BGA376 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

BGA376

Abstract: MS-034 sot741 MS 034
Contextual Info: PDF: 2002 Jan 14 Philips Semiconductors Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 ∅v M C A B b 1/2 e e AB AA Y W V U T R P N M L K J H G F E

Contextual Info: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape

23X23

Abstract: PBGA376 BGA376 PRBG0376FA-A
Contextual Info: JEITA Package Code P-BGA376-23x23-1.00 RENESAS Code PRBG0376FA-A Previous Code 376FHP MASS[Typ.] 2.1g φb A A φx M S AB e A1 ZD e B D y S Index mark Laser mark S ZE E AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10111213141516171819202122

Contextual Info: Package outline BGA376: plastic ball grid array package; 376 balls SOT1094-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

R2A25416SP

Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
Contextual Info: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

FSQ510 Equivalent

Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
Contextual Info: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178