WS57C291 Search Results

WS57C43

Abstract: WS57C128 WS57C191 wafer equipment
Contextual Info: Document: WSI-1022 September 22, 1998 Subject: Critical Process Change Notification High Speed Memory 35ns and slower only Device Types: WS57C128, WS57C191, WS57C291, WS57C43, WS57C49, WS57C51 - This change effects speeds 35ns and slower only (-35, -45, -55, -70

Contextual Info: PROM/RPROM SELECTION GUIDE ARCHITECTURE 2 32K x 8 WS57C71C 16K x 8 WS57C51C 8K x 8 WS57C49C 4K x 8 WS57C43C 2K x 8 REGISTERED WS57C45 2K x 8 WS57C191C 2Kx8 WS57C291C 2K x 8 (3 VOLT) WS57LV29IC 45 50 55 ACCESS TIME (ns) NOTE: Shaded area is Advance Information.

SS1203

Abstract: N82S191A 27HC642 N82S191 cy7c292 cross reference cy7c291 cross reference
Contextual Info: PROM/RPROM CROSS REFERENCE AMD WSI NATIONAL WSI AM27C49 AM27C191 AM27C291 AM27PS43 AM27S43 AM27S43A AM27S45 AM27S49 AM27S51 AM27S51A AM27S191 AM27S291 WS57C49C WS57C291C WS57C291C WS57C43C WS57C43C WS57C43C WS57C45 WS57C49C WS57C51C WS57C51C WS57C191C WS57C291C

NEC uPB

Abstract: ATMEL PROM AM27S45 SS1203 SIGNETICS prom WSI Cross Reference AM27S51A AM27S51 cy7c291 cross reference N82HS1281
Contextual Info: PROM/RPROM CROSS REFERENCE AMD WSI NATIONAL WSI AM27C49 AM27C191 AM27C291 AM27PS43 AM27S43 AM27S43A AM27S45 AM27S49 AM27S51 AM27S51A AM27S191 AM27S291 WS57C49C WS57C291C WS57C291C WS57C43C WS57C43C WS57C43C WS57C45 WS57C49C WS57C51C WS57C51C WS57C191C WS57C291C

Contextual Info: FAMILY OF HIGH PERFORMANCE CMOS PROMs AND RPROMs PART NUMBER PAGE NO. DENSITY BITS ARCHITECTURE SPEED (ns) DRAWING NO. NO. OF PINS PACKAGE WS57C191C 2-7 16K 2K X 8 2 5 -5 5 D1 J3 P2 24 28 24 CERDIP, 0.6" PLDCC Plastic DIP, 0.6" WS57C291C 2-7 16K 2K X 8 2 5 -5 5

Contextual Info: WS57C291-45 IL00D C-MOS 16 K-BIT 2,048 x 8 HIGH SPEED ERASABLE P-ROM —TOP VIEW— 8 A7 IN VDD 24 1 7 6 A6 IN 2 23 A8 IN 22 A9 IN 5 4 A5 IN 3 3 2 A4 IN 21 4 A10 IN 1 23 A3 IN 20 5 CS1/VPP IN 22 21 A2 IN 6 19 CS2 IN A1 IN 7 18 CS3 IN A0 IN 8 17 D7 OUT D0 OUT

16k prom

Abstract: 16k x 8 PROM ws57c43 datasheet for 4K x -12sl WS57C191C WS57C291C WS57C43C WS57C45
Contextual Info: PROM/RPROM SELECTION GUIDE ARCHITECTURE 32K x 8 WS57C71C 16K x 8 WS57C51C 8K x 8 WS57C49C 4K x 8 WS57C43C 2K x 8 REGISTERED WS57C45 2K x 8 WS57C191C 2K x 8 WS57C291C 2K x 8 (3 VOLT) WS57LV291C 25 30 35 40 45 50 55 60 65 70 90 ACCESS TIME (ns) Return to Main Menu

CERDIP 28 PINS

Abstract: t-12824 cerdip WS57C291C WS57C43C WS57C45 WS57C49C WS57C51C WS57C71C WS57LV291C
Contextual Info: FAMILY OF HIGH PERFORMANCE CMOS PROMs AND RPROMs PART NUMBER PAGE NO. DENSITY BITS ARCHITECTURE SPEED (ns) DRAWING NO. NO. OF PINS PACKAGE WS57C191C 2-7 16K 2K x 8 25 – 55 D1 J3 P2 24 28 24 CERDIP, 0.6" PLDCC Plastic DIP, 0.6" WS57C291C 2-7 16K 2K x 8

Contextual Info: FAMILY OF HIGH PERFORMANCE CMOS PROMs AND RPROMs PART NUMBER PAGE NO. DENSITY BITS SPEED (ns) DRAWING NO. NO. OF PINS PACKAGE WS57C191C 2-7 16K 2K X8 2 5 -5 5 D1 J3 P2 24 28 24 CERDIP, 0.6“ PLDCC Plastic DIP, 0.6" WS57C291C 2-7 16K 2K X 8 2 5 -5 5 S1 T1

WS57C291B-45KMB

Abstract: 5962-8873401JX 5962-8873401KX 5962-88734033X 5962-8873403LX fl734
Contextual Info: REVISIONS LTR DATE YR-MO-DA DESCRIPTION APPROVED REV SHEET REV SHEET REV STATUS OF SHEETS REV SHEET 2 1 3 PREPARED BY PMICN/A — STANDARDIZED MILITARY DRAWING A z 4 5 6 AM SC N/A jjO R M 8 9 10 11 / / w / n o * /YVUv y MICROCIRCUIT, MEM0RV, DIGITAL, CMOS, 2K X

PAC1000

Abstract: SAM448 DALLAS 2501 PSD100 WS27c010 Waferscale Integration pac1000 IR 9515 datasheet 9435, ic BA 9706 K Microcontroller AT89C51 plcc 44 pin details
Contextual Info: Reliability Summary 1999 Waferscale Integration, Inc. Reliability Summary 1999 Copyright 1999 Waferscale Integration, Inc. All rights reserved. 47280 Kato Road, Fremont, California 94538 Tel: 510-656-5400 Fax: 510-657-5916 Web Site: http://www.waferscale.com

WS57C191-55

Abstract: 24PIN
Contextual Info: - 7C 19 1 m % ft £ X4 «/ y OC TMC nax ns) TCAC max (ns) TOH oax (ns) tg TOE max (ns) TOD VDD (ns) (V) m 1r\ A I DD/STANDBY (mA) VIL max (V) VIH rain (V) tuu/mæ« et Ci Bax (pF) V O L / I VOL Eiax (V/ b A) V O H / 1 VOH min (V/iA) WS57C 1 9 1-40 WAFERSCALE

ICT-083-S-TG

Abstract: NSH-06DB-S2-TG ADS56004 DSP56002 DSP56004 JG11 SBL-02-S-TG AES EBU CONVERTER NSH-40DB-S2-TG30 socket s1
Contextual Info: CHAPTER 9 DSP56004 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 9.1 BOARD ARCHITECTURE The DSP56004 ADM has various options to facilitate evaluation of the different features of the chip. These options are outlined in this chapter with a statement on the default factory jumpers the ADM will be shipped with.

5962-88734033X

Abstract: WS57C291B-45KMB 5962-8873401JX
Contextual Info: REVISIONS LTR DATE YR-MO-DA DESCRIPTION APPROVED REV SHEET REV SHEET REV STATUS OF SHEETS REV 10 1 1 SHEET PMICN/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE B Y ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A PREPARED B Y

2 k bipolar prom

Abstract: 3A4C
Contextual Info: WS57C191 C/291 C MILITARY HIGH SPEED 2 K x 8 CMOS PROM/RPROM KEY FEATURES • Pin Compatible with Am27S191/291 and N82S191 Bipolar PROMs • Ultra-Fast Access Time — *ACC = 35 ns — t c s = 20 ns • Immune to Latch-UP • Low Power Consumption — Up to 200 mA

WSI eprom Programming algorithm

Contextual Info: WS57LV291C PRELIMINARY HIGH SPEED 3.3 VOLT 2 K x 8 CMOS PROM/RPROM KEY FEATURES • 3.3 Volt ± 0.3 Volt Vcc • Available in 300 Mil "Skinny" DIP • Fast Access Time * Immune to Latch-up — tA c c = 70 ns — Up to 200 mA ~ lcs = 20 ns • Low Power Consumption

mc14507p

Abstract: Augat ict socket NSH-03SB-S2-TG30 16KX8 DSP56002 JG11 waferscale intergration MCM6290 berg pga C330C474M5R5CA
Contextual Info: CHAPTER 8 DSP56002 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 8.1 BOARD ARCHITECTURE The DSP56002 ADM has various options to facilitate evaluation of the different features of the chip. These options are outlined in this chapter with a statement on the default factory jumpers the ADM will be shipped with.

25ls2521

Abstract: 10F305 74ls245 jtag ansley idc ribbon connector beckman j2 EVQ-QS205K ICE-243-S-TG30 74LS04 SIGNETICS Beckman 661 XTB37-B
Contextual Info: CHAPTER 6 HOST COMPUTER CARD/COMMAND CONVERTER SUPPORT INFORMATION 6.1 INTRODUCTION This chapter provides the connector signal descriptions and parts lists for hardware that is required to run with the ADS software. This list includes the host interface cards, host

5962-8873401JX

Abstract: 5962-8873401KX 5962-8873401LX cypress mil-std-883 prom
Contextual Info: REVISIONS LTR DATE YR-MO-DA DESCRIPTION APPROVED REV SHEET REV SHEET REV STATUS OF SHEETS REV SHEET 10 11 12 13 14 PMICN/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR U SE B Y A LL DEPARTMENTS AND A G EN CIES O F THE DEPARTMENT O F D E FE N SE

HD637B01VOP

Abstract: HD63701VOP HD63705VOP hd63701xop HD637A01VOP HD64F3048F16 MB8516 HD637B01YOP HD63701YOP lh57257
Contextual Info: ＡＦ−９７００ ＳＥＲＩＥＳ ＤＥＶＩＣＥ ＬＩＳＴ ＡＦ−９７０４ ＥＰＲＯＭ ＡＦ−９７０５ ＭＯＳ ＡＦ−９７０６ ＥＰＲＯＭ ＡＦ−９７０７ ＰＣ ＡＦ−９７２１ ＧＡＮＧ ＰＲＯＧＲＡＭＭＥＲ

Contextual Info: WS57C191B/291B HIGH SPEED 2 K x 8 CMOS PROM/FtPROM FOR M A IN T E N A N C E PU R PO SES ONLY! N O T TO B E USED FOR N E W DESIGNS. SEE WS57C191 C/291 C FOR N E W VERSION! KEY FEATURES • Ultra-Fast Access Time _ 3 5 ns • Pin Compatible with Am27S191/291

Contextual Info: WS57C191 C/291 C HIGH SPEED 2 K x 8 CMOS PROM/RPROM KEY FEATURES • Ultra-Fast Access Time • Pin Compatible with Am27S191/291 and N82S191 Bipolar PROMs — *ACC = 25 ns — t c s = 12 ns • Immune to Latch-UP • Low Power Consumption — Up to 200 mA

smd marking 25J

Contextual Info: WS57C191 C/291 C HIGH SPEED 2K X 8 CMOS PROM/RPROM KEY FEATURES • Pin Compatible with Am27S191/291 and N82S191 Bipolar PROMs • Ultra-Fast Access Time — Ucc = 25 ns — t c s = 12 ns • Immune to Latch-UP • Low Power Consumption — Up to 200 mA • ESD Protection Exceeds 2000V

WS57C191C55DMB

Abstract: N82S1
Contextual Info: WS57C191C/291C MILITARY HIGH SPEED 2Kx 8 CMOS PROM/RPROM KEY FEATURES • Pin Compatible with Am27S191/291 and N82S191 Bipolar PROMs • Ultra-Fast Access Time f ACC = 35 ns — t c s = 20 ns • Immune to Latch-UP • Low Power Consumption — Up to 200 mA