WLCSP Search Results

Contextual Info: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCC064GWZ-3 General Description BRCC064GWZ-3 is a serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 „ Completely conforming to the world standard I C BUS. All controls available by 2 ports of serial clock

Contextual Info: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCA016GWZ-W 16Kbit General Description BRCA016GWZ-W series is a serial EEPROM of I2C BUS Interface Method. Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Completely conforming to the world standard I2C BUS. All controls available by 2 ports of serial clock (SCL)

RF6280

Abstract: RD6280
Contextual Info: RF6280 Preliminary POWER MANAGEMENT IC Package Style: 15-Bump WLCSP, 4 x 4 Array, 2 mm x 2 mm Features „ „ „ „ „ „ „ „ „ „ „ „ „ Peak Efficiency Up To 96% High Efficiency Over Various Loads Transient Response < 10 s 650 mA Current Capability

LQM18PN1R0

Abstract: CBMF1608 LQM18PN 953-MHz ADP2139
Contextual Info: Compact, 800 mA, 3 MHz, Step-Down DC-to-DC Converter ADP2138/ADP2139 Data Sheet FEATURES GENERAL DESCRIPTION Input voltage: 2.3 V to 5.5 V Peak efficiency: 95% 3 MHz fixed frequency operation Typical quiescent current: 24 A Very small solution size 6-lead, 1 mm x 1.5 mm WLCSP package

Contextual Info: Package outline WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm A E NVT4555UK B A2 ball A1 index area A A1 D detail X e1 e ZE2 C Øv Øw b C A B C y D e C B ZE1 ball A1 index area e2 1/2 e A 1 ZD1 2 3 X ZD2 2 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.53 mm A B D NX20P3xxUK ball A1 index area A2 E A A1 detail X e1 C e C A B C Øv Øw b y D e C e2 B A ball A1 index area 1 2 3 4 X 2 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm B D LPC1768UK A ball A1 index area A2 A A1 E detail X e1 1/2 e e Øv Øw b C A B C C y K e J H G F e2 E D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 X 3 mm

Contextual Info: Package outline WLCSP4: wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm Backside coating included A B D NX3P1107/NX3P1108 A2 ball A1 index area A A1 E detail X e 1/2 e C A B C Øv Øw b C y B 1/2 e e A ball A1 index area 1 2 X 1 mm scale Dimensions (mm are the original dimensions)

WLCSP15

Contextual Info: Package outline WLCSP15: wafer-level chip-size package; 15 bumps; 4 x 4 - C2 D bump A1 index area A2 E A A1 detail X e1 e b D e C e2 B A 1 2 3 4 X European projection wlcsp15_4x4-c2_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not

Contextual Info: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.664 x 1.364 x 0.509 mm Backside coating included B A D NX5P1000 A2 ball A1 index area A E A1 detail X e1 1/2 e e C A B C Øv Øw b C y C e B e2 A ball A1 index area 1 2 3 4 X 2 mm scale

Contextual Info: Reflow soldering footprint WLCSP17: wafer level chip-size package; 17 bumps 6-5-6 D bump A1 index area A2 A E A1 detail X e 1/2 e b C e1 B1 B B2 B3 B4 B5 e2 A 1 2 3 e3 4 5 6 X European projection wlcsp17_6-5-6_po www.nxp.com 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not

SOLDERRM

Abstract: WLCSP10 156BSC
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.56x1.05 CASE 567BH−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.

WLCSP10

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 2.46x0.96 CASE 567BG−01 ISSUE O SCALE 4:1 È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

SOLDERRM

Abstract: WLCSP15
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 2.47x1.05 CASE 567BR−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È 0.05 C A 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

567AZ-01

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP5, 0.94x1.41 CASE 567AZ−01 ISSUE O SCALE 4:1 D 2X A ÈÈ PIN A1 REFERENCE DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

143X1

Abstract: wlcsp8 footprint
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.43x1.41 CASE 567BE−01 ISSUE O SCALE 4:1 D PIN A1 REFERENCE 2X A ÈÈ DATE 26 JUL 2010 B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP4, 0.96x0.96 CASE 567AW−01 ISSUE O SCALE 4:1 ÈÈ ÈÈ D PIN A1 REFERENCE 2X A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

WLCSP20

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.27x1.13 CASE 567BW−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D È È A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER

567BM-01

Abstract: WLCSP10
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E e TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER

WLCSP-20

Abstract: 16X1 WLCSP20
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 3.16x1.05 CASE 567BU−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER

WLCSP10

Abstract: 567BL
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.96x1.33 CASE 567BL−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X ÈÈ D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

portable dvd player schematic diagram of video

Abstract: 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK
Contextual Info: SA58671 1.2 W/channel stereo class-D audio amplifier Rev. 02 — 24 October 2008 Product data sheet 1. General description The SA58671 is a stereo, filter-free class-D audio amplifier which is available in a 16 bump WLCSP Wafer Level Chip-Size Package . The SA58671 features independent shutdown controls for each channel. The gain can be

Contextual Info: BlueNRG Bluetooth low energy wireless network processor Datasheet - production data • On-chip non-volatile Flash memory  AES security co-processor  Low power modes  16 or 32 MHz crystal oscillator  12 MHz ring oscillator WLCSP34 QFN32  32 kHz crystal oscillator

A2 diode

Contextual Info: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W6x6.36 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID D TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 b 0.270 ±0.030