DS3816 Search Results

AN2077

Abstract: APP2077 DS2065W DS3802 DS3832 Using nvsRAM in RAID Controller Applications
Contextual Info: Maxim > App Notes > Memory Keywords: RAID, NVSRAM, NVRAM, NVSRAMs, NV SRAMs, DS3816, DS3832, RAID controller, cache, flash May 30, 2003 APPLICATION NOTE 2077 Using Dallas Semiconductor NV SRAMs in RAID Applications Abstract: Dallas Semiconductor's, a wholly owned subsidiary of Maxim Integrated Products, NV SRAMs, such

DS3802

Abstract: DS3816C-512
Contextual Info: DS3816C-512 16Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 5V operation ±10% Surface-mount NV RAM BGA module construction 512k x 32 NV SRAM memory space and separate 64 x 8 real-time clock memory

50/DA5807

Contextual Info: GEC PLESSEY S F m I ( \ L> 1/ C f O K S DS3816-1.2 DA5807 MICROWAVE DOPPLER VEHICLE ALARM SENSOR FOR CENTRAL VEHICLE MOUNTING The DA5807 car alarm sensor is a microwave doppler movement detector working at 2.45GHz. It is designed to be mounted in the centre of the vehicle and gives coverage of the

DS2030AB

Abstract: DS2030L DS2030W DS2030Y DS2045AB DS2045L DS2045W DS3802 Using nvsRAM in RAID Controller Applications
Contextual Info: Maxim > App Notes > Memory Keywords: RAID, NVSRAM, NVRAM, NVSRAMs, NV SRAMs, DS3816, DS3832, RAID controller, cache, flash May 30, 2003 APPLICATION NOTE 2077 Using Dallas Semiconductor NV SRAMs in RAID Applications Abstract: Dallas Semiconductor's, a wholly owned subsidiary of Maxim Integrated Products, NV SRAMs, such

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

A7W 34

Abstract: a7w 20 DS146 a7w 9 ds1480 ds1216 ds2503 DS1722 DS1671 AC501
Contextual Info: RMP Process Samples 0.8 µm 0.6 µm Double Poly, Double Metal 0.8 µm Rev DS80CH10 A3 A2 DS21352 A4 A5 Product Rev DS1722 A2 DS1722 A4 DS1775 A1 DS1775 A2 DS1820 B5 DS1820 B5 DS1820 B6 DS1822 B6 DS1822 B6-PA DS1847 B1 DS1848 B1 DS21352 A3 DS21352 A4 DS21354

DS1868

Abstract: DS1207 MUBW20-12 A7 DS2505 DS1640
Contextual Info: RMP Process Samples 0.8 µm Double Poly, Double Metal Monitor Device s Product DS2154 DS2152 A2 DS2154 A2 DS80CH10 A3 DS80CH10 A5 0.6 µm A2 DS32KHZ A6 Double Poly, Double Metal (Ti/TiN layers used on all Metals) Product 0.6 µm Rev Rev DS1722 A2 DS1775 A1

Contextual Info: RELIABILITY MONITOR DS1230Y-100 JAN '01 MONITOR DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 A1-Y 0045 720 305435 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 26427 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 26428 PHYSICAL DIMENSIONS MIL-STD-883-2016

max14574

Abstract: MAX1786 MAX1788 MAX8899 DS1849 MAX16908 MAX4967 DS3610 max17018 max13487
Contextual Info: Monitor Reports by Product: 1. Find the product of interest in the table below. Note the process and/or package for that product. 2. Use the "Back" button to return to the home page. 3. Select the process in the "Process Reliability" for the product of interest.

25814

Contextual Info: RELIABILITY MONITOR DS1230Y-200 APR '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-Y 0005 720 118511 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25412 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 25413 PHYSICAL DIMENSIONS MIL-STD-883-2016

A6W 37

Abstract: A7W 14 a7w 16 a7w 37 A7W 34 A7W 29 ds1480 a4w 29 DS1868 DS1722
Contextual Info: RMP Process Samples 0.6 µm Standard Process Monitor Device s DS21Q43 A3-A Friday, December 28, 2001 Product DS2401 C2 Rev DS12885 B1 DS12885 B1-C DS12887 A2-C DS1425 F1 DS1425 F2 DS1501 A4-Y DS1501 A6-W DS1501 A6-Y DS1511 A6-W DS1511 DS1553 A6-Y A1 DS1543

hyundai

Abstract: DS2228 DS1246 dallas date code DS1556 On semiconductor date Code ON SEMICONDUCTOR TRACEABILITY DS1248 DS1251 DS1486
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: July 31, 2000 Subject: PRODUCT CHANGE NOTICE – G003104 Description: New Qualified RAM Supplier for 1MEG and 4MEG Modules and SIPSTIK’s Hyundai.

DS2228

Abstract: DS1650 CY62148 CY62148V DS1251 DS1254 DS1557 DS1747 DS2229
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: July 31, 2000 Subject: PRODUCT CHANGE NOTICE – G003103 Description: New Qualified RAM Supplier for 4MEG Modules and SIPSTIK’s - Cypress.

reflow temperature rohs bga

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

DS1868

Abstract: DS2433 ds1480 DS2505 DS1640
Contextual Info: RMP Process Samples 0.8 µm 0.6 µm Double Poly, Double Metal Product Rev DS32KHZ A6 DS80CH10 A5 Rev DS1232 C2-L DS1722 A2 DS1775 A1 DS1775 A2 DS1820 B5 DS1820 B5 DS1820 B6 DS21352 A3 DS21352 A4 DS21354 A1 DS21354 A4 DS2148 A2 DS21552 A3 DS21552 A4 DS21554

dallas date code ds1230

Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00

2-5779

Contextual Info: RELIABILITY MONITOR DS1230AB-200 JUL '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-A 0019 720 117143 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25775 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 2 2 25776 PHYSICAL DIMENSIONS MIL-STD-883-2016

dallas date code ds1230

Abstract: dallas ds1230 25919 DS1230
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:

25821

Abstract: dallas date code ds12887 25854
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC

DALLAS CAP

Abstract: DS3802 DS3832C-311 nv sram
Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

a7w 9

Abstract: A7w 12 a7w 20 A7w 50 DS2503 DS-1100 DS29020 A6W 08 DS1624 DS1868
Contextual Info: RMP Process Samples 0.8 µm 0.6 µm Double Poly, Double Metal 0.8 µm Rev DS80CH10 A3 A2 DS21352 A4 A5 Product Rev DS1722 A2 DS1775 A1 DS1775 A2 DS1820 B5 DS1820 B5 DS1820 B6 DS21352 A3 DS21352 A4 DS21354 A1 DS21354 A4 DS2148 A2-3 DS2148 A2-5 DS21552 A3 DS21552

Cisco Toaster

Abstract: "Audio Volume Control" DS1615 DS1845 DS1921 DS2148 DS80C390 mostek system development board CISCO 4506
Contextual Info: DS CORPORATE INFORMATION Page 1 CORPORATE PROFILE • JANUARY 2001 Business Overview Quarterly Net Sales Dallas Semiconductor designs, manufactures and markets a broad line of mixed-signal, specialty semiconductors. The Company combines proprietary fab and circuit technologies to create

nv sram

Abstract: Using nvsRAM in RAID Controller Applications DS3802 DS3832C-311 access time embedded sram dallas sram lithium
Contextual Info: Application Note 2077 Using Dallas Semiconductor NV SRAMs in RAID Applications www.maxim-ic.com INTRODUCTION RAID Redundant Array of Independent Disks consists of multiple hard drives in one system that appear like a single drive. The multiple drives provide better performance and fault tolerance than single drive systems.