U8439-1
Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)
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a1006-0323-jul-2010fcbga-1156fcbga-900+1523-oct-201089hpes16t16zabl89hpes16t16zabr89hpes22t16zabl89hpes22t16zabliu8439-1aus703nau-8namics underfillabf-gx3ablestik underfilldcl5x23-7772-4dcl4x23-7772
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12SnOFC
Abstract: BQ37 PMC-90 PMC-90 leadframe material MKT-TO220B03 FDP3672 HRF3205 equivalent mosfet number Tamac4 a105 transistor HRF3205 equivalent
Contextual Info: Date Created: 1/9/2004 Date Issued: 2/13/2004 PCN # 20040204 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will
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huf75343p3huf75542p3huf75631p3huf75645p3+16huf75939p3huf76107p3huf76132p3huf76143p3huf76419p3huf76432p312snofcbq37pmc-90pmc-90 leadframe materialmkt-to220b03fdp3672hrf3205 equivalent mosfet numbertamac4a105 transistorhrf3205 equivalent
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microsemi TVS
Abstract: MicroNote
Contextual Info: MicroNote Series 118 by Mel Clark and Kent Walters, Microsemi Scottsdale TVS/Chip Product Overview Microsemi’s offerings of TVS chip size products include: TVS/Chip Passivated TVS/Chip types of: a planar, b) mesa and c) bidirectional mesa are illustrated
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microsemi tvsmicronote |
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duraseal
Abstract: SiC IGBT High Power Modules sic wafer 100 mm Wacker Silicones 28Cu72Ag wacker 100C parallel mosfet Cree SiC MOSFET silicon carbide
Contextual Info: Performance and Reliability Characteristics of 1200 V, 100 A, 200oC Half-Bridge SiC MOSFET-JBS Diode Power Modules James D. Scofield and J. Neil Merrett Air Force Research Laboratory 1950 Fifth St WPAFB, OH 45433 937-255-5949 james.scofield@wpafb.af.mil James Richmond and
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200ocdurasealsic igbt high power modulessic wafer 100 mm+7wacker silicones28cu72agwacker100cparallel mosfetcree sic mosfetsilicon carbide
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bt 1696
Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Contextual Info: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are
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bt 169612x12 bga thermal resistance35x35 bgabga 23x23+6bga 27x27 pitchtsop 20 package xilinxxilinx cs144 thermal resistancecf1144bga thermal resistance 6x8smt a1 transistor
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12SnOFC
Abstract: PMC-90 PMC-90 leadframe material 92.5Pb5Sn2.5Ag Tamac4 MKT-TO263A02 pmc90 PMC-90 to-263 RF1S640SM9A FDB2532
Contextual Info: Date Created: 12/30/2003 Date Issued: 1/15/2004 PCN # 20040002 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will
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fairchildf76143s3shuf76145s3shuf76419s3sthuf76432s3s+16huf76439s3shuf76445s3sthuf76639s3shuf76645s3stisl9n303as3isl9n306as3st12snofcpmc-90pmc-90 leadframe material92.5pb5sn2.5agtamac4mkt-to263a02pmc90pmc-90 to-263rf1s640sm9afdb2532
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X23-7772-4
Abstract: U8439-1 DCL5 AUS703 namics underfill X23-7772 NAU-8 ABF-GX3 namics U8439-1 X2377
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0904-03 DATE: 22-May-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 19mm x 19mm FCBGA-324 (RoHS) Refer to Attachment II for the affected part numbers
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a0904-0322-may-2009fcbga-32422-aug-2009+15jesd22-a104jesd22-a118jesd22-a103jesd22-a11380ksw0001arx23-7772-4u8439-1dcl5aus703namics underfillx23-7772nau-8abf-gx3namics u8439-1x2377
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Thin Film Resistors SiCr
Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
Contextual Info: AT C / / A V X T H I N F I L M TECHNOLOGIES Engineered Thin Film Solutions TA B L E O F C O N T E N T S Introduction to ATC // AVX Thin Film Technologies .1 - 2
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thin film resistors sicrsicr thin film tisac305hfss+680au-20sn3 to 10 ghz bandpass filtersac305 thermal conductivity184394ansoftsac305 reflow bga
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90Pb10Sn
Abstract: FODB10X 5SN3 AN-3011 FODB100 95Pb-5 62Sn36Pb2Ag 95Pb5Sn
Contextual Info: www.fairchildsemi.com Application Note AN-3011 Surface Mounting Technology Assembly Guidelines for Fairchild’s Microcouplers Ball Grid Array Optocoupler technology, consisting of a light source and a photosensitive detector surrounded by a transparent light
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an-3011fodb100an300600990pb10sn+5fodb10x5sn395pb-562sn36pb2ag95pb5sn
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underfill
Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate
Contextual Info: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package
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12x10-617x10-66x10-6underfill+9cte table flip chip substrateansys darveauxwith or without underfillfr4 substrate height and thicknesscte table bgacte table63sn37pbapplication for bt 151fr4 substrate
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