U8439-1
Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)
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a1006-0323-jul-2010fcbga-1156fcbga-900+1523-oct-201089hpes16t16zabl89hpes16t16zabr89hpes22t16zabl89hpes22t16zabliu8439-1aus703nau-8namics underfillabf-gx3ablestik underfilldcl5x23-7772-4dcl4x23-7772
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X23-7772-4
Abstract: U8439-1 DCL5 AUS703 namics underfill X23-7772 NAU-8 ABF-GX3 namics U8439-1 X2377
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0904-03 DATE: 22-May-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 19mm x 19mm FCBGA-324 (RoHS) Refer to Attachment II for the affected part numbers
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a0904-0322-may-2009fcbga-32422-aug-2009+15jesd22-a104jesd22-a118jesd22-a103jesd22-a11380ksw0001arx23-7772-4u8439-1dcl5aus703namics underfillx23-7772nau-8abf-gx3namics u8439-1x2377
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PSR4000 AUS308
Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
Contextual Info: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array
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hl832hl832-hshl832-nbmcl-e-679w+13mcl-e-679brmcl-e-679fgghpl-830gea-679nmr600psr4000 aus308prepreg ghpl-830taiyo aus703taiyo psr4000 aus303thp 100psr4000 aus703hitachi mcl-e-679fgmgc hl832
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