SIO2 Search Results

Al2O3

Abstract: Inductor CI100505
Contextual Info: MATERIAL DATA SHEET Material CI100505 Series Product Line Multilayer Ceramic Chip Inductor Date 04-December-2004 NO. Construction element Material group Material Weight g Materials CAS If applicable Average mass (%) 1 Ceramic Body Ceramic 0.00052 SiO2 -

SAFDC315MSP0T95R12

Abstract: murata SAW
Contextual Info: AUTOMOTIVE AUTOMOTIVE SAW FILTER FOR RKE Murata part number :SAFDC315MSP0T95 Features • Lead free component RoHs compliant . • Passivation layer :SiO2 • AEC-Q200 Compliant Package Dimensions Specification Item 4-1.50±0.15 Nominal Center Frequency(fc)

SAFDC312MSM0T00

Abstract: murata SAW
Contextual Info: AUTOMOTIVE AUTOMOTIVE SAW FILTER FOR RKE Murata part number :SAFDC312MSM0T00 Features • Lead free component RoHs compliant . • Passivation layer :SiO2 • AEC-Q200 Compliant Package Dimensions Specification 4-1.50±0.15 Item 3.0±0.2 3.0±0.2 Dot Marking(φ0.5)

honeywell hr 20

Abstract: HC1773 crystal oscillator burn-in data
Contextual Info: Military & Space Products Advance Information DUAL RATE 1773 FIBER OPTIC TRANSCEIVER HC1773 FEATURES • Fabricated with RICMOS IV Bulk CMOS 0.8 µm Process Leff = 0.65 µm • 1Mbps or 20Mbps 1773 format • Total Dose Hardness of ≥3x105 rad(SiO2)

HV200

Abstract: Si3N4
Contextual Info: HA-2640/883 Die Characteristics DIE DIMENSIONS: 93 x 68 x 19 mils ± 1 mils 2360 x 1720 x 483µm ± 25.4µm METALLIZATION: Type: Al, 1% Cu Thickness: 16kÅ ± 2kÅ GLASSIVATION: Type: Nitride Si3N4 over Silox (SiO2, 5% Phos.) Silox Thickness: 12kÅ ± 2kÅ

murata SAW

Contextual Info: SAW RESONATOR FOR RKE AUTOMOTIVE AUTOMOTIVE Murata part number : SARCC868M35BXM0 Features • Lead free component RoHs Compliant . • Passivation layer :SiO2 • AECQ200 compliant Specification Package Dimensions Item Specification(25±2°C) 3.0±0.2 3.0±0.2

Contextual Info: Product content sheet Name: SMD Crystal Type: ABMSG Glass Glass Country of origin: China Structural Substances Part Cover Part (ms/ / \ Weight Material Structural At203 5.633 ms Tio2 Cr2O3 MnO2 Co3O4 sio2 Meo Fe2O3 CaO 25.050 ms Ceramic 1 31 7-36-8 7183-46-2

HG-2

Abstract: 3060A 7471A AES chips E.04
Contextual Info: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04

275 nm

Contextual Info: rev.1.0 05.05.15 UVMAX270-50 • • • • • • • Deep Ultraviolet Light Emission Source 275 nm, 30-50 mW Multi chip LED array Thermistor TEC optionally TO3 metal can with SiO2 glass lens Water Sterilization, DNA Sequencing Description UVMAX270 is a series of AlGaN based deep UV multi chip LED arrays, typically utilizing 4-5 parallel strings (common cathode),

Contextual Info: rev.2.0 07.05.15 DUV-HL5N • • • • • Deep Ultraviolet Light Emission Source 265, 280, 310, 325, 340 nm TO5 metal can Hemispherical SiO2 lens Beam angle 6 deg. Description DUV-HL5N is a series of AlGaN based single emitter DEEP-UV LEDs in a hermetically sealed TO5 package, utilizing a

hx6228

Abstract: MIL-PRF38535
Contextual Info: Military & Space Products 128K x 8 STATIC RAM—SOI HX6228 FEATURES RADIATION OTHER • Fabricated with RICMOS IV Silicon on Insulator SOI 0.7 µm Process (Leff = 0.55 µm) • Read/Write Cycle Times ≤ 16 ns (Typical) ≤ 25 ns (-55 to 125°C) • Total Dose Hardness through 1x106 rad(SiO2)

HR2000

Abstract: HR2010 HR2065 HR2090 HR2210 HR2125 HR2340 "rad" sram
Contextual Info: RICMOS GATE ARRAYS HR2000 FAMILY FEATURES • Total Dose Hardness ≥1x106 rad SiO2 • Fabricated on Honeywell’s Radiation Hardened 0.65 µmLeff RICMOS™ IV Bulk Process • Dose Rate Upset Hardness ≥1x109 rad(Si)/sec • Array Sizes from 10K to 336K Available Gates (Raw)

SAFDC868MSN0X90R12

Abstract: SAFDC murata saw filter murata SAW
Contextual Info: AUTOMOTIVE SAW FILTER FOR RKE Murata part number :SAFDC868MSN0X90 Features • Lead free component RoHs compliant .  Passivation layer :SiO2  AEC-Q200 Compliant Package Dimensions Specification Item 4-1.50±0.15 3.0±0.2 3.0±0.2 Dot Marking(0.5)

LRIS64K

Abstract: DSASW003741
Contextual Info: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

Contextual Info: MAX 245°C PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.1590 7440-22-4

honeywell hx3000

Abstract: HX306G HX311G HX303G HX3000 HX314G
Contextual Info: HIGH PERFORMANCE SOI GATE ARRAYS HX3000 FAMILY FEATURES • Fabricated on Honeywell’s Radiation Hardened 0.28 µm Leff RICMOS V SOI Process • Maximum Clock Rates >250 MHz • Array Sizes to 1M Usable Gates • Total Dose Hardness ≥3x105 rad(SiO2 )

Contextual Info: MAX 260°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.1789

Contextual Info: ELEMENTAL ANALYSIS MAX 260°C 245°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd Resistor Thick Film MSL 1 % Normalize for BOM 0.4045 Wt. Of BOM Item g % by Wt (Comp. Item)

Contextual Info: MAX 260°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.1988

Contextual Info: MAX 245°C PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.2060 7440-22-4

Contextual Info: MAX 245°C PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.2341 7440-22-4

Contextual Info: MAX 260°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd 7440-22-4 7440-05-3 Resistor Thick Film RuO2 PbO SiO2 (silicon dioxide) B2O3 12036-10-1 1317-36-8 14808-60-7

Contextual Info: MAX 260°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Pd 7440-22-4 7440-05-3 Resistor Thick Film RuO2 PbO SiO2 (silicon dioxide) B2O3 12036-10-1 1317-36-8 14808-60-7

Contextual Info: MAX 260°C RoHS Compliant PRODUCT FAMILY Material CAS Number Alumina Ceramic Al2O3 SiO2 silicon dioxide 1344-28-1 14808-60-7 Conductor Thick Film Ag Resistor Thick Film MSL 1 % Normalize for BOM 0.8800 Wt. Of BOM Item (g) % by Wt (Comp. Item) mg/unit 0.1184