SOT745 Search Results
SOT745 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SOT745-1 |
|
Plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm | Original | 238.03KB | 1 | ||
| SOT745-1 |
|
Footprint for reflow soldering SOT745-1 | Original | 11.35KB | 1 |
SOT745 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E |
Original |
LFBGA72: OT745-1 | |
|
Contextual Info: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11 |
Original |
LFBGA72: OT745-1 | |
|
Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA72 package SOT745-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste |
Original |
LFBGA72 OT745-1 OT745-1 | |
sot745Contextual Info: Package outline Philips Semiconductors LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A e e2 ball A1 |
Original |
LFBGA72: OT745-1 OT745 sot745 |