DS3801 Search Results

CT3513-1

Abstract: MV3010 PCBAN111 MV30101 SCAMP
Contextual Info: THIS DOCUMENT IS FOR MAINTENANCE PURPOSES ONLY AND IS NOT RECOMMENDED FOR NEW DESIGNS CT3513-1 ADVANCE INFORMATION DS3801-1.0 PCBAN111 MV3010-1 SLAC EVALUATION PACKAGE Now available from GPS is a complete evaluation package for the MV3010-1 Subscriber Line Audio Circuit SLAC . The

Contextual Info: RELIABILITY MONITOR DS1230Y-100 JAN '01 MONITOR DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 A1-Y 0045 720 305435 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 26427 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 26428 PHYSICAL DIMENSIONS MIL-STD-883-2016

25814

Contextual Info: RELIABILITY MONITOR DS1230Y-200 APR '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-Y 0005 720 118511 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25412 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 25413 PHYSICAL DIMENSIONS MIL-STD-883-2016

DS3802

Abstract: DS3816C-512
Contextual Info: DS3816C-512 16Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 5V operation ±10% Surface-mount NV RAM BGA module construction 512k x 32 NV SRAM memory space and separate 64 x 8 real-time clock memory

dallas date code ds1230

Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS1620 D1 JUN '01 27096 0109 CPS ChipPac, China DH046190AAI SOIC 50 50 DS1869 A3 JUN '00

2-5779

Contextual Info: RELIABILITY MONITOR DS1230AB-200 JUL '00 Monitor DEVICE REVISIO DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1230 B1-A 0019 720 117143 28 Module w/SMT Fastech JOB_NO DESCRIPTION CONDITION 25775 SOLDERABILITY MIL-STD-883-2003 TOTAL: 3 2 2 25776 PHYSICAL DIMENSIONS MIL-STD-883-2016

dallas date code ds1230

Abstract: dallas ds1230 25919 DS1230
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 DE940040AAC SOIC A7 MAR '00 25224 9950 OSEP PACKAGE READ POINT QTY FAIL 50 50 RELIABILITY MONITOR STRESS:

DF 331 TRANSISTOR

Contextual Info: MOTOROLA sc -c xstrs /r f > 13E D I t,3 b ? E S 4 □Df l TSt . T T -n -ty 1 | Order this data sheet by MG100BZ100/D MOTOROLA I SEMICONDUCTOR • 8 9 TECHNICAL DATA MG100BZ100 Isolated Gate Bipolar Power Transistor Module Energy M anagem ent Series D U A L N-CH ANN EL

Contextual Info: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and

DS3802

Abstract: DS3832C-311 DS3801
Contextual Info: DS3832C-311 3.3V, 32Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 3.0V to 3.6V operation Surface-mount nonvolatile NV RAM ball-grid array (BGA) module construction 1024k x 32 NV SRAM memory space and

25821

Abstract: dallas date code ds12887 25854
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 MAR '00 25224 9950 OSEP DE940040AAC SOIC 50 50 DS1869 A3 JUN '00 25547 0017 CPS ChipPac, China DH833210AAB SOIC