LFBGA72 Search Results

Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D B SOT856-1 A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y y1 C C A B C e e2 ball A1 index area 1 2 3 4 5 6 7 8 9 10 11

Contextual Info: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E

Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

LFBGA72

Abstract: LFBGA-72 sot856
Contextual Info: Package outline Philips Semiconductors LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 1.05 mm D SOT856-1 B A ball A1 index area E A2 A A1 C e1 e ∅v ∅w b L K J H G F E D C B A M M y1 C C A B C y e e2 ball A1 index area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA72 package SOT745-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot745

Contextual Info: Package outline Philips Semiconductors LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A e e2 ball A1

Contextual Info: XE1431 Bluetooth SoC VREGA RC Oscillator VREGD] Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs MISO VMIC_P VMIC_N NRESET CODEC PA[7:0] GPIO/UART PB[7:0]

BT 816 transistor replacement

Abstract: schematic diagram bluetooth headset
Contextual Info: SX1441 Personal Area Network Data Sheet Bluetooth 1.2 SoC Bluetooth QD ID B012209 VREGA RC Oscillator VREGD Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs

BT 816 transistor

Abstract: schematic diagram bluetooth headset block diagram bluetooth headset CoolRISC 816 CX72302 CX72303 SX1441 XE1401 XE1413
Contextual Info: Data Sheet SX1441 – Bluetooth 1.2 SoC Personal Area Network VREGA RC Oscillator VREGD Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs MISO VMIC_P VMIC_N

XE1203

Abstract: XE1203F XE1283I076TRLF XE8806A XE8807A
Contextual Info: XE1283 XE1283 433/868/915MHz low-power integrated UHF transceiver with low-power dedicated microcontroller GENERAL DESCRIPTION KEY PRODUCT FEATURES The XE1283 combines the functionality of a lowpower transceiver operating in the 433, 868 and 915 MHz license-free ISM Industry Scientific and

BT 816 transistor

Abstract: 31314 res-pre variable resistor CVSD BT 816 transistor replacement
Contextual Info: XE1431 Bluetooth SoC VREGA RC Oscillator VREGD] Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs MISO VMIC_P VMIC_N NRESET CODEC PA[7:0] GPIO/UART PB[7:0]

CoolRISC 816

Contextual Info: Preliminary Data Sheet SX1441 – Bluetooth 1.2 SoC Personal Area Network VREGA RC Oscillator VREGD Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs MISO

Contextual Info: CBTU4411 11-bit DDR2 SDRAM MUX/bus switch with 12 Ω ON resistance Rev. 4 — 18 June 2012 Product data sheet 1. General description This 11-bit bus switch is designed for 1.7 V to 1.9 V VDD operation and SSTL_18 select input levels. Each Host port pin HPn is multiplexed to one of four DIMM port pins (xDPn). The

CBTU4411EE

Abstract: JESD22-A114 JESD22-A115 JESD78 2dp1
Contextual Info: INTEGRATED CIRCUITS CBTU4411 11-bit DDR2 SDRAM mux/bus switch with 12 Ω on-resistance Product data sheet Supersedes data of 2005 Jan 07 Philips Semiconductors 2006 Sep 22 Philips Semiconductors Product data sheet 11-bit DDR2 SDRAM mux/bus switch with 12 Ω on-resistance

868-MHz

Abstract: 868m
Contextual Info: XE1283 XE1283 433/868/915MHz low-power integrated UHF transceiver with low-power dedicated microcontroller GENERAL DESCRIPTION KEY PRODUCT FEATURES The XE1283 combines the functionality of a lowpower transceiver operating in the 433, 868 and 915 MHz license-free ISM Industry Scientific and

PCA9654

Abstract: AN10441 msata tegra 250 tegra 2 UBA3070 interface of IR SENSOR with SPARTAN3 FPGA SC18IM700 demo PCF85134 PCA95xx
Contextual Info: BL Interface Products for Enterprise Network and Computing BL-IP, BL IP BU HPMS 1Q11 CONTENT 1 1. Introduction to Business Line Interface Products 2. Interface Products for Enterprise Network & Computing – – – – – I2C C-bus bus GTL DIMM U UART PCI Express

IC ax 2008 USB FM PLAYER

Abstract: STi7110 IC ax 2008 used for mp3 player le88221 PI7C9X440SL PI7C9X111SL bl3458 pi3eqx6701 PI3EQX5701 PAS5201
Contextual Info: Table of Contents PAGE 2 3 About Pericom Applications 13 Products - Signal Integrity 14 17 18 19 PCI Express ReDriver SAS/SATA/XAUI ReDriver Digital Video Signal Integrity DisplayPort, HDMI, DVI USB3 ReDriver 21 Products - Connectivity 23 25 27 33 35 45

smd code marking 56 sot23-6

Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
Contextual Info: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,

Contextual Info: CBTU4411 11-bit DDR2 SDRAM MUX/bus switch with 12 Ω ON resistance Rev. 4 — 18 June 2012 Product data sheet 1. General description This 11-bit bus switch is designed for 1.7 V to 1.9 V VDD operation and SSTL_18 select input levels. Each Host port pin HPn is multiplexed to one of four DIMM port pins (xDPn). The

BT 816 transistor

Abstract: 0x2004 BT 816 transistor replacement
Contextual Info: SX1441 Personal Area Network Data Sheet Bluetooth 1.2 SoC Bluetooth QD ID B012209 VREGA RC Oscillator VREGD Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs

Contextual Info: NXP High-Speed Muxes/Switches Supporting DP/PCIe/SATA/mSATA/SAS/USB/LVDS AC-Coupled High Speed Interfaces Summary NXP’s high-speed muxes/switches support AC-coupled and non-AC-coupled interfaces in a range of formats, from LVDS to PCI3 Gen 3. The table lists the mux/switch formats for AC-coupled interfaces.

CBTU4411EE

Abstract: HP10 JESD22-A114 JESD22-A115 JESD78 001A 2dp1
Contextual Info: CBTU4411 11-bit DDR2 SDRAM MUX/bus switch with 12 Ω ON resistance Rev. 03 — 12 October 2009 Product data sheet 1. General description This 11-bit bus switch is designed for 1.7 V to 1.9 V VDD operation and SSTL_18 select input levels. Each Host port pin HPn is multiplexed to one of four DIMM port pins (xDPn). The

CoolRISC 816

Abstract: CX72303 XE1431 CX72302 XE1401 XE1413 40* logical ex or 0x040a
Contextual Info: XE1431 Bluetooth SoC VREGA RC Oscillator VREGD] Power Management VDDBAT VREF Memory VREG_OFF Boot Loader Bluetooth Sequencer MOSI CPU NSS[4:0] RADIO SPI ROM SCK radio inputs Interface radio outputs MISO VMIC_P VMIC_N NRESET CODEC PA[7:0] GPIO/UART PB[7:0]

t06 sot23

Abstract: TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12
Contextual Info: Plastic IC Package Information Tape & Reel Tape and Reel packing system protects Pericom’s products from mechanical and electrical damage and is designed for automatic pick-and-place equipment. Pericom’s tape and reel specifications are in compliance with Electronics Industries Association standards for embossed carrier taping of sur face mount components for Automatic Handling EIA-481, current