WLCSP |
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NXP Semiconductors
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Guideline for the laser marking layout of WLCSP devices |
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WLCSP12 |
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NXP Semiconductors
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Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm |
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WLCSP12 |
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NXP Semiconductors
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Wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm |
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Original |
PDF
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WLCSP12 |
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NXP Semiconductors
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WLCSP12: wafer level chip-scale package; 12 bumps |
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WLCSP15 |
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NXP Semiconductors
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Wafer-level chip-size package; 15 bumps; (4 x 4 - C2) |
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WLCSP16 |
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NXP Semiconductors
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Wafer level chip-size package; 16 bumps |
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WLCSP16 |
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NXP Semiconductors
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Wafer level chip-size package; 16 bumps |
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WLCSP17 |
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NXP Semiconductors
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Wafer level chip-size package; 17 bumps (6-5-6) |
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WLCSP20 |
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NXP Semiconductors
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Wafer level chip-size package; 20 bumps |
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WLCSP25 |
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NXP Semiconductors
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WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1) |
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WLCSP25217X232 |
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NXP Semiconductors
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WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - A1) |
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WLCSP39 |
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NXP Semiconductors
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Wafer level chip-scale package; 39 balls |
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WLCSP4 |
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NXP Semiconductors
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Wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) |
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WLCSP4 |
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NXP Semiconductors
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Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm |
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WLCSP49 |
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NXP Semiconductors
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Wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm |
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WLCSP5 |
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NXP Semiconductors
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Wafer level chip-size package; 5 bumps (2-1-2) |
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WLCSP6 |
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NXP Semiconductors
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Wafer level chip-size package; 6 bumps (2 x 3) |
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