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LRIS64K Abstract: DSASW003741 Contextual Info: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):	Original	TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741	PDF

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LRIS64K

Abstract: DSASW003741
Contextual Info: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

Original

TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741

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