A022 Search Results

Contextual Info: Advanced Control Com ponents 20 MERIDIAN ROAD EATONTOWN, N.J. 07724 PHONE: 732 460-0212 FAX: (732)460-0214 W W W.ADVANCED-CONTROL.COM Inc. PRODUCT SPECIFICATION PART NUMBER: ACDL-A022 DESCRIPTION: DETECTOR LOG VIDEO AMPLIFIER, DC COUPLED & CW IMMUNE FREQUENCY RANGE:

Contextual Info: Issue No. ： 12-SWDW-A022 October 30, 2012 Date of Issue ： Classification ： • New □ Change For General Distribution PRODUCT SPECIFICATION FOR APPROVAL Product Description Customers Part Number Product Part Number Country of Origin

Contextual Info: Protection Relays & Controls ARC Detectors A0220 Description Arc Detecting Point Sensor The A0220 Arc Detector is a photo electric sensor. It has a sensitive area of 180˚. Sensor signal is a mA current signal of 0.5 mA / klux. The sensor includes 10 m of shielded

Contextual Info: N AMER PHILIPS/DISCRETE 2SE D • bb53T31 a022b51 fi ■ BYV79 SERIES A 7 1 0 3 - 1 7 ULTRA FAST RECOVERY RECTIFIER DIODES Glass-passivated, high-efficiency epitaxial rectifier diodes in plastic envelopes, featuring low forward voltage drop, ultra fast reverse recovery times with very low stored charge and soft-recovery

i800

Abstract: 97-0008 3069B 27i0
Contextual Info: 10 N o. OF ENG. No. PART No. CCTS. I0 3069-A02 -A022 -A03 -A032 -A04 -A042 -A05 -A052 -A06 -A062 -A07 -A072 -A08 -A082 -A09 -A092 -A 10 -AI02 -All -A II2 I2 I3 I4 I5 I6 IT I8 I9 20 - AI 2 -AI22 -AI3 -AI32 -AI4 -AI42 -AI5 -AI52 -AI6 -AI62 -AI7 -AI72 - AI 8

7408, 7404, 7486, 7432

Abstract: RF400U functional diagram of 7400 and cd 4011 ls 7404 180 nm CMOS standard cell library TEXAS INSTRUMENTS 74191 4BITS s273 buffer 74374 7408 CMOS cmos 7404
Contextual Info: TGC100 Series CMOS Gate Arrays RELEASE 3.0, REVISED JANUARY 1990 • Twelve Arrays with up to 26K Available Gates • Fast Prototype Turnaround Time • Extensive Design Support - Design Libraries Compatible with Daisy, Valid, and Mentor CAE Systems - Tl Regional ASIC Design Centers

Contextual Info: DRAW ING No.: M 4 0 - 4 0 1 IF IN D O U BT - A S K XX 4 6 R X B +0.20— NOT TO S C A LE 1 6 + 0 .0 5 .0+0.05 i LO o o +l LO O +l O CIRCUIT 1 0. 20 PHOSPHOR BRONZE SEMI-GLOSS TIN t LO <o o +1 -X2.Ç 0 .7 + 0 .0 5 - GO r A d 1.2+0.05- PCB LAYOUT ro X d X NO. OR

M40-4010446R

Abstract: M40-4012046R 40113 M40-4010346R M40-4010546R M40-4010646R M40-4010746R M40-4010846R M40-4011046R 401104
Contextual Info: DRAWING No.: M40-401 IF IN DOUBT - ASK XX 46R NOT TO SCALE THIRD ANGLE PROJECTION ALL DIMENSIONS IN mm -1.0±0.05 1.5 REF- -0.6+0.05 SPECIFICATIONS: Y LO o LO MATERIAL: - Y O LO LO MOULDING: NYLON 9T, U L94V-0 CONTACT: PHOSPHOR BRONZE, T=0.2MM o FINISH:—

VN10K

Contextual Info: VN10K Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN10K 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si

2N7000

Contextual Info: 2N7000 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7000 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain

TN2124

Contextual Info: TN2124 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2124 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain

R5F5631

Abstract: R5F563NBDDFP A083H RX631 100-6 p86 A161H ir127 capacitor PMR 202 DM IPR200 c04f
Contextual Info: Features RX63N Group, RX631 Group Renesas MCUs R01DS0098EJ0100 Rev.1.00 Jun 13, 2012 100-MHz 32-bit RX MCU, on-chip FPU, 165 DMIPS, up to 2-MB flash memory, Ethernet MAC, full-speed USB 2.0 host/function/OTG interface, various communications interfaces including CAN, 10- & 12-bit A/D

Contextual Info: NECES001 C P20K 0 .8 -M IC R O N NEC Electronics Inc. fpgas February 1993 Description Figure 1. CP20K FPGAs NEC Electronics Inc. and Crosspoint Solutions, Inc. have joined forces to offer to system designers an expedient way to prototype in Field Programmable Gate Arrays

EM78

Abstract: UIT660N elan EM78 EM78813 Usb m015 a006 c8051 microcontroller Workout 0X00 EM78815
Contextual Info: EM78 Series Microcontrollers INTEGRATED DEVELOPMENT ENVIRONMENT USER’S GUIDE Doc. Version 1.0 Applicable to eUIDE Version 1.0 & later ELAN MICROELECTRONICS CORP. October 2009 Trademark Acknowledgments IBM is a registered trademark and PS/2 is a trademark of IBM.

R5F51115AGFL

Abstract: R5F51113ADNF R5F51113ADFM
Contextual Info: Datasheet RX111 Group Renesas MCUs 32 MHz 32-bit RX MCUs, 50 DMIPS, up to 512 Kbytes of flash memory, USB 2.0 full-speed host/function/OTG, up to 6 comms channels, 12-bit A/D, 8-bit D/A, RTC R01DS0190EJ0120 Rev.1.20 Sep 29, 2014 Features • 32-bit RX CPU core

Contextual Info: User’s Manual 32 Cover RX630 Group User’s Manual: Hardware RENESAS 32-Bit MCU RX Family / RX600 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

Contextual Info: HV20822 16-Channel High Voltage Analog Switch Features ► ► ► ► ► ► ► ► ► General Description HVCMOS technology for high performance 220V operating conditions Output on-resistance typically 22Ω 5.0V and 12.0V CMOS logic compatibility Very low quiescent current consumption 10µA

IS49NLS18320

Contextual Info: IS49NLS96400,IS49NLS18320 576Mb x9, x18 Separate I/O RLDRAM 2 Memory ADVANCED INFORMATION FEBRUARY 2012 FEATURES • • • • • • • • • 533MHz DDR operation (1.067 Gb/s/pin data rate) 38.4 Gb/s peak bandwidth (x18 Separate I/O at 533 MHz clock frequency)

BVA16

Abstract: BZV15 cx fuse A0420
Contextual Info: POLYSNAP POWER INLET MODULES C14 Inlet Twin Fuse - Standard Filter EMI FILTER OPTIONS ᔢ For Polysnap modules BZV15, BZV16, BZH13, BZH14, BZH15, BZH16, BZH21, BZH22, BVA15, BVA16, BVB15, BVB16 ᔢ PF0033 style twin fuse IEC inlet ᔢ Using PS26/A filter

15nf

Abstract: PS25 PX0587 PX0588
Contextual Info: FiltersSection - 2010:FiltersSection - 2010 8/6/10 16:57 Page 142 MAINS FILTERS IEC Power Inlets Flange and Snap Fit Twin Fused PANEL MOUNTING ᔢ 2 or 4 Amp Current Rating ᔢ Twin Fused ᔢ Optional Additional Components ᔢ 2.8 or 6.3mm tabs PS25/A SNAP FIT

HY53C464LS

Abstract: HY53C464F hy53c464 hy53c464lf HY53C464LF70 HY53C464S An-313
Contextual Info: HY53C464 Seríes " H Y U N D A I 64K X 4-bit CMOS DRAM DESCRIPTION Hie HY53C464 is fast dynamic RAM organized 65,536 x 4-bit. The HY53C464 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.

Contextual Info: White Electronic Designs W78M32V-XBX ADVANCED* 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operations Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

10001000XXX

Abstract: PWA with 555 W78M32V-XBX SA139-SA142 SA175-SA178 SA187-SA190 SA163-SA166
Contextual Info: White Electronic Designs W78M32V-XBX 8Mx32 Flash 3.3V Page Mode Simultaneous Read/Write Operation Multi-Chip Package FEATURES Access Times of 70, 90, 100, 120ns Unlock Bypass Program command Packaging • 159 PBGA, 13x22mm – 1.27mm pitch • Reduces overall programming time when issuing

Contextual Info: TP2435 P-Channel Enhancement Mode Vertical DMOS FETs Features General Description This low threshold enhancement-mode normally-off transistor utilizes a vertical DMOS structure and Supertex’s well-proven silicon-gate manufacturing process. This combination produces a device with the power handling