144MB Search Results

HR128E08B

Abstract: HR128E08C HR128E08D HR128E08E HR128N08C HR128N08D HR128N08E
Contextual Info: 128 MB RIMMTM Module with 128/144Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.

da53

Abstract: HY5R128HC745 HY5R128HC840 HY5R128HC845 HY5R144HC653 HY5R144HC745 HY5R144HC840 HY5R144HC845 HY5R144HM745 HY5R144HM845
Contextual Info: Direct RDRAM 128/144Mbit 256Kx16/18x32s Preliminary Overview The Rambus Direct RDRAM™ is a general purpose highperformance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any other application where high bandwidth and

144MB

Abstract: B641 High Connection Density
Contextual Info: 64MB SO-RIMMTM Module with 128/144 Mb RDRAMs Direct Rambus SO-RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus SO-RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and

Contextual Info: Preliminary GS81302T08/09/18/36E-375/350/333/300/250 144Mb SigmaDDRTM-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaDDR Interface • Common I/O bus

GS81302D36E-250

Contextual Info: GS81302D08/09/18/36E-375/350/333/300/250 144Mb SigmaQuadTM-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: GS81302T08/09/18/36E-375/350/333/300/250 144Mb SigmaDDRTM-II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaDDR Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: Preliminary GS81302S08/09/18/36E-333/300/250/200/167 144Mb Burst of 2 DDR SigmaSIO-II SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 4M x 36Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package

TOP SIDE MARKING OF MICRON

Abstract: MT6V8M16F-4C MT6V8M16F1-3B MT6V8M16F1-3M MT6V8M16F1-4C MT6V8M18F1-3B MT6V8M18F1-3M MT6V8M18F1-4C ctm 512
Contextual Info: ADVANCE 128Mb/144Mb: 8 MEG x 16/18 RDRAM RAMBUS DRAM MT6V8M16 - 256K x 16 x 32 banks MT6V8M18 - 256K x 18 x 32 banks For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES FBGA Top View • High-speed 300 MHz, 356 MHz, and 400 MHz

Contextual Info: Preliminary GS81302T07/10/19/37E-400/375/333/300 144Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–300 MHz 1.8 V VDD 1.8 V or 1.5 V I/O Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaDDR Interface

Contextual Info: Preliminary GS81302D19/37E-400/375 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 400 MHz–375 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS8128418/36B-250/200/167 119-BGA Commercial Temp Industrial Temp 8M x 18,4M x 36 144Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

GS81302D36E-250

Contextual Info: GS81302D08/09/18/36E-375/350/333/300/250 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O 144Mb SigmaQuadTM-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features Clocking and Addressing Schemes • Simultaneous Read and Write SigmaQuad Interface

Contextual Info: Preliminary GS81302S08/09/18/36E-333/300/250/200/167 144Mb SigmaSIOTM DDR -II Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–167 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaSIO Interface • JEDEC-standard pinout and package

Contextual Info: Preliminary GS81284Z18/36B-xxxV 119-Bump BGA Commercial Temp Industrial Temp 144Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT No Bus Turn Around functionality allows zero wait Read-Write-Read bus utilization; fully pin-compatible with

Contextual Info: GS81302R08/09/18/36E-375/350/333/300/250 144Mb SigmaDDRTM-II Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp 375 MHz–250 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features • Simultaneous Read and Write SigmaDDR Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: GS81302T07/10/19/37E-450/400/350/333/300 144Mb SigmaDDRTM-II+ Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 Clock Latency • Simultaneous Read and Write SigmaDDR Interface • Common I/O bus • JEDEC-standard pinout and package

Contextual Info: GS8128418/36B-xxxV 119-Pin BGA Commercial Temp Industrial Temp 8M x 18, 4M x 36, 144Mb S/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS81302QT07/10/19/37E-318/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

Contextual Info: GS81302Q07/10/19/37E-318/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

Floppy connector 34 pin IDC to usb

Abstract: NE2000 port/PS-2-2000F
Contextual Info: HAWK HAWK HAWK HAWK HAWK Supports Intel Pentium and AMD CPUs up to 233MHz MMX Up to 256MB DRAM 256 or 512KB L2 Cache COAST 0-144MB Flash options (DiskOnChip) Up to 512KB SRAM PCI Local Bus SVGA for LCD and CRT 800x600, 1024x768, 1280x1024 resolutions

da53

Abstract: DB26 KM416RD8AC KM418RD8AC
Contextual Info: KM416RD8AC D /KM418RD8AC(D) Direct RDRAM 128/144Mbit RDRAM 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM Revision 1.01 October 1999 Page -2 Rev. 1.01 Oct. 1999 KM416RD8AC(D)/KM418RD8AC(D) Direct RDRAM™ Revision History Version 1.0 (July 1999) - Preliminary

SAMSUNG MR18R162GMN0

Abstract: A76 MARKING CODE MR18R162GMN0-CK8
Contextual Info: MR16R1624 6/8/C/G MN0 MR18R1624(6/8/C/G)MN0 Change History Version 0.9 (January 2000) - Preliminary * First copy. * Based on the 1.02ver 128/144Mbit RDRAMs base RIMM Datasheet Version 1.0 (October 2000) - Preliminary * Based on the 1.0ver Rambus 256/288Mb RDRAMs base RIMM datasheet

CQ 1265

Abstract: AN1021
Contextual Info: GS81302QT07/10/19/37E-333/300/250/200 144Mb SigmaQuad-II+TM Burst of 2 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features • 2.0 clock Latency • Simultaneous Read and Write SigmaQuad Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface

direct rdram

Contextual Info: ADVANCE M l^ P n iv r I 144Mb: 8 MEG X 18 DIRECT RDRAM MT6V8M18 - 256K x 18 x 32 banks DIRECT RAMBUS c™ DRAM n o a nil For the latest data sheet, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • High-speed 300 MHz and 400 MHz clocks with 2x data