CDN055 Search Results

Cdn055

Contextual Info: L CDN055 CDP055 CDN055, CDP055 NPN POWER TRANSISTOR PNP POWER TRANSISTOR General Purpose Switching and Amplifier Applications DIM A B C E F G H J K L M MIN MAX 39,37 22,22 8,50 6,35 1.09 0,96 1.77 29,90 30,4 10,69 11,18 5,72 5,20 16,64 17,15 11,15 12,25 26,67

CDN055

Abstract: CDP055
Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company CDN055 NPN CDP055 PNP SILICON PLANAR POWER TRANSISTORS TO-3 Metal Can Package ABSOLUTE MAXIMUM RATINGS DESCRIPTION SYMBOL VALUE UNITS Collector Base Voltage VCBO 50

Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company CDN055 NPN CDP055 PNP SILICON PLANAR POWER TRANSISTORS TO-3 Metal Can Package ABSOLUTE MAXIMUM RATINGS DESCRIPTION SYMBOL VALUE UNITS Collector Base Voltage VCBO 50

CSD200

Contextual Info: Maximum Rating« Type No. vCBO Electrical Characteristics TasîS'C, Unless Otherwise SpecHlad v CEO vEBO (V) (V) Min Min PD !C (A) (W) Min «Tc=25°c (V) kæo (MA) Max Vcb 9<V) •ces <mA) e VCE 0 (V) Min Max ic (mA) 1 5 1.5 3 1.4 1.6 * 2.5 4 6 200 25 1

BU2080

Contextual Info: TO-3 Power Package Transistors NPN Electrical Characteristics (Ta=25'C, Unless Otherwise Specified) Maximum Ratings Type No. V CBO V C E0 (V) Min (V) Min 1500 800 2SD1168P Pd 'c VebO (W) (A) (V) Min 0Tc=25°c 5 50 !cbo (PA) Max V CB @ (V) hpE 1000 1500 9

BDY38

Abstract: 2N3055HV BDY20 BU326A 2N3055 bu326 2N3773 2N4347 2N6253 2N6257
Contextual Info: Continental Device India Limited An ISO/TS 16949, ISO 9001 and ISO 14001 Certified Company TO-3 Metal Can Package 3 All dimensions are in mm. PIN CONFIGURATION 1. BASE 2. EMITTER 3. COLLECTOR 2 1 TO-3 Power Package Transistors NPN Maximum Ratings Type No.

BDY38

Abstract: BDY55 2N305S 2N3773 CDIL BDY20 2N3055 2N3773 2N4347 2N6257 2N6371
Contextual Info: TO-3 DIM A B C D E F G H J K L M t. r'i 0 —4 1 - MIN MAX 39,37 22,22 8,50 1.09 1.77 30,4 11,18 5,72 17,15 12,25 26,67 4,19 - 6,35 0,96 29.90 10,69 5,20 16,64 11,15 - 3,84 PIN CONFIGURATION 1. BASE 2. EMITTER 3. COLLECTOR ALL DIMENSIONS ARE IN M.M. TO-3 Power Package Transistors NPN

BU208D

Abstract: BU208 BU208A 2SD870 BDY38 BOY20 BU2080 2SC1942 2SD1168 2SD1168P
Contextual Info: TO-3 Power Package Transistors NPN Maximum Ratings Type No. V CBO VCEO V EBO (V) (V) (V) Min Min Min Electrical Characteristics (Ta=25°C, Unless Otherwise Specified) •c Po (W) (A) To=25°c ICBO V CB •c e s V CE (MA) Max 0 (V) (MA) Max (V) 10 e

2N3055HV

Abstract: BDY38 BDX18 2N3055 2N3773 2N4347 2N6253 2N6257 2N6371 2N6371HV
Contextual Info: TO-3 : DIM A B C D E F G H J K L M r 'i 7 r 0 — 41— MIN ; MAX 39,37 22,22 8,50 1.09 1,77 30,4 11,18 5,72 17,15 12,25 26,67 4,19 - 6,35 0,96 29,90 10,69 5,20 16,64 11,15 - 3,84 PIN CONFIGURATION 1. BASE 2. EMITTER 3. COLLECTOR ALL DIMENSIONS ARE IN M.M.

TRANSISTOR BC337 SMD

Abstract: transistor BC170 C5198 CDIL 2N2222A Transistor bd139 smd bc337 SMD PACKAGE bd140 SMD equivalent BC109 BC184 BC549 a1941 CDIL BD139
Contextual Info: • Transistors • • • • • Small Signal Medium Power Power Darlington MOSFET CDIL Semiconductors ~ Worldwide Reach Product Profile Transistors Product Range • • Chips/Dice – Diffused Silicon Wafers Surface Mount and Leaded Semiconductor Devices

bdx20

Contextual Info: TO-3 POWER PACKAGE TRANSISTORS NPN M a x im u m R a t in g s Type No. v CB0 (V) Min v CB0 v EB0 (V) (V) Min Min PD (W) 8Tc=25"C Electrical C h a ra c te ris tic s 'CBO (HA) * VCB hFE (V) Max lc & (A) Min VCE 00 Max #1100 800 5 10 2 2.00 5 BU209 #1500

BDY38

Abstract: 2N6311 BDX18 2n3771 BDY20 BU205 BDY73 BU208 pnp transistor 2N3055 2SC1308
Contextual Info: TO-3 POWER PACKAGE TRANSISTORS NPN Maxim um R atings Type No. v CB0 v CBO v EB0 (V) (V) Min Min (V) Min Pd (W) 6Tc=25°C Electrical C haracteristics 'CBO (MA) e v CB hFE 6 (V) Max lc & (A) Min VCE (V) Max #1100 800 5 10 2 2.00 5 BU209 #1500 800 5 13 2 3.00

transistor 2N3906 smd 2A SOT23

Abstract: BC327-40 SMD pin configuration transistor BC547 smd packaging DIAC DB2 BC547 smd packaging bd469 W04M pin configuration A1941 C5198 application notes D1 DB2 Diac w33 SMD sot 23
Contextual Info: Contents Chips/Dice Package Outline Drawings Page # Axial Glass/Plastic Packages Package Outline Drawings Page # … Leaded Plastic Packages Chips/Dice for Diodes 2 DO-35 50 KBPC 60 Chips/Dice for Transistors 2 DO-41 50 KBPC-6 60 Products for CFL/TL Ballasts

pin configuration transistor BC547 smd packaging

Abstract: BC547 smd packaging BD469 C2N3904 c5198 CMJE2955T transistor mcr100-8 BC337 TO-92 Generic DIAC DB2 BC337 hie hre hfe
Contextual Info: Quick Reference Data Chip/Dice – Diffused Silicon Wafers Surface Mount Devices Leaded Semiconductor Devices Electronic Manufacturing Services Switching Diodes & Arrays Schottky Barrier Diodes Zener Diodes Rectifiers Small Signal Transistors Medium Power Transistors