C16185
Abstract: D346 PA-PGA240-01 Q560 2E682 30h2 65c51
Contextual Info: PA-PGA240-01 Map Rev A, 10/4/89 221 181 141 101 61 21 201 161 121 81 41 1 21 61 101 141 181 221 1 41 81 121 161 201 A1 A17 R1 R17 2.1" 2.3" 220 180 140 100 60 20 240 200 160 120 80 40 Bottom View-Base PGA Base A1 23 A2 3 A3 43 A4 63 A5 42 A6 41 A7 83 A8 103
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PGA240-C-S17U-2
Abstract: PGA240
Contextual Info: PGA240-C-S17U-2.54 44.7 ± 0.55 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 U T R P N M L K J H G F E D C B A 4.82±0.4 INDEX MARK 2.54 0.46±0.05 5 0.25 M 3.3±0.4 1.27±0.3 SEATING PLANE
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F5 94
Abstract: PA-PGA240-02 l5107 U15235 L346
Contextual Info: PA-PGA240-02 Map Rev A, 6/22/94 213,182 151,120 89,59 1,30 30,1 59,89 120,151 182,213 A17 B C D E F G H J K L M N P R T U17 A1 B C D E F G H J K L M N P R T U1 241,212 181,150 119,88 29,58 58,29 Bottom View-Base PGA Base A1 1 A2 7 A3 36 A4 31 A5 60 A6 66 A7
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HT12E HT12D
Abstract: Panasonic RELAY Cross Reference NEC OMRON N80C196KC16 MOS248 TDA2086A GOULD 500 COLOUR LCD DIGITAL STORAGE OSCILLOSCOPE 1NA114AP ICM72171 SL443A nec matrix Vacuum tube display
Contextual Info: Issued July 1996 021-928 Data Packs A-K RS data sheet/semiconductor manufacturers data sheet index Data Sheet Introduction RS data sheets form a unique source of detailed information regarding technical specifications, absolute maximum ratings and applications for engineers and designers working with RS products.
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ht12e ht12dpanasonic relay cross reference nec omronn80c196kc16mos248+6tda2086agould 500 colour lcd digital storage oscilloscope1na114apicm72171sl443anec matrix vacuum tube display
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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dip8-p-300-2dip14-p-300-2dip16-p-300-2dip18-p-300-2+12mil-m-38510mil-std-883lga 1156 pin out diagramqsj-44403lga 1150 socket pin diagramlga 1155 socket pin diagramic107-26035-20-glga 1151 pin diagramreflow lga socket 1155ic107-3204-gtb 2929 h alternativelga 1155 pin diagram
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HG62S026
Contextual Info: HG62S Series High-Speed CMOS Gate Array H IT A C H I* Features Description The HG62S series free-channel gate arrays utilize a 0.8-/un CMOS process with triple metal intercon nect technology. The series consists of 6 master slices ranging from 26,054 to 250,000 raw gates.
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425M
Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3
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p-lfbga144-1313-0p-bga256-2727-1p-bga352-3535-1p-bga420-3535-1+12p-bga560-3535-1p-tflga32-0806-0425mdip18dip20dip28dip32dip40soj28-p-400-1pga wire bondingipga400-c-s33u-1pga240
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SOP48
Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7
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qfp12qfp13qfp15qfp14+1012x12x114x20x214x14x1sop48cf rm sot89sop3814x14x2epson qfp 21645x45 mm bga14x14x2.7
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AK336
Abstract: TQFP240 68HC11E0 68hc001 68HC05B5 TQFP160 68hc11a0 Yamaichi TQFP144 68HC12 microcontroller M68HC08A
Contextual Info: Product Catalog 1/98 Development Tools for - Motorola M68HC05 - Motorola M68HC08 - Motorola M68HC11 - Motorola M68HC12 - Motorola M68xxx - Motorola CPU-32 General Information Contents This catalog gives an overview of the products General Information 2 Contents
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m68hc05m68hc08m68hc11m68hc12+16m68xxxcpu-3268hc05/08/11ax681168hc0568hc08ak336tqfp24068hc11e068hc00168hc05b5tqfp16068hc11a0yamaichi tqfp14468hc12 microcontrollerm68hc08a
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lg r40 MOTHERBOARD CIRCUIT diagram
Abstract: palce programmer schematic lg tv electronic board schematic R5432 IHI-0001 PALCE mach210 programming EOI-0012 NBW4 VG-468 HP1650B
Contextual Info: hrg.book Page i Wednesday, July 22, 1998 9:18 AM ARM Development Board ARM7TDMI Version Document number: ARM DUI 0017C Issued: March 1997 Copyright ARM Limited 1997 ENGLAND GERMANY ARM 90 Fulbourn Road Cherry Hinton Cambridge CB1 4JN UK Telephone: +44 1223 400400
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0017clg r40 motherboard circuit diagrampalce programmer schematiclg tv electronic board schematic+7r5432ihi-0001palce mach210 programmingeoi-0012nbw4vg-468hp1650b
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sac 326
Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要
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pc114g4296513ja144pin+1644pin100ping389621x2429x29p-bga144-1313-0sac 326tsop 1386-tsoppga133-c-s14d-2pga240pbga352 35g43-87g38-96dip18-p-300-2tsop 48 thermal resistance
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HT12E HT12D
Abstract: 1NA114AP Burr Brown part marking Allen-Bradley micrologix 1000 RS 434-071 PCB Board 1na111ap allen-bradley silicone dashpot fluid hengstler, 890, 1 702 019 1NA131AP ICM72171
Contextual Info: Issued September 2001 302-1000 Data Packs A-K Data Sheet RS data sheet/semiconductor manufacturers data sheet index Introduction RS data sheets form a unique source of detailed information regarding technical specifications, absolute maximum ratings and applications for engineers and designers working with RS products.
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icm7216a1jiicm722a1jlicl8038bcicl8038cc+11max038cpht12e ht12d1na114apburr brown part markingallen-bradley micrologix 1000rs 434-071 pcb board1na111apallen-bradley silicone dashpot fluidhengstler, 890, 1 702 0191na131apicm72171
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HS253
Contextual Info: ADE-206-001 C H Feb. 1990 HG 62 E SERIES (H itachi C M O S Gate Array) 0 H IT A C H I The HG62E series is a master slice CMOS gate array o f w hich the gate length is 1 fim and uses 2-layer metal interconnect technology. Auto-diagnosis is a typical feature o f HG62E
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QFP160-P-2828-0
Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE
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qfp160-p-2828-0qfp304tsop 66 pin package thermal resistancetsop 48 thermal resistance+6bga 208 packageqfj32-p-r450-1sdip64-p-750-1soj28-p-400-1qfp208-p-2828-0tsop 48 thermal resistance junction to case
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G43-87
Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要
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pc114g42-96p-bga144-1313-0p-bga256-2727-1+14p-bga352-3535-1p-bga560-3535-113x13x025x25x135x35x1g43-87dip14-p-300-2dip20-p-300-2dip36-p-600-2pbga-144g38-96qfp160pga240qfp208-p-2828-0
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HS173
Abstract: KCC CL-30 HG62E11 HS153 TTL 74 series HS135 HS153 sn j hs-135 HG62E33 HG62E08
Contextual Info: A D E - 2 0 6 - 0 0 1 C H Feb. 1 9 9 0 HG62E SERIES (H itachi C M O S Gate A rray) H IT A C H I The HG 62E series is a master slice CMOS gate array o f w h ich the gate length is 1 fim and uses 2-layer metal interconnect technology. Auto-diagnosis is a typ ica l feature o f HG 62E
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ade-206-001hg62eade-206-001chs173+9kcc cl-30hg62e11hs153ttl 74 serieshs135hs153 sn jhs-135hg62e33hg62e08
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