QFP272-P-3636-0
Contextual Info: QFP272-P-3636-0.50-BK4 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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QFP272
Contextual Info: QFP272-P-3636-0.50-BK4 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 9.96 TYP. 2 版/96.11.28
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QFP272-P-3636-0
Contextual Info: QFP272-P-3636-0.50-BK4 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 9.96 TYP. 2/Nov. 28, 1996
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Contextual Info: G-QFP272-3636-0.50
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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dip8-p-300-2dip14-p-300-2dip16-p-300-2dip18-p-300-2+12mil-m-38510mil-std-883lga 1156 pin out diagramqsj-44403lga 1150 socket pin diagramlga 1155 socket pin diagramic107-26035-20-glga 1151 pin diagramreflow lga socket 1155ic107-3204-gtb 2929 h alternativelga 1155 pin diagram
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425M
Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3
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p-lfbga144-1313-0p-bga256-2727-1p-bga352-3535-1p-bga420-3535-1+12p-bga560-3535-1p-tflga32-0806-0425mdip18dip20dip28dip32dip40soj28-p-400-1pga wire bondingipga400-c-s33u-1pga240
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QSJ-50074
Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4
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300milqsj44400dip8p3002dip14p3002+15dip16p3002dip18p3002dip20p3002dip22p3002dip8g3002qsj-50074qsj-44403qfj28-p-s450-1qsj-44574ssop60-p-700-0ssop30-p-56-0sop8-p-250-1qsj52627sop44-p-600-1.27-kqfj20
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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ic 50061lfbga50-p-400qfp128-p-1420-0+6qfp304qfp304 tray sizeqsj-44440p-lfbga84-0909-0p-lfbga224-1515-0soj32-p-400-1
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QSJ52627
Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 7 章 包装 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 7 章部分とな ります。
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300milqsj-44400dip8-p-300-2dip14-p-300-2+13dip16-p-300-2dip18-p-300-2dip20-p-300-254-w154-s1qsj52627b375aqsj-50345040e-6qsj-44403qfj68-p-s9501890aqsj-52628
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DIP24-P-600-2
Abstract: oki qfp tray SEPT24
Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40
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100mil70mil50mil40pqfp+3dip24-p-600-2oki qfp traysept24
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3360D
Abstract: 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP18 DIP20 DIP28 DIP32 SDIP30
Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4
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300mil400mil350mil3360d+9800a 711tqfp64-p-1010-0qsj-4444044568dip18dip20dip28dip32sdip30
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TSOP 173 g
Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
Contextual Info: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4
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10secqfp56-p-910-ksnpb9557030ju-11t+1030sectsop 173 gtsop 056p150p151ssop20ssop30ssop32tsopi32-p-814-0qfp304
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sac 326
Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要
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pc114g4296513ja144pin+1644pin100ping389621x2429x29p-bga144-1313-0sac 326tsop 1386-tsoppga133-c-s14d-2pga240pbga352 35g43-87g38-96dip18-p-300-2tsop 48 thermal resistance
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koki solder paste
Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY
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ju-11tkoki solder pastebga256koki ju-11t+6qfp128-p-1420-0the package information document consisting of 8 chapters in totalqfp128-p-2828-0ssop20-p-250-0ssop30-p-56-0ssop32-p-430-1
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oki qfp tray
Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40
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50mil100mil70mil40pqfp+10oki qfp tray353512ssop64p-bga256-2727-1qfj28-p-s450-1qfp304-p-4040-0zip28qfp100-p-1420-0lqfp144-p-2020-0p-bga352-3535-1
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SMD IC 2025 bl
Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機
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j2t0011-38-60copyright1998okielectricindustrycoj2t0002-38-60bga-388+14bga-4202144-9028-01-x5x1mil-m-38510mil-std-883smd ic 2025 blssop64d560mk 50075 nqfp package 128 lead .5mmdip16-c-300-2r400s115960ffpq20
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G43-87
Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0
Contextual Info: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要
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pc114g42-96p-bga144-1313-0p-bga256-2727-1+14p-bga352-3535-1p-bga560-3535-113x13x025x25x135x35x1g43-87dip14-p-300-2dip20-p-300-2dip36-p-600-2pbga-144g38-96qfp160pga240qfp208-p-2828-0
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MSM7731-02
Abstract: P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A
Contextual Info: Datasheet CD-ROM Ver 1.23, July 1999 Bay of Islands, New Zealand Attention Please! People to People Technology 1. Regarding Operation • This is NOT a music CD. Please do not play it on an ordinary music CD player. It may cause damage to your ears and loudspeakers.
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270mbml670100d-41460msm7731-02+9p-bga313-3535-1tba 931msm82c59msm66arm processormsm5299ssop20-p-250-0qfj28-p-s450-1msm65524a
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d1884
Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40
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50mil100mil70mil40pqfp+10d1884tsop infraredtqfp80-p-1212-0msm6779bav-z-01mark w1 tsopmsm6778bav-z-01dip14-p-300-2dip20-p-300-23360d8400b
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