ceramic coaxial resonators
Abstract: DIELECTRIC COAXIAL RESONATOR
Contextual Info: DATA SHEET Introduction and Applications for Coaxial Resonators and Inductors 300 MHz–6.0 GHz Features Frequency tuned to 0.5% and 1% High dielectric constant ● Rugged construction ● Low loss silver ● Act as parallel resonant circuit or a high quality inductor
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SEM 2006
Abstract: paste profile reflow profile 245 J-STD-020B 62Sn36Pb2Ag PQFN 8 leads
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. Environmentally Preferred Products: Development of Lead Pb - Free and Bromine (Br)- Free Solutions Index Overview 1. Environmentally Preferred Products 1.4 Long Term Goals 1.5 Short Term Goals
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SAC405
Abstract: IPC-9702 IPC-9701A PBGA 23X23 0.8 pitch ipc 610D ipc 9702 JEDEC JESD51-8 BGA bga thermal cycling reliability fine BGA thermal profile Service Manual smd rework station
Contextual Info: Introduction to the Plastic Ball Grid Array PBGA Q1, Burnette 2008 Terry Dec. 15, 2005 TM Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc in the US and other countries. All other product or service names are the property of their respective owners. Freescale Semiconductor, Inc. 2008. The information provided is typical to the industry and is not intended to represent
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countrieESD51
JESD5112,
SAC405
IPC-9702
IPC-9701A
PBGA 23X23 0.8 pitch
ipc 610D
ipc 9702
JEDEC JESD51-8 BGA
bga thermal cycling reliability
fine BGA thermal profile
Service Manual smd rework station
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BGA PROFILING
Abstract: MPC852T 62Sn-36Pb-2Ag 4/5/32R2024/25/62Sn-36Pb-2Ag
Contextual Info: Motorola PowerQUICC MPC852T Pb-Free Packaging Information Motorola Semiconductor Motorola SPS, NCSD - Q1 2003 – Rev. 1 - Page 1 Motorola General Business Information MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other
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MPC852T
23x23
16x16
BGA PROFILING
62Sn-36Pb-2Ag
4/5/32R2024/25/62Sn-36Pb-2Ag
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DSP56321
Abstract: 97Pb3Sn 97Pb DSP56300 DSP56311 EB365 62-SN
Contextual Info: Freescale Semiconductor Engineering Bulletin EB365 Rev. 5, 10/2005 Functional Differences Between the DSP56311 and DSP56321 The DSP56311 and DSP56321, two members of the Freescale DSP56300 family of programmable digital signal processors DSPs , support network applications with general filtering
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EB365
DSP56311
DSP56321
DSP56321,
DSP56300
DSP56321
97Pb3Sn
97Pb
EB365
62-SN
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AN1035
Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
Contextual Info: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction
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AN-1035
065mm.
pp1509-1523
AN1035
tamura solder paste
SN62 PB36 ag2 kester
IRF6604
DirectFet
SN62 PB36 ag2 Copper
Tamura kaken
100N
IRF6601
IRF6602
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kester r256
Abstract: 62Sn36Pb2Ag
Contextual Info: ,QILQHRQ technologies Assembly & Interconnect Technology Version 1.0 Recommendations for the board assembly of the ECSP- 4 package Application Note 1 Target 2) Board pad design 3) Solder paste printing process 4) Placement of components 5) Reflow soldering process
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62Sn36Pb2Ag
Abstract: Adhesive electrode GPS ceramic patch "GPS patch antenna" circular microstrip patch antenna 62Sn-36Pb-2Ag
Contextual Info: SPECTRUM CONTROL INC. GPS Patch Antenna Description/ Applications A M P ’s new ceramic microstrip patch Used in surveying, marine, military, antenna is a miniature dielectric antenna recreational, automotive, aviation, and element for Global Positioning Systems
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62SN-36Pb-2Ag)
62Sn36Pb2Ag
Adhesive electrode
GPS ceramic patch
"GPS patch antenna"
circular microstrip patch antenna
62Sn-36Pb-2Ag
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sn-pb-ag solder paste
Abstract: 62Sn36Pb2Ag IPC-A-610C
Contextual Info: Application Report SZZA035 - October 2002 Board-Mount Evaluation of Tin-Plated Component Leads Douglas W. Romm, Donald C. Abbott, Bernhard Lange, and Muhammad Khan Standard Linear & Logic ABSTRACT The solderability performance of tin Sn -plated integrated circuit (IC) component leads is
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sn-pb-ag solder paste
62Sn36Pb2Ag
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