MARKING B17 Search Results

B1772

Abstract: KTB1772
Contextual Info: SEMICONDUCTOR KTB1772 MARKING SPECIFICATION TO-92 PACKAGE 1. Marking method Laser Marking 2. Marking K 016 B1772 Y No. Item 1 KEC K 2 Lot No. 016 01.03.09 Marking Description KEC CORP. Year 0 ~ 9 : 2000~2009 16 Week 16 : 16th Week 3 Device Name B1772 KTB1772

D1700

Abstract: DS-323 DS323
Contextual Info: 237 KWIK-CHANGE*DESIGNATION STRIPS DOUBLE HEIGHT Kwik-Change Designation Strip DS311 (double height) DOUBLE HEIGHT DESIGNATION STRIPS Part No. DS311 DS312 DS313 Description Kit (double height) Includes: 1-mounting strip (17“ long) 1-cover 1-marking strip sheet

P6SBMJ24A

Abstract: B17C B14A A17a B14A equivalent MARKING A19c marking A32A P4SSMJ24A A12A a32a
Contextual Info: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS PLASTIC MATERIAL USED CARRIES UL 94V-0 TYPE Marking Break Down Voltage VBR V @ IZT Test Current Min Nom Max Volts Volts Volts @IT Working Peak Reverse Voltage Maximum Reverse Leakage Current Maximum Reverse Current

5800c

Abstract: bios programmer block diagram of crusoe processor TM5500-800 chip morphing TM5800 feature sdr sdram pcb layout TM5800 TM5800-733 TM5800-800
Contextual Info: TM5500/TM5800 Version 1.0 Data Book Crusoe Processors Described in this Document Processor SKU Memory Interface Package Marking L2 Cache Max Core Core Frequency Voltage Tj Max TDP DDR SDR TM5800-933 CoolRun80 DDR/SDR 5800C093310 512 KBytes 933 MHz 0.90-1.35 V

bios programmer

Abstract: sdr sdram pcb layout TM5800-1000-LP processor cross reference cdq42 5800P100021 5800R100021 TM5500 TM5800 16M X 32 SDR SDRAM
Contextual Info: TM5800 Version 2.1 Data Book Crusoe Processors Described in this Document Processor Memory Package Marking L2 Cache Max Core Frequency Core Voltage TM5800-1000-ULP CoolRun80 DDR/SDR 5800T100021 512 KBytes 1000 MHz TM5800-1000-VLP CoolRun80 DDR/SDR Tj Max TDP

B14A equivalent

Abstract: zener b14a P6SBMJ24A B17C tvs2315pt TVSS5VESPT diode B14A B14A zener equivalent A17a P4SSMJ24A
Contextual Info: SURFACE MOUNT DEVICES FOR HYBRID APPLICATIONS PLASTIC MATERIAL USED CARRIES UL 94V-0 Zener Voltage VZ V @ IZT TYPE Test current Working Peak Reverse Voltage IZT(mA) Vrwm(V) Marking Min Nom Max Volts Volts Volts Maximum Maximum Maximum Reverse reverse Reverse

block diagram of crusoe processor

Abstract: bios programmer SDR100 TM5800 TM58EL-800 crusoe "sdr sdram" design guideline TM58E SDR100 sdram dimm TM55EL-667
Contextual Info: Crusoe SE TM55E/TM58E Version 2.1 Data Book Crusoe SE Embedded Processors Described in this Document Processor SKU Memory Package Marking L2 Cache Max Core Core Frequency Voltage Temp Range TDP DDR SDR TM58EX-933 100°C DDR/SDR 58EXAE093321 512 KBytes 933 MHz

marking a86

Contextual Info: MN18R1624 8 DF0 MP18R1624(8)DF0 Revision History Version 1.0 (May 2003) - First Copy - Based on the 1.0 ver. (July 2002) 288Mbit D-die SO-RIMMTM Module Datasheet. Version 1.1 (Aug. 2003) - Add PGA type 144MB NexMod Module. - Add the discription of index pin marking.

MARKING A1600

Abstract: DS321
Contextual Info: PHONE: 773 792-2700 JACK PANELS X-WIDE VERTICAL DESIGNATION STRIPS DS353 X-WIDE VERTICAL DESIGNATION STRIPS Part No. DS321 DS322 DS323 DS350 DS351 DS352 DS353 Description For Panels Kit .75 x 1.75 inches includes: 2-mounting brackets 2-marking strips 2-covers

b72 voltage regulator

Abstract: marking A93 A75 marking code marking a86
Contextual Info: MN18R1624 8 DF0 MP18R1624(8)DF0 Revision History Version 1.0 (May 2003) - First Copy - Based on the 1.0 ver. (July 2002) 288Mbit D-die SO-RIMMTM Module Datasheet. Version 1.1 (Aug. 2003) - Add PGA type 144MB NexMod Module. - Add the discription of index pin marking.

B83 004

Abstract: marking a86 b72 voltage regulator
Contextual Info: MN18R162 4 8DF0 MP18R162(4)8DF0 Revision History Version 1.0 (May 2003) - First Copy - Based on the 1.0 ver. (July 2002) 288Mbit D-die SO-RIMM Datasheet. Version 1.1 (Aug. 2003) - Add PGA type 144MB NexMod. - Add the discription of index pin marking. - Correct the physical dimension of PGA NexMod.

BZX 48c 6v8

Abstract: PT2369 code Cj5 CMXZ11VTO 7006S
Contextual Info: M arking Codes Marking Code Part Number 04 04D 04A 04C 04S 040 1A 1A8 1AC 1B 1B8 1C8 1D8 1E 1E8 1F 1F8 1FF 1G 1G8 1H8 1J 1J8 1K 1K8 1L 1L8 1M8 1P 1PC 1QC 1RC 2AC 2B 2C 2C A 2F 2FC 2G 2 PC 2Q C 2P 3A 3AE 3B 3CE 3E 3F 3G 3J 3K 3L 3P 3SE 4A 4B 4C 4E 4F 4G 4P

B1100

Abstract: B180 sma marking CODE 63 SMB MARKING EX B170/B B170B B1100B B170 B180B B190
Contextual Info: B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER SPICE MODELS: B170 B180 B190 B1100 B170B B180B B190B B1100B Features • · · · · · · · Schottky Barrier Chip Guard Ring Die Construction for Transient Protection Ideally Suited for Automatic Assembly

marking code 63, sma package

Abstract: marking b1100 sma b1100 marking Sma marking CODE 63 B180
Contextual Info: SPICE MODELS: B170 B180 B190 B1100 B170B B180B B190B B1100B B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Features • · · · · · Schottky Barrier Chip · · High Temperature Soldering: 260°C/10 Second at Terminal Guard Ring Die Construction for Transient Protection

B1100 DIODES INC

Abstract: B180 63 marking, sma package diode B1100 B170/B B170B B1100B B170 B180B B190
Contextual Info: SPICE MODELS: B170 B180 B190 B1100 B170B B180B B190B B1100B B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Features • · · · · · Schottky Barrier Chip · · High Temperature Soldering: 260°C/10 Second at Terminal Guard Ring Die Construction for Transient Protection

B1100

Abstract: B180 sma marking 63 B1100B B170 B170B B180B B190 B190B
Contextual Info: SPICE MODELS: B170 B180 B190 B1100 B170B B180B B190B B1100B B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Features • · · · · Guard Ring Die Construction for Transient Protection · · High Temperature Soldering: 260°C/10 Second at Terminal

Sma marking CODE 63

Abstract: B170/B sma marking code 63 marking, sma package diode B1100/B SMA diode marking 79 J-STD-020D sma marking 63 B170 marking code 63, sma package
Contextual Info: B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Please click here to visit our online spice models database. Features • • • • • • • Mechanical Data • • Guard Ring Die Construction for Transient Protection Ideally Suited for Automated Assembly

B170/B

Abstract: marking code 63, sma package DSAE007156 B180
Contextual Info: B170/B - B1100/B Green 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Please click here to visit our online spice models database. Features Mechanical Data • • • • • • • • • • Guard Ring Die Construction for Transient Protection Ideally Suited for Automated Assembly

B180

Contextual Info: B170/B - B1100/B Green 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Please click here to visit our online spice models database. Features Mechanical Data • • • • • • • • • • Guard Ring Die Construction for Transient Protection Ideally Suited for Automated Assembly

B180

Contextual Info: B170/B - B1100/B Green 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Features Mechanical Data • • • • • • • • • • Guard Ring Die Construction for Transient Protection Ideally Suited for Automated Assembly Low Power Loss, High Efficiency

"marking nh"

Abstract: 1SMB10 1SMB10A 1SMB11 1SMB11A 1SMB12 1SMB12A 1SMB13 1SMB170 403A-01
Contextual Info: M O T O R O L A SC D IOD ES / OP T O 5SÉ b3L7555 DDÒIBET □ J> MOTOROLA Order this data sheet by 1SMB5.Ô/D T - a - 2 3 SEMICONDUCTOR piivjì TECHNICAL DATA 1SMB5.0, A Zener O vervoltage Transient Su p p re sso rs thru 1SM B170, A . . . this device is designed specifically for transient voltage suppression. The wide leads

Contextual Info: Extract from the online catalog EMG 90-B17 Order No.: 2946269 Custom circuit module, consisting of housing, MKDS 3 connection terminal blocks and PCB Product notes WEEE/RoHS-compliant since:

Contextual Info: Extract from the online catalog EMG 90-B17 Order No.: 2946269 Custom circuit module, consisting of housing, MKDS 3 connection terminal blocks and PCB Product notes WEEE/RoHS-compliant since:

B180

Contextual Info: B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER SPICE MODELS: B170 B180 B190 B1100 Features • · · · · · · · Schottky Barrier Chip Guard Ring Die Construction for Transient Protection Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency