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    QFJ20PS3501 Search Results

    QFJ20PS3501 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    QFJ20-P-S350-1

    Contextual Info: QFJ20-P-S350-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		QFJ20-P-S350-1 PDF

    425M

    Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
    Contextual Info: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3


    Original     		P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240 PDF

    m80c85ah

    Abstract: oki m82c55a-2 pin diagram oki m82c55a-2 M81C55-5 M82C51A M82C51A-2 M82C51A-2 OKI IC OKI M81C55 M82C53 M82C53-2
    Contextual Info: Dear customers, About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd. The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI Semiconductor Co., Ltd. on October 1, 2008.


    Original     		MSM82C84A-2RS/GS/JS OP24-P-430-1 m80c85ah oki m82c55a-2 pin diagram oki m82c55a-2 M81C55-5 M82C51A M82C51A-2 M82C51A-2 OKI IC OKI M81C55 M82C53 M82C53-2 PDF

    QSJ-50074

    Abstract: QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20
    Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4


    Original     		300mil QSJ44400 DIP8P3002 DIP14P3002 DIP16P3002 DIP18P3002 DIP20P3002 DIP22P3002 DIP8G3002 QSJ-50074 QSJ-44403 QFJ28-P-S450-1 QSJ-44574 SSOP60-P-700-0 SSOP30-P-56-0 SOP8-P-250-1 QSJ52627 sop44-p-600-1.27-k QFJ20 PDF

    M82C84A-2

    Abstract: M82C37B-5 M80C88A-2 M82C51A-2 82C84A
    Contextual Info: E200012-27-X2 O K I Semiconductor MSM82C84A-2RS/GS/JS Previous version: Aug. 1996 CLOCK GENERATOR AND DRIVER GENERAL DESCRIPTION The MSM82C84A-2RS/GS is a clock generator designed to generate MSM80C86A-10 and MSM80C88A-10 system clocks of 8MHz. Due to the use of silicon gate CMOS technology, standby current is only 40 {lA MAX. , and the


    OCR Scan     		E200012-27-X2 MSM82C84A-2RS/GS/JS MSM82C84A-2RS/GS MSM80C86A-10 MSM80C88A-10 82C84A-2RS/GS/JS S0P24-P-430-1 M82C84A-2 M82C37B-5 M80C88A-2 M82C51A-2 82C84A PDF

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    QSJ52627

    Abstract: B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628
    Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 7 章 包装 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 7 章部分とな ります。


    Original     		300mil QSJ-44400 DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1 54-S1 QSJ52627 B375A QSJ-50345 040E-6 QSJ-44403 QFJ68-P-S950 1890A QSJ-52628 PDF

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24 PDF

    M81C55-5

    Abstract: m80c85ah M80C85A-2 M82C51A-2 M82C53-5 m81c55 m82c51a M80C85A M80C88A-2 m82c55a-5
    Contextual Info: J2O0012-27-X3 作成：1998年 1月 MSM82C84A-2l 前回作成：1996年 8月 ¡ 電子デバイス MSM82C84A-2 CMOS Clock Generator and Driver For MSM80C86A, MSM80C88A Processor n 概要 MSM82C84A-2はMSM80C86A、MSM80C88Aのシステムクロックを発生するクロックジェネ


    Original     		J2O0012-27-X3 MSM82C84A-2l MSM82C84A-2 MSM80C86A, MSM80C88A MSM82C84A-2MSM80C86AMSM80C88A CMOS40mA CLK16mA 624MHzCLK28MHz MSM80C86AMSM80C88AREADYRESET M81C55-5 m80c85ah M80C85A-2 M82C51A-2 M82C53-5 m81c55 m82c51a M80C85A M80C88A-2 m82c55a-5 PDF

    MSM82C84A-2RS

    Abstract: 82C84A-2 MSM80C86A-10 MSM80C88A-10 MSM82C84A-2GS-K MSM82C84A-2JS QFJ20-P-S350-1 xtal osc
    Contextual Info: E2O0012-16-81 ¡ Semiconductor MSM82C84A-2RS/GS/JS MSM82C84A-2RS/GS/JS ¡ Semiconductor CLOCK GENERATOR AND DRIVER GENERAL DESCRIPTION The MSM82C84A-2RS/GS is a clock generator designed to generate MSM80C86A-10 and MSM80C88A-10 system clocks of 8MHz. Due to the use of silicon gate CMOS technology, standby current is only 40 mA MAX. , and the power


    Original     		E2O0012-16-81 MSM82C84A-2RS/GS/JS MSM82C84A-2RS/GS MSM80C86A-10 MSM80C88A-10 82C84A-2 MSM82C84A-2RS 82C84A-2 MSM82C84A-2GS-K MSM82C84A-2JS QFJ20-P-S350-1 xtal osc PDF

    3360D

    Abstract: 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP18 DIP20 DIP28 DIP32 SDIP30
    Contextual Info: 7.包装 7. 包装 7-1. 包装形態 - 2 7-1-1. 通常包装 - 2 7-1-2. 防湿包装 - 3 7-2. 個装仕様 - 4


    Original     		300mil 400mil 350mil 3360D 800A 711 TQFP64-P-1010-0 QSJ-44440 44568 DIP18 DIP20 DIP28 DIP32 SDIP30 PDF

    TSOP 173 g

    Abstract: TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304
    Contextual Info: 4. 表面実装型パッケージ（SMD） の実装における参考情報 4. 表面実装型パッケージ（SMD）の実装 における参考情報 4-1. フットパターン - 4 4-1-1. フットパターンの設計方法 - 4


    Original     		10sec QFP56-P-910-K SnPb9557030 JU-11T 30sec TSOP 173 g TSOP 056 P150 P151 SSOP20 SSOP30 SSOP32 TSOPI32-P-814-0 JU-11T QFP304 PDF

    m80c85ah

    Abstract: m82c84a-2 M82C53-5 M81C55-5 M80C85A-2 M82C51A-2 oki m82c55a-2 m82c55a-5 OKI M82C51a-2 M80C85A
    Contextual Info: お客様各位 資料中の「沖電気」「ＯＫＩ」等名称の OKI セミコンダクタ株式会社への変更について 2008 年 10 月 1 日を以って沖電気工業株式会社の半導体事業は OKI セミコン ダクタ株式会社に承継されました。 従いまして、本資料中には「沖電気工業株


    Original     		J2O0012-27-X3 MSM82C84A-2l MSM82C84A-2 MSM80C86A, MSM80C88A MSM82C84A-2MSM80C86AMSM80C88A CMOS40mA CLK16mA 624MHzCLK28MHz MSM80C86AMSM80C88AREADYRESET m80c85ah m82c84a-2 M82C53-5 M81C55-5 M80C85A-2 M82C51A-2 oki m82c55a-2 m82c55a-5 OKI M82C51a-2 M80C85A PDF

    koki solder paste

    Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1
    Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY


    Original     		JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1 PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Contextual Info: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    oki qfp tray

    Abstract: 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1
    Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		50mil 100mil 70mil 40PQFP oki qfp tray 353512 ssop64 P-BGA256-2727-1 QFJ28-P-S450-1 QFP304-P-4040-0 ZIP28 QFP100-P-1420-0 LQFP144-P-2020-0 P-BGA352-3535-1 PDF

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 PDF

    MSM7731-02

    Abstract: P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A
    Contextual Info: Datasheet CD-ROM Ver 1.23, July 1999 Bay of Islands, New Zealand Attention Please! People to People Technology 1. Regarding Operation • This is NOT a music CD. Please do not play it on an ordinary music CD player. It may cause damage to your ears and loudspeakers.


    Original     		270MB ML670100 D-41460 MSM7731-02 P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A PDF

    QfJ20-P-S350

    Abstract: QFJ20PS3501
    Contextual Info: QFJ20-P-S350-1.27 Spherical surface 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数／改版日 エポキシ樹脂 Cu アロイ 半田メッキ(≥5µm) 0.59 TYP. 3 版/96.11.11


    Original     		QFJ20-P-S350-1 QfJ20-P-S350 QFJ20PS3501 PDF

    QFJ20-P-S350-1

    Contextual Info: QFJ20-P-S350-1.27 Spherical surface 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.59 TYP. 3/Nov. 11, 1996


    Original     		QFJ20-P-S350-1 PDF

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Contextual Info: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B PDF