SOT74 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT746-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm A B D SOT740-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C T R e P N M L K J e2 H 1/2 e G F E D C B A ball A1 index area

Contextual Info: Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-2 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.

b0245a

Abstract: b0607 PH3055T FT3055 SOLITRON B0501A MJE280H MJE2801K MJE3055K
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 2N5877 SOT7732 SOT7732 SOT7732 SOT7742 SOT7742 SOT7742 SOT7762 ~g:gg~~ 35 40 SOT7012 SOT7475 2N2811 OTL8012 SOT3226 SOT3226 SOT3226 SOT85307 SD+;5~01 45 50 55 60 65 70 SOT85507 SOT85607 SOT85607

SOT-74

Abstract: SOT74 CDIP16 CDIP-16 philips 23
Contextual Info: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP16: ceramic dual in-line package; 16 leads; glass seal SOT74-1 8.25 max seating plane 19.94 max 296 mm Datasheet 27 mm 5.08 max 3.4 2.9 0.51 min 0.32 0.23 1.27 max 2.54 (14x) 0.51 0.38 0.254 M 7.62

Contextual Info: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E

LFBGA64

Abstract: sot744
Contextual Info: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E

MO-195

Abstract: sot747
Contextual Info: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A

Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-3 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.

D010

Abstract: sot748
Contextual Info: PDF: 2002 Apr 26 Philips Semiconductors Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.

SOT-74

Abstract: SOT74
Contextual Info: Philips Semiconductors Package outlines SOT74 16-lead dual in-line; ceramic cerdip Dimensions in mm. August 1994 1

LBGA256

Abstract: MO-192 SOT740-1 sot740
Contextual Info: PDF: 2002 Jan 09 Philips Semiconductors Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm A B D SOT740-1 ball A1 index area A E A2 A1 detail X C e1 1/2 e e ∅v M C A B b y y1 C ∅w M C T R e P N M L K

Contextual Info: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape

Contextual Info: Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-4 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA72 package SOT745-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT747-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA72: plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm D SOT747-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm A B D SOT740-2 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b 1/2 e y y1 C ∅w M C T R e P N M L K J e2 H G 1/2 e F E D C B A ball A1 index area

Contextual Info: Package outline COF 35 mm; plastic chip on foil package; 35 mm wide tape SOT748-1 X D 10 20 mm A scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 35.2 34.8 For unspecified dimensions see COF-drawing given in the subpackage code.

Contextual Info: Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

D010

Abstract: sot748
Contextual Info: PDF: 2002 Oct 18 Philips Semiconductors Package outline COF 48 mm; plastic chip on foil package; 48 mm wide tape SOT748-3 X D 10 A 20 mm scale detail X DIMENSIONS mm are the original dimensions UNIT A max. D mm 1 48.2 47.8 For unspecified dimensions see COF-drawing given in the subpackage code.