TSOP 50 PACKAGE Search Results

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

Contextual Info: PRELIMINARY MICRON I TECHNOLOGY, 1 6 M l n b XAM INC. FEATURES 50-Pin TSOP V cc DQ0 DQ1 V ssQ DQ2 DQ3 V ccQ DQ4 DQ5 V ssQ DQ6 DQ7 V ccQ DQ M L W E# C AS# RAS# C S# BA A10 A0 A1 A2 A3 V cc MARKING 1M16 • Plastic Package - OCPL 50-pin TSOP 400 mil TG • Timing

Contextual Info: PRELIMINARY MICRON 4 MEG x 16 EDO DRAM I MT4LC4M16R6 DRAM FEATURES PIN ASSIGNMENT Top View OPTIONS 50-Pin TSOP (DB-7) Vcc DQ1 DQ2 DQ3 DQ4 Vcc DQ5 DQ6 DQ7 DQ8 NC Vcc WE# RAS# NC NC NC NC A0 A1 A2 A3 A4 A5 Vcc MARKING • Package Plastic TSOP (400 mil) TG

BA5 marking

Abstract: DQ112-127 BA7 marking HMD4M144D9WG DQ113 BA6 marking BA6137 DQ99
Contextual Info: HANBit HMD4M144D9WG 64Mbyte 4Mx144 200-pin ECC Mode 4K Ref. DIMM Design 5V Part No. HMD4M144D9WG GENERAL DESCRIPTION The HMD4M144D9WG is a 4Mbit x 144bit dynamic RAM high-density memory module. The module consists of eight CMOS 4Mx16bit DRAMs in 50-pin TSOP packages and one CMOS 4M x 16bit DRAM in 50pin TSOP package

Contextual Info: 184PIN DDR400 Unbuffered DIMM 512MB With 32Mx8 CL2.5 JM366D643A-50 Description Placement The JM366D643A-50 is a 64Mx64bits Double Data Rate SDRAM high-density for DDR400. The JM366D643A-50 consists of 16pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048

Contextual Info: 184PIN DDR400 Unbuffered DIMM 256MB With 32Mx8 CL2.5 JM334D643A-50 Placement Description The JM334D643A-50 is a 32M x 64bits Double Data Rate SDRAM high-density for DDR400.The JM334D643A-50 consists of 8pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages and a 2048

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M01 Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 50-pin plastic TSOP II (FPT-50P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max)

Contextual Info: 32Mx4, 50 - 60ns, TSOP Stack 30A221-10 A M-Densus 128 Megabit CMOS 3.3V EDO DRAM DP3ED32MX4RKY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 64 Megabit DRAM is a member of this family which utilizes the new and innovative space saving TSOP

50-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M02 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

50-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M01 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Lead bend direction Normal bend Sealing method

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC To Top / Package Lineup / Package Index FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06)

Contextual Info: 200PIN DDR400 Unbuffered SO-DIMM 256MB With 32Mx8 CL2.5 JM434D643A-50 Placement Description The JM434D643A-50 is a 32M x 64bits Double Data Rate SDRAM high-density for DDR400. The JM434D643A-50 consists of 8pcs CMOS 32Mx8 bits Double Data Rate SDRAMs in 66 pin TSOP-II 400mil packages, and a 2048

Contextual Info: TSOP 2 50-P-400-0.80-1K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.61 TYP. 4/Feb.4,1997

Contextual Info: I ^DDS371 000 037 3 b73 TSOP — 32 50 XX Number of Contacts:. 32 — SMT — TT J 50 = .50mm Lead Spacing . Plating _ Blank = Standard Pack 5 parts/pack TP - Tape & Reel (body only) 'Fram es are packaged in vinyl bags ALL DIMENSIONS IN MILLIMETERS ± 0.3 General Tolerance

44-P-400-0

Contextual Info: TSOP 2 50/44-P-400-0.80-1K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.60 TYP. 2/Jun.11,1998

Contextual Info: “H Y U N D A I HYM5V72A224A R-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE _ with EXTENDED DATA OUT DESCRIPTION The HYM5V72A224A is a 2M x 72-bit EDO mode CMOS DRAM module consisting of two HY51V4404B in 20/26 pin SOJ or TSOP-II, four HY51V18164B 42/42 pin SOJ or 44/50 pin TSOP-II and one 2048 bit EEPROM on a 168

GS70328

Abstract: GS70328SJ-10 GS70328SJ-10I GS70328SJ-12 GS70328SJ-15 GS70328SJ-7 GS70328SJ-7I GS70328SJ-8 GS70328SJ-8I
Contextual Info: GS70328SJ/TS 32K x 8 256Kb Asynchronous SRAM SOJ, TSOP Commercial Temp Industrial Temp 7, 8, 10, 12, 15 ns 3.3 V VDD Corner VDD and VSS Features • Fast access time: 7, 8, 10, 12, 15 ns • 75/65/50/50/50 mA at max cycle rate • Single 3.3 V ± 0.3 V power supply

GS70328

Abstract: GS70328SJ-10 GS70328SJ-10I GS70328SJ-12 GS70328SJ-15 GS70328SJ-7 GS70328SJ-7I GS70328SJ-8 GS70328SJ-8I 70328
Contextual Info: GS70328SJ/TS 32K x 8 256Kb Asynchronous SRAM SOJ, TSOP Commercial Temp Industrial Temp 7, 8, 10, 12, 15 ns 3.3 V VDD Corner VDD and VSS Features • Fast access time: 7, 8, 10, 12, 15 ns • 75/65/50/50/50 mA at max cycle rate • Single 3.3 V ± 0.3 V power supply

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M08 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN PLASTIC To Top / Package Lineup / Package Index FPT-26P-M02 26-pin plastic TSOP II Lead pitch 50 mil Package width 300 mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method

m14 transistor

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14)

max2119

Abstract: 675004
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 26 PIN PLASTIC To Top / Package Lineup / Package Index FPT-26P-M05 26-pin plastic TSOP II Lead pitch 50 mil Package width 300 mil Lead shape Gullwing Lead bend direction Normal bend Sealing method

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16)