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    SOT-74 Search Results

    SOT-74 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MKZ36V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 36 V, SOT-23 Datasheet
    MUZ6V2
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.2 V, SOT-323 Datasheet
    MKZ30V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 30 V, SOT-23 Datasheet
    MSZ36V
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 36 V, SOT-346 Datasheet
    MKZ5V6
    		Toshiba Electronic Devices & Storage Corporation Zener Diode, 5.6 V, SOT-23 Datasheet

    SOT-74 Datasheets (16)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT740-1
    		NXP Semiconductors Footprint for reflow soldering SOT740-1 Original PDF 11.56KB 1
    SOT740-1
    		NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm Original PDF 290.21KB 1
    SOT740-2
    		NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm Original PDF 289.5KB 1
    SOT741-1
    		NXP Semiconductors Footprint for reflow soldering SOT741-1 Original PDF 11.56KB 1
    SOT741-1
    		NXP Semiconductors Plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm Original PDF 295.47KB 1
    SOT744-1
    		NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm Original PDF 236.2KB 1
    SOT745-1
    		NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm Original PDF 238.03KB 1
    SOT745-1
    		NXP Semiconductors Footprint for reflow soldering SOT745-1 Original PDF 11.35KB 1
    SOT746-1
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm Original PDF 236.17KB 1
    SOT746-1
    		NXP Semiconductors Footprint for reflow soldering SOT746-1 Original PDF 11.34KB 1
    SOT747-1
    		NXP Semiconductors Plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm Original PDF 237.7KB 1
    SOT747-1
    		NXP Semiconductors Footprint for reflow soldering SOT747-1 Original PDF 11.34KB 1
    SOT748-1
    		NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF 250.3KB 1
    SOT748-2
    		NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF 242.44KB 1
    SOT748-3
    		NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF 250.68KB 1
    SOT748-4
    		NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF 244.45KB 1