UNDERFILL Search Results

W8X00

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; SEE TABLE 1 FOR LAND PAD AND SOLDER MASK COORDINATES; SEE TABLE 2 FOR SOLDER PASTE STENCIL COORDINATES. 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

FR4 SUBSTRATE SHEET

Abstract: 0343
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

DS1822X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES

Contextual Info: Part Number: S7100PH-C4 Package: 484L HSGBA 23x23mm Material Declaration Statement of Materials, Construction Material Component Name Weight (g) Element/Compound 1 2 Die Underfill 0.1502 0.0170 3 Epoxy 0.0500 4 Heat Spreader 2.3620 5

underfill

Abstract: DS2417X FR4 substrate ds2417
Contextual Info: NOTES: 1. 2. DIMENSIONS: LASER MARK MM [IN C H ] 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR CONNECTIONS AND COORDINATES, SEE TABLE 1 4. PAD UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILUMETERS

IS242

Abstract: DS2423X
Contextual Info: NOTES: 1. DIMENSIDNSi 2. 3. MM CINCHES] LASER MARK LAND PAH NOT DEFINED BY SOLDER MASK; FDR PAD CONNECTIONS, SEE TABLE 1 4. UNDERFILL DR GLEIB TDP REQUIRED FDR FR4 DR EQ U IVA LEN T SUBSTRATE TABLE 1. APPLICATION LAND PAD C0NNECT0N5 AND CENTE R COORDINATES

KY transistor

Abstract: MSCD052 MSCD053 MSCD054
Contextual Info: MSCD052 THRU MSCD054 VOLTAGE 20V ~ 40V Elektronische Bauelemente 0.5 AMP Surface Mount Schott ky Barrier Rectifiers RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled

DS2430AX

Abstract: FR4 substrate 0537
Contextual Info: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

FR4 SUBSTRATE SHEET

Abstract: DS75X 3ao2
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X

stdf

Abstract: DS1722X Glob DS1722
Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. N O N -SO LD ER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR FR4- OR EQUIVALENT SUBSTRATE APPLICATIONS T A B LE 1: SU B ST R A T E CDNNECTIDNS AND PAD C D D R IIN A T E S MILLIMETERS NUMBER

underfill

Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Contextual Info: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.

MSCD204

Abstract: MSCD202
Contextual Info: MSCD202 THRU MSCD204 VOLTAGE 20V ~ 40V Elektronische Bauelemente 2 AMP Surface Mount Schottky Barrier Rectifiers RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled

JESD22

Abstract: Sn46 PB46 7410E A104 A108 A113 WED3C7410E16M-400BX
Contextual Info: WED3C7410E16M-400BX POWER PC 7410E MULTI-CHIP PACKAGE CONSTRUCTION HIGH RELIABILITY FLIP CHIP ATTACH TEST • C4 Assembly on PowerPC™ Processors & SSRAM die ■ Burn-In - 100%, 48 hours at 125°C ■ JEDEC Level 2 underfill ■ Die Thickness ■ Final Electrical Test - 100% at maximum and

165301

Contextual Info: ^ 0.15 A A1 INDEX N // 0.25 A SEATING PLANE r 8X 6.5 MAX i I I L // 0.35 UNDERFILL ZONE r I y 4X 11.3 MAX TOP VIEW 18X 1.27 w I L h rII ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦

Contextual Info: Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions UNIT A

MSCD104

Abstract: marking a4
Contextual Info: MSCD104 VOLTAGE 40V Elektronische Bauelemente 1 AMP Surface Mount Schottky Barrier Re ctifie rs RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free 0805 .002 0.05 FEATURES * Case : Packed with FRP substrate and epoxy underfilled * Terminals : Solder plated , solderable per MIL-STD-750,

underfill

Abstract: DS2415X D085-002 FR4 substrate
Contextual Info: NOTES: 1. DIMENSIDN5: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS

JESD22-B117

Abstract: JEDEC JESD22-B117 JESD22B117 dallas date code JESD22-B100
Contextual Info: 05/06/2003 RELIABILITY REPORT FOR Dallas, no underfill, 144 Chip Scale BGA Interposer Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy.

underfill

Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Contextual Info: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings

underfill

Abstract: FCP2 SOT732-1 sot732
Contextual Info: Package outline Philips Semiconductors FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill tape D 5 10 15 20 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: ^ 0.15 A1 INDEX A_ N / / 0.25 A SEAÄNG PL 8X 6.5 MAX i r I I L / / 0.35 UNDERFILL ZONE r I y 4X 11.3 MAX TOP VIEW 18X 1.27 h I L ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦

OLGA

Contextual Info: 360X 0.15 A c A1 INDEX SEATING PLANE 8X 6.5 M A X i 4X 11.3 M A > UNDERFILL ZONE — 0.34 "0.14 360X 0Q-Q2 1 2 3 4 5 6 7 9 11 13 15 17 19 8 10 12 14 16 18 fh 00.3 A E C 00.1 5® A 0.9 '0.7 2.14 MAX- BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED.

JEDEC JESD22-B117

Abstract: JESD22-B117 Nitto HC Maxim ic date code Nitto 17X17X1 HC100 underfill JESD22-B100
Contextual Info: 01/23/2004 RELIABILITY REPORT FOR DS21Q55, Rev B2, ASAT no underfill Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292

DS56X

Contextual Info: NOTES: 1. DIMENSIONS: MM [INCH] LASER MARK LANDING PAD NOT DEFINED BY SO LD ER Z. 3. MASK; FOR PAD CONNECTIONS AND COORDINATES. SE E TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS