SNAGCU Search Results

UBGA035-W-3333AEA

Abstract: AN3205
Contextual Info: PACKAGE STANDARDS UBGA035-W-3333AEA Total Pages Page 6 2 1. Outline Drawing Unit:mm Weight : 20 mg Body Material : Epoxy Resin Reroute Material : Cu Terminal Material : SnAgCu Exclusive use for AN32051A Semiconductor Company, Matsushita Electric Industrial Co., Ltd.

SAT-5100

Abstract: fujitsu reflow profile SAT-51 C5191 Fujitsu Ltd Ni 120
Contextual Info: ENVIRONMENTALLY FRIENDLY TECHNOLOGY Fujitsu Component Limited Relay R&D department 1. Fujitsu Components’ Guideline Schedule and Goal Started to replace solder in each relay series with lead-free solder SnAgCu in April 2004 and will complete this conversion by March 2005.

sensors mttf

Abstract: SAC405 UM 3841 4953 sac 405 "Hall Effect Sensor" mttf resistor activation energy sURVEY OF Hall Effect Current Measurements WLCSP Cu6Sn5
Contextual Info: Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps Stephen Gee and Luu Nguyen National Semiconductor M/S 19-100 3875 Kifer Rd. Santa Clara, CA 95051 stephen.gee@nsc.com luu.nguyen@nsc.com ABSTRACT In this test setup, embedded die surface temperature sensors are

MARKING EU

Abstract: br27
Contextual Info: NETWORKS Thick Film R-Network STRUCTURE BGA Resistor Package BR 1 2 3 4 5 6 7 8 Ceramic substrate Thick film inner electrode RuO2 resistive film 1st protective coating amorphous glass 2nd protective coating (epoxy resin) Marking Pb-free solder (SnAgCu: 96.5;3;0.5)

BGF127

Abstract: IEC61000
Contextual Info: BGF127 Low Capacitance ESD protection array • 8-channel ESD protection according to: IEC61000-4-2 ESD : ± 25 kV (contact) • Max. working voltage: 5.3 V • Very low capacitance < 1.0 pF typ. • Very low reverse current < 1 nA typ. • Wafer level package with SnAgCu solder balls

AN32155

Abstract: UBGA024-W-2525AEL
Contextual Info: Package Standards Total pages Page 6 2 1. Outline Drawing Unit:mm Package Code : UBGA024-W-2525AEL Body Material Br / Sb Free : Epoxy Resin Reroute Material : Cu Bump - - Established Revised : SnAgCu Exclusive use for AN32155A Semiconductor Company, Panasonic Corporation

AN30259A

Abstract: XBGA012-W-1316AEL RESIN molding epoxy resin BGA OUTLINE DRAWING AN3025
Contextual Info: Package Standards 1. Outline Drawing Total pages Page 6 2 Unit:mm Package Code : XBGA012-W-1316AEL Body Materia l : Br/Sb Free Epoxy resin Reroute Material : Cu Bump - - Established Revised : SnAgCu Exclusive use for AN30259A Semiconductor Company, Panasonic Corporation

Contextual Info: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1B21 Microcontroller D ATA SHE E T D S -LM3S 1B 21 - 1 3 4 4 2 . 2 5 4 9 S P M S 222H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated

transistor marking WC 2C

Abstract: E22/6/AS7620/TMS320C6678/AS7620/NZT6728-datasheet
Contextual Info: TMS320C6678 SPRS691E—November 2010—Revised March 2014 Multicore Fixed and Floating-Point Digital Signal Processor Check for Evaluation Modules EVM : TMS320C6678 1 TMS320C6678 Features and Description 1.1 Features • Eight TMS320C66x DSP Core Subsystems (C66x

Contextual Info: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz

Contextual Info: TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S9B81 Microcontroller D ATA SHE E T D S -LM3S 9B 81 - 1 5 8 5 2 . 2 7 4 3 S P M S 223J C o p yri g h t 2 0 07-2014 Te xa s In stru me n ts In co rporated Copyright Copyright © 2007-2014 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments

c07f

Abstract: MARKING C07F marking C075
Contextual Info: SN74LVC1G07 www.ti.com SCES296AA – FEBRUARY 2000 – REVISED JULY 2013 SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT Check for Samples: SN74LVC1G07 FEATURES DESCRIPTION • This single buffer/driver is designed for 1.65-V to 5.5V VCC operation. 1 2 • •

u262

Contextual Info: SN74AUC1G126 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT www.ti.com SCES383J – MARCH 2002 – REVISED JULY 2007 FEATURES • • • • • • • • Available in the Texas Instruments NanoFree Package Optimized for 1.8-V Operation and Is 3.6-V I/O

Contextual Info: bq24153A, bq24156A bq24158, bq24159 www.ti.com SLUSAB0B – OCTOBER 2010 – REVISED AUGUST 2012 Fully Integrated Switch-Mode One-Cell Li-Ion Charger With Full USB Compliance and USB-OTG Support Check for Samples: bq24153A, bq24156A, bq24158, bq24159 FEATURES

Contextual Info: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S5951 Microcontroller D ATA SHE E T D S -LM3S 5951 - 1 3 4 4 2 . 2 5 4 9 S P M S 186M C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated

SPM0204HE5-PB

Abstract: mems condenser microphone DC-DC REGULATOR MARKING M7 DIODE mic free sound system amplifier circuit diagram TPS65930BZCHR TPS65930
Contextual Info: TPS65930/TPS65920 Integrated Power Management \Audio Codec TPS65930 Only Silicon Revision 1.2 Data Manual PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not

Contextual Info: SN74LVTH16245A-EP 3.3-V ABT 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com FEATURES • • • • • • • • • • • • • • • 1 Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Enhanced Diminishing Manufacturing

LCW CQAR.EC

Contextual Info: OSLON Square Data Sheet Version 0.0 LCW CQAR.EC Draft - This design is for Reference Subject to change may be necessary in a limited number of cases Small size high-flux LED for slim designs between 200 mA and 1.5 A constant current . 200 lm, 91 lm/W at 700 mA; 113 lm, 108 lm/W at

tube 6G6

Contextual Info: OBSOLETE: TI has discontinued production of this device. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S6G65 Microcontroller D ATA SHE E T D S -LM3S 6G6 5 - 1 2 9 8 6 . 2 5 3 2 S P M S 269B C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated

micro usb ID resistance values

Contextual Info: LP8727 www.ti.com SNVS898 – OCTOBER 2012 LP8727 Micro/Mini USB Interface with Integrated 28V Charger Check for Samples: LP8727 FEATURES 1 • 2 • • • USB Multiplexing Switches – High-speed USB on USB and UART inputs – Negative voltage rail on Audio inputs

Contextual Info: bq27531-G1 www.ti.com SLUSBE7 – MARCH 2013 Battery Management Unit Impedance Track Fuel Gauge for Use With the bq2419x Charger Controller Check for Samples: bq27531-G1 FEATURES 1 • 23 • • • • Battery Fuel Gauge and Charger Controller for 1-Series Li-Ion Applications

Contextual Info: SN74LVC3G14 TRIPLE SCHMITT-TRIGGER INVERTER www.ti.com SCES367I – AUGUST 2001 – REVISED FEBRUARY 2007 FEATURES • • • • • • • • Available in the Texas Instruments NanoFree Package Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V

LM 858 IC chip

Abstract: Q65111A3098
Contextual Info: 6-lead in-line MULTILED Enhanced optical Power LED ThinFilm / ThinGaN  Lead (Pb) Free Product - RoHS Compliant LRTB GFUG Released Besondere Merkmale • Gehäusetyp: schwarzes P-LCC-6 Gehäuse zur Kontrasterhöhung (RGB-Displays) und diffuser Silikon-Verguß

Contextual Info: SN54CBT16212A, SN74CBT16212A 24ĆBIT FET BUSĆEXCHANGE SWITCHES SCDS007U − NOVEMBER 1992 − REVISED JUNE 2005 D Members of the Texas Instruments D D D D SN54CBT16212A . . . WD PACKAGE SN74CBT16212A . . . DGG, DGV, OR DL PACKAGE TOP VIEW Widebus  Family