A0311 Search Results
A0311 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| RJE741AA0311A |
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Modular Jack - Single Port, 10P10C, Vertical, THR, No Shield, No LEDs, RMK4 Keying | |||
| RJE741AA0311 |
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Modular Jack - Single Port, 10P10C, Vertical, THT, No Shield, No LEDs, RMK4 Keying | |||
| G880A031131THR |
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Board mount - Header Plug - Wire to Board 1.25mm Pitch Vertical,Dip,1x3Pin,Matte Tin,NY4T,TAIL=3.0mm,Color-White | |||
| RJE741AA0311H |
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Modular Jack - Single Port, 10P10C, Vertical, THR, No Shield, No LEDs, RMK4 Keying | |||
| RJE051AA0311 |
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Modular Jack - 10P10C, Right Angle, Single Port, Without Shield, No LEDs |
A0311 Price and Stock
TE Connectivity 44A0311-12-3CK0202/144A0311-12-3CK0202/1 |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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44A0311-12-3CK0202/1 | 2,110 | 21 |
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44A0311-12-3CK0202/1 | 1,393 | 20 |
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Amphenol Corporation G880A031131THRConnector: wire-board; male; data; 1A; PIN: 3; pick and place |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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G880A031131THR | 1,000 | 229 |
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G880A031131THR | 660 | 2,500 |
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Abracon Corporation ATCA-03-111M-HInductor: wire; THT; 110uH; ±20%; 24x11.5mm; Leads: radial; Ø: 24mm |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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ATCA-03-111M-H | 500 | 175 |
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ATCA-03-111M-H | Bulk | 443 | 1 |
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Buy Now | |||||
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ATCA-03-111M-H | 14 Weeks | 2,000 |
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ATCA-03-111M-H | 1 |
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Kingbright SA03-11EWADisplay: LED; 7-segment; 7.62mm; 0.3"; No.char: 1; red; 1.9÷6.4mcd |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SA03-11EWA | 351 | 1 |
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Buy Now | ||||||
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SA03-11EWA | 282 |
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SA03-11EWA | 17 Weeks | 260 |
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Get Quote | ||||||
Abracon Corporation ATCA-03-111M-VInductor: wire; THT; 110uH; 4A; ±20%; Leads: radial; iron powder |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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ATCA-03-111M-V | 257 | 88 |
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ATCA-03-111M-V | Tray | 12 Weeks | 2,000 |
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ATCA-03-111M-V | Bulk | 45 |
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Buy Now | ||||||
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ATCA-03-111M-V | 14 Weeks | 2,000 |
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ATCA-03-111M-V | 1 |
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Buy Now | |||||||
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ATCA-03-111M-V |
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A0311 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
power supply ic 1507
Abstract: MWA0370
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OCR Scan |
mwa0311mwa0311la0304a0311l+3 | |
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Contextual Info: < 111 SMT a0311 5" H m m SPECIFICATIONS D E Hn Choice of post heights Mates with: CLE FTE SERIES Low profile 1,70mm) .067" For complete specifications see www.samtec.com?FTE Insulator Material: Black Liquid Crystal Polymer T O P OPTION Terminal Material: |
OCR Scan |
a0311100ps1-800-samtec-9 | |
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Contextual Info: NECES001 C P20K 0 .8 -M IC R O N NEC Electronics Inc. fpgas February 1993 Description Figure 1. CP20K FPGAs NEC Electronics Inc. and Crosspoint Solutions, Inc. have joined forces to offer to system designers an expedient way to prototype in Field Programmable Gate Arrays |
OCR Scan |
neces001cp20kram8x16ram16x16+5 | |
2.2NFContextual Info: MAINS FILTERS Base Mounting and Bulkhead BASE MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating ᔢ 3 Alternative Circuits ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs Base Mounting PS02/A BULKHEAD MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating IEC CONNECTORS |
Original |
ps02/aps03/aps03/axxps02/a011x/xxxx+5 | |
VN0104Contextual Info: Supertex inc. VN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
vn0104a031110 | |
HV57708Contextual Info: Supertex inc. HV57708 Die Specification Pad Layout 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 0,0 23 42 22 43 21 44 20 45 19 46 18 47 17 48 16 49 15 50 14 51 13 52 12 53 11 54 10 55 9 56 8 57 7 58 6 59 5 60 4 61 3 62 2 63 1 64 65 80 79 78 77 76 75 |
Original |
hv57708a031110 | |
81 221
Abstract: HV583 HVOUT116
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Original |
hv583123inglya03111081 221+1 | |
VN0109Contextual Info: Supertex inc. VN0109 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0109 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
vn0109a031110 | |
HV514
Abstract: Bl 370
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Original |
hv514a031110bl 370 | |
inkjet module
Abstract: piezoelectric transducer printer inkjet ultrasound transducer circuit driver HV2301 HV2301FG-G HV2301PJ-G HV232
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Original |
hv2301hv232a031109inkjet module+4 | |
B101xContextual Info: Netzfilter Netzfilter Dieses umfassende Sortiment, das für die Reduzierung leitungsgeführter EMS entwickelt wurde, bietet viele Lösungen für das EMS-Problem. Um individuellen Konstruktionsanforderungen zu entsprechen, sind die Filter mit drei Dämpfungsoptionen erhältlich - Standard, Hochleistung |
Original |
px0587pz0100px0587/sepx0588+5 | |
INTEL 87C196 USER MANUAL
Abstract: intel 87C196 PROGRAMMER GUIDE INSTRUCTION RF 300eh 87C196 Assembler Users guide 270646 intel 8XC196 PROGRAMMER GUIDE INSTRUCTION A3055 8xc196 programming support C814 RF 300CH
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Original |
8xc196ntindex-15intel 87c196 user manualintel 87c196 programmer guide instruction+8 | |
RESISTOR VDR
Abstract: a0311 PS-02
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Original |
ps02/aps03/aps03/axxps02/axxxx/xx+6 | |
2.2NFContextual Info: MAINS FILTERS Base Mounting and Bulkhead BASE MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating ᔢ 3 Alternative Circuits ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs Base Mounting PS02/A BULKHEAD MOUNTING ᔢ 1, 3, 6 or 10 Amp Current Rating IEC CONNECTORS |
Original |
ps02/aps03/aps03/axxps02/a011x/xxxx+5 | |
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Contextual Info: B TO^GìKratio ' zijja®; B aoD iE coasE \ Base Mounting PS02/A Bulkhead Mounting PS03/A Series N* 1 f —f Hoeo^i Cx Oc L *— R R I VDR, 1— L/C Circuit Additional Version Components XX X l A = Ol Ver 1 = 1 PS02/A 3 A = 03 Ver 2 = 2 PS 03/A 6 A = 06 |
OCR Scan |
ps02/aps03/aps02/axxxx/xx50-400hz+4 | |
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Contextual Info: SPM3314 Ordering number : A0311 SPM3314 RF SPDT Switch MMIC Features • • • • • Ultrasmall package ECSP . Middle power (Pin0.1dB=29dBm). Low insertion loss. Control voltage +2.7 / 0V. High isolation. Specifications Absolute Maximum Ratings at Ta=25°C |
Original |
spm3314ena031129dbma0311-3/3+1 | |
TN0110Contextual Info: Supertex inc. TN0110 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0110 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn0110a031110 | |
TN0104Contextual Info: Supertex inc. TN0104 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0104 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn0104a031110 | |
HV9808Contextual Info: Supertex inc. HV9808 Die Specification Pad Layout 11 12 13 14 15 16 17 18 19 20 21 22 10 23 9 24 8 25 7 26 6 27 5 28 4 29 3 30 2 31 1 0,0 41 40 39 38 37 36 35 34 32 33 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal |
Original |
hv9808a031110 | |
VN0606Contextual Info: Supertex inc. VN0606 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0606 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
vn0606a031110 | |
HV57009Contextual Info: Supertex inc. HV57009 Die Specification Pad Layout 0,0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 37 39 40 41 42 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 43 56 55 54 |
Original |
hv57009a031110 | |
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Contextual Info: Supertex inc. DN1509 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) DN1509 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
dn1509a031110 | |
LP0701Contextual Info: Supertex inc. LP0701 Die Specification Pad Layout 1 2 3 0,0 Backside: Drain Die Specifications Die Dimensions Device Length1 Width1 Thickness (mils) Back Side Metal 50 70 11 ± 1.5 None (mils) LP0701 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si |
Original |
lp0701a031110 | |
TN0106Contextual Info: Supertex inc. TN0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) TN0106 1 (mils) Back Side Bonding Pad Material Drain Al/Cu/Si Bonding Pad Description |
Original |
tn0106a031110 | |