TFBGA64 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT746-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT1073-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA64

Abstract: MO-195 SOT-543
Contextual Info: PDF: 2002 Apr 11 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2

TFBGA64

Abstract: SOT-543
Contextual Info: PDF: 1999 Jun 08 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm SOT543-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4 5 6 7 8

SOT962-1

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls B D SOT962-1 A ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm scale

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls B D SOT962-2 A ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm scale

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls B D SOT962-3 A ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm scale

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-3 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

TFBGA64

Abstract: SOT543 MO-195 SOT-543
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11

SOT-543

Abstract: sot543
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

TFBGA64

Abstract: MO-195 sot746
Contextual Info: PDF: 2002 Jan 15 Philips Semiconductors Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A

Contextual Info: Package outline SOT1336-1 TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls A B D ball A1 index area A A2 E A1 detail X e1 C 1/2 e e Øv Øw b C A B C y1 C y H G e F E e2 D C 1/2 e B A 1 ball A1 index area 2 3 4 5 6 7 8 X 5 mm scale Dimensions mm are the original dimensions

Contextual Info: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm D SOT543-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3

xvYCC601

Abstract: xvYCC709 tda9989 ITU656 ws dvd 290 analog rgb to HDMI converter ic TDA9989ET K 85500 crxxx TFBGA64
Contextual Info: TDA9989 150 MHz pixel rate HDMI 1.3a transmitter with 3 x 8-bit video inputs and CEC support Rev. 02 — 11 June 2009 Product data sheet 1. General description The TDA9989 is a very low power and very small size High-Definition Multimedia Interface HDMI 1.3a transmitter. It is backward compatible DVI 1.0 and can be connected to any

stm32l052k

Contextual Info: STM32L052x6 STM32L052x8 Ultra-low-power 32-bit MCU ARM -based Cortex®-M0+, up to 64 KB Flash, 8 KB SRAM, 2 KB EEPROM, USB, ADC, DAC Datasheet - production data Features • • • • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40 to 125 °C temperature range

STM32F103xE

Abstract: LQPF100 FOOTPRINTS BGA64 LQFP100 LQFP48 LQFP64 STM32F103C8 STM32F103RB AN2606 STM32F103CBT6
Contextual Info: STM32F103x8 STM32F103xB Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces Features • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1

stm32l052k

Abstract: stm32l052
Contextual Info: STM32L052x6 STM32L052x8 Ultra-low-power 32-bit MCU ARM-based Cortex-M0+, up to 64 KB Flash, 8 KB SRAM, 2 KB EEPROM, USB, ADC, DAC Datasheet - preliminary data Features • • • • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40 to 105/125 °C temperature range

SDIO101IHE

Abstract: SDIO101 CE-ATA version 1.1 TFBGA64 SDcd MMC specification version 1.4 D2B10 smd diode H3 SDIO HOST CONTROLLER
Contextual Info: SDIO101 SD/SDIO/MMC/CE-ATA host controller Rev. 01 — 24 September 2009 Product data sheet 1. General description The SDIO101 is a SD/SDIO/MMC/CE-ATA host controller with a standard 16-bit asynchronous memory interface. The device conforms to the SD Host Standard

STM32W108

Abstract: stm32f103 DAC STM8L151 PROGRAMMER FOR STM32F103 stm32f107 stm32f103 spi stm32f105 STM32 PWM output developer kit ST10F273 programmer schematic STM32-PRIMER2
Contextual Info: 62 7x 10 M32 M8 R7 R9 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STM32 STM8 STR7 STR9 Family STM32 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins

Contextual Info: STM32L053C6 STM32L053C8 STM32L053R6 STM32L053R8 Ultra-low-power 32-bit MCU ARM -based Cortex®-M0+, up to 64KB Flash, 8KB SRAM, 2KB EEPROM, LCD, USB, ADC, DAC Datasheet - production data Features • • • Ultra-low-power platform – 1.65 V to 3.6 V power supply

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10