TSOP 50 PACKAGE Search Results

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)

400MIL

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)

50-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) 50-pin plastic TSOP (II) (FPT-50P-M06)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) 50-pin plastic TSOP (II) (FPT-50P-M05)

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Contextual Info: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)

eb240

Contextual Info: 50P3G-F Plastic 50pin 400mil TSOP (LOC) EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 40 36 26 Recommended Mount Pad E Symbol 1 15 11 25 A D e L c L1 HE ME 50 I2 F y b A2 Detail F A A1 A2 b c D E e HE L

Contextual Info: PRELIMINARY MICRON I TECHNOLOGY, 1 6 M l n b XAM INC. FEATURES 50-Pin TSOP V cc DQ0 DQ1 V ssQ DQ2 DQ3 V ccQ DQ4 DQ5 V ssQ DQ6 DQ7 V ccQ DQ M L W E# C AS# RAS# C S# BA A10 A0 A1 A2 A3 V cc MARKING 1M16 • Plastic Package - OCPL 50-pin TSOP 400 mil TG • Timing

44-P-400-0

Abstract: 44P4000
Contextual Info: 50P3W-L Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 50 36 26 E Recommended Mount Pad Symbol 1 11 15 25 A D e L c L1 HE ME 40 l2 F y b A2 Detail F A1 A A1 A2 b c D E e HE L L1

Contextual Info: 50P3W-M Plastic 50pin 400mil TSOP EIAJ Package Code TSOP II 50/44-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 25 E Recommended Mount Pad Symbol 50 40 36 26 A c L D L1 HE ME 15 l2 11 1 e y b A2 Detail F A A1 A2 b c D E e HE L L1 y

TSOP package tray

Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Contextual Info: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117

Contextual Info: DRAM PART NUMBERING HY 51 X XX XXX X XX XX - XX HYUNDAI SPEED Memory Products 45 45ns 50 50ns 60 60ns 70 70ns PRODUCT GROUP 51 : DRAM PACKAGE PROCESS & POWER SUPPLY BLANK : CMOS, 5.0V J 300mit SOJ V : CMOS, 3.3V JC 400mit SOJ T 300mil TSOP-II TC 400mil TSOP-il

Contextual Info: PRELIMINARY MICRON 4 MEG x 16 EDO DRAM I MT4LC4M16R6 DRAM FEATURES PIN ASSIGNMENT Top View OPTIONS 50-Pin TSOP (DB-7) Vcc DQ1 DQ2 DQ3 DQ4 Vcc DQ5 DQ6 DQ7 DQ8 NC Vcc WE# RAS# NC NC NC NC A0 A1 A2 A3 A4 A5 Vcc MARKING • Package Plastic TSOP (400 mil) TG

ion lithium battery ev

Abstract: MM1532 MM1639 MM1332 MM1333 MM1433 MM1438 MM1475 MM1485
Contextual Info: MITSUMI IC For Charging Lithium - ion Batteries Temperature conditions A: Ta=-25~75°C, B: Ta=-20~70°C, C: Ta=0~50°C, D: Ta=0~40°C Package SOP-8C, 8E VSOP-8A, 8B TSOP-16A MM1332 MM1333 VSOP-16A TSOP-24A AF 4.100±0.050 B 1cell BF 8.200±0.100 B 2cell CF

Contextual Info: 184PIN DDR400 Unbuffered DIMM 512MB With 32Mx8 CL2.5 JM366D643A-50 Description Placement The JM366D643A-50 is a 64Mx64bits Double Data Rate SDRAM high-density for DDR400. The JM366D643A-50 consists of 16pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048

Contextual Info: 184PIN DDR400 Unbuffered DIMM 256MB With 32Mx8 CL2.5 JM334D643A-50 Placement Description The JM334D643A-50 is a 32M x 64bits Double Data Rate SDRAM high-density for DDR400.The JM334D643A-50 consists of 8pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M01 Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 50-pin plastic TSOP II (FPT-50P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max)

Contextual Info: 32Mx4, 50 - 60ns, TSOP Stack 30A221-10 A M-Densus 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RKY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP

30A221-00

Contextual Info: 32Mx4, 50 - 60ns, TSOP Stack 30A221-00 A M-Densus 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M02 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)

50-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M02 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

50-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M01 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Normal bend Sealing method

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06)