PCF50623 GNS7560 an 6710 diagram circuit usb mp3 player with radio fm lcd CMOS Sensor to H.264 VFBGA100 Aero4229 nfc antenna
Contextual Info: Cellular system solution 6710 Compact, low-power system solution for HSDPA February 2009 www.stericsson.com This highly integrated 3.5G solution uses a fully validated modem and advanced multimedia technology to reduce design complexity and time-to-market. It provides an evolutionary step that brings ST-Ericsson leadership in EDGE and