WE14 Search Results

elliptical waveguide

Abstract: WAVEGUIDE 6x47 waveguide elliptical
Contextual Info: Elliptical Waveguide The content of this specification may change without notification 1/15/10 Elliptical Waveguide Standard Models P/N WE26- XX WE38- XX WE48- XX WE54- XX WE62- XX WE80- XX WE90- XX WE110- XX WE120- XX WE130- XX WE148- XX WE188- XX Frequency

inconel thermocouple

Abstract: WT16-71515-000-0-00 WK18-71503-000-0-00 WF24 MJ-26 Hoskins2300 K20B WT20-11507-000-0-00 A1046 A0712
Contextual Info: WIRE AND ACCESSORIES Wire and Accessories Wire & Accessories Wire/Acc d Re 2-1 /2" BARBER-COLMAN CO. LOVES PARK, ILL. U.S.A. CL 90°, ceramic insulated HL BA LO RB VE ER S -C PA O RK LM , IL AN L. C U.S O . .A . 07 Si 18 ng 0 le Ex te ns io n Ja ck an d Bo

IMX6DQ6SDLSRM

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.3, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

IMX6DQ6SDLSRM

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.3, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

sony cmos sensor imx 117

Abstract: sony IMX 117 imx 117 sensor sony cmos sensor imx 174 sony IMX 135 sony CMOS sensor imx 135 225/sony cmos sensor imx IMX 206 imx 117
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 3, 03/2014 MCIMX6QxAxxxxC MCIMX6QxAxxxxD MCIMX6DxAxxxxC MCIMX6DxAxxxxD i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

SDHC specification

Abstract: omnivision SS42 graphic display 8080 epson sony IMX 136 toshiba LTM 10 C 015 K NV 15F sony smartphone ARM11 MCIMX31
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data MCIMX31 and MCIMX31L MCIMX31 and MCIMX31L Multimedia Applications Processors 1 Introduction The MCIMX31 and MCIMX31L multimedia applications processors represent the next step in low-power, high-performance application processors.

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.1, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

sony cmos sensor imx 175

Abstract: sony IMX 132 CMOS Sony IMX 183 sony IMX 145 image sensor DDR21 imx cmos sony sony IMX 140 sensor sony cmos sensor imx 071
Contextual Info: Document Number: MCIMX35SR2CEC Rev. 8, 04/2010 MCIMX35 i.MX35 Applications Processors for Industrial and Consumer Products Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Silicon Revisions 2.0 and 2.1 Ordering Information See Table 1 on page 3 for ordering information.

samsung EMMC user guide

Abstract: Jedec lpddr2 samsung lpddr2 Mobile RAM samsung eMMC 4.5 MX53UG n78c AMBA AXI dma controller designer user guide lpddr2 layout SONY VTR M15 DIAGRAM DDR3 jedec
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 4, 11/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

sony cmos sensor imx 174

Abstract: Sony "IMX 175" CMOS
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.1, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

Samsung eMMC 4.41

Abstract: LPDDR2 SDRAM samsung i.MX53 USB_OTG emmc spec samsung samsung EMMC user guide samsung lpddr2 eMMC 4.4 Jedec lpddr2 sahara lcd monitor circuit diagram free
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53AEC Rev. 3, 7/2011 MCIMX53xA i.MX53xA Automotive and Infotainment Applications Processors Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information

pin vga CRT pinout

Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Contextual Info: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm

WS512K32-XXX

Contextual Info: WS512K32-XXX / EDI8C32512CA HI-RELIABILITY PRODUCT 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES • Access Times of 15*, 17, 20, 25, 35, 45, 55ns ■ 5 Volt Power Supply ■ Packaging ■ Low Power CMOS ■ Built-in Decoupling Caps and Multiple Ground Pins for Low

Contextual Info: \9» ¡¿>tt PUMA 2S1000 molate PUMA 2S1000-35/45/55/70 Issue 3.0 : January 1992 ADVANCE PRODUCT INFORMATION Sem iconductor /"• Pin Definition Inc. 1,048,576 bit CMOS High Speed Static RAM \ 1 12 23 o o O De WE2 015 O _a o D9 CS2 D U o o o Features Very Fast access times of 35/45/55/70 ns.

Contextual Info: MIXED TECHNOLOGY PUMA molate PUMA 2X0215 ISSUE 1.1 : October 1991 ADVANCE PRODUCT INFORMATION S e m ic o n d u c to r inc. 524,288 bit EEPROM and 524,288 bit SRAM Features Output user configurable as 8 / 16 bit wide. Average Power EEPROM 732 /1155 mW max .

Contextual Info: WF512K32-XXX5 512Kx32 5V NOR FLASH MODULE SMD 5962-94612* FEATURES  Access Times of 60, 70, 90, 120, 150ns  Low Power CMOS  Packaging  Embedded Erase and Program Algorithms • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP

Contextual Info: WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES  Access Times of 125 and 150ns  Automatic Page Write Operation  MIL-STD-883 Compliant Devices Available  Page Write Cycle Time: 10ms Max  Packaging:  Data Polling for End of Write Detection

Contextual Info: WE512K16-XG4X 512Kx16 CMOS EEPROM MODULE FEATURES  Access Time of 140, 150, 200ns  Page Write Cycle Time: 10ms Max  Packaging:  Data Polling for End of Write Detection  Hardware and Software Data Protection • 68 lead, 40mm Hermetic CQFP Package 501

Contextual Info: WE32K32-XXX 32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES  Access Times of 125 and 150ns  Automatic Page Write Operation  MIL-STD-883 Compliant Devices Available  Page Write Cycle Time: 10ms Max  Packaging:  Data Polling for End of Write Detection

Contextual Info: WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES  Access Times of 15, 17, 20, 25, 35, 45, 55ns  TTL Compatible Inputs and Outputs  Packaging  5 Volt Power Supply  Low Power CMOS • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP

WS512K32V-XXX

Contextual Info: WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE PRELIMINARY* FEATURES • Access Times of 15, 17, 20ns ■ Low Voltage Operation ■ Low Power CMOS ■ Packaging ■ Fully Static Operation: ■ TTL Compatible Inputs and Outputs • 66-pin, PGA Type, 1.075 inch square, Hermetic

WS1M32-XG3X

Contextual Info: WS1M32-XG3X 1Mx32 SRAM MODULE FEATURES • Access Times of 17, 20, 25ns ■ Low Power CMOS ■ 84 lead, 28mm CQFP, Package 511 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Organized as two banks of 512Kx32, User Configurable as

WS128K32XXX

Contextual Info: WS128K32-XXX / EDI8C32128C HI-RELIABILITY PRODUCT 128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595 FEATURES • ■ ■ ■ ■ ■ Access Times of 15, 17, 20, 25, 35, 45, 55ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging Commercial, Industrial and Military Temperature Ranges

WS256K64-XG4WX

Contextual Info: WS256K64-XG4WX 256Kx64 SRAM MODULE ADVANCED* FEATURES • Access Times 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: ■ Commercial, Industrial and Military Temperature Range ■ 5 Volt Power Supply ■ Low Power CMOS • 116 lead, 40mm, Hermetic CQFP Package 504