SILICON BLACK Search Results

ZPD 5.1 ITT

Abstract: ZPD ITT diode zener ZD 88 germanium BYY32 germanium transistor CJ 4148 ZENER BAW21 ITT ZPD 11 itt germanium diode
Contextual Info: General Information Germanium Gold Bonded Diodes Silicon Diodes Silicon Capacitance Diodes Silicon Diode Switches PIN Diodes Silicon Zener Diodes and Temperature Compensated Stabilizing Circuits Silicon Stabilizer Diodes Light Emitting Diodes Silicon Rectifiers

Infrared Phototransistor

Abstract: QEE213 QSE213 QSE214
Contextual Info: QSE213/QSE214 Plastic Silicon Infrared Phototransistor Features Description • ■ ■ ■ ■ ■ The QSE213/QSE214 is a silicon phototransistor encapsulated in a medium angle, infrared transparent, black thin plastic sidelooker package. NPN Silicon Phototransistor

Contextual Info: QSB363 / QSB363GR / QSB363YR / QSB363ZR Subminiature Plastic Silicon Infrared Phototransistor Features Description • • • • • • • • The QSB363 is a silicon phototransistor encapsulated in a black infrared transparent T-3/4 package. NPN Silicon Phototransistor

QEB363

Contextual Info: QSB363 Subminiature Plastic Silicon Infrared Phototransistor Features Description • NPN Silicon Phototransistor The QSB363 is a silicon phototransistor encapsulated in a black infrared transparent T-3/4 package. ■ T-3/4 2mm Surface Mount Package ■ Medium Wide Beam Angle, 24°

Infrared Phototransistor

Abstract: c 5802 7402 ic configuration QSB363 QEB363 QEB373 IC 7402
Contextual Info: QSB363 Subminiature Plastic Silicon Infrared Phototransistor Features Description • NPN Silicon Phototransistor The QSB363 is a silicon phototransistor encapsulated in a black infrared transparent T-3/4 package. ■ T-3/4 2mm Surface Mount Package ■ Medium Wide Beam Angle, 24°

PF42

Abstract: SFM309 SFH309P-2 SFM309P
Contextual Info: SFH309P DAYUGHT FILTER SFH309PF SIEMENS SILICON NPN PHOTOTRANSISTOR FE AT U R ES DESCRIPTION • Silicon NPN Phototransistor In Epitaxial Planar Technology The SFH309P/309PF are silicon NPN phototransistors in a standard T1 3 mm plastic package. The SFH309PF has a black daylight filter.

Contextual Info: RoHS CS32SP Silicon Diode with Silicon Oxide Passivation in a Copper Pill Package Product Environmental Data Sheet CS32SP Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact CS32SP - Package

Contextual Info: RoHS P55/CS32 Silicon Diodes with Silicon Oxide Passivation in Kovar Pill Package Product Environmental Data Sheet P55/CS32 Semiconductor Silicon Chip – Oxide Passivated Silicon with Boron Doping CAS 1E-10 Silicon Gold Plated Contact 7400-21-3 Contact P55/CS32 - Package

Contextual Info: SILICON SENSORS PHOTOINTERRUPTERS PHOTOINTERRUPTER PERFORMANCE SPECIFICATIONS Photointerrupters consist of an infrared emitting diode facing a silicon NPN phototransistor packaged in a black thermoplastic housing. The phototransistor switches from high to low

B345

Abstract: wcn1
Contextual Info: [*13 PLASTIC SILICON PHOTODARLINGTON HteuM* OPTOELECTRONICS QSC133 DESCRIPTION PACKAGE DIMENSIONS L _ .126 3.20 106(2.69) REFERENCE SURFACE The QSC133 is a silicon photodarlington encapsulated in an infrared transparent, black T-1 package. FEATURES .042 (1.07)-*

QSC11

Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • ■ ■ ■ The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. Tight production distribution PACKAGE DIMENSIONS

DM6437ZWT

Abstract: TMS320DM6437 dm6437 DM6431 A120 SPRU983 TMS320DM6431 TMS320DM6435 I2C applications DM6437 27B2
Contextual Info: TMS320DM6437/35/33/31 Digital Media Processor DMP Silicon Revisions 1.3, 1.2, 1.1, and 1.0 Silicon Errata Literature Number: SPRZ250D January 2007 – Revised January 2008 Silicon Errata SPRZ250D – January 2007 – Revised January 2008 TMS320DM643x DMP Silicon Revisions 1.3, 1.2, 1.1, and

Contextual Info: EQ PLASTIC SILICON PHOTOTRANSISTOR 0 PTOELECTRDHICS QSD422/423/424 PACKAGE DIMENSION! DESCRIPTION The QSD42X is a silicon phototransistor encapsulated in an infrared transparent, black TO-18 package. L, 190 4.83 j .178(4.52) REFERENCE SURFACE' II FEATURES

C11351

Contextual Info: ] • PLASTIC SILICON PHOTOTRANSISTOR optoelectronics QSC112/113/114 DESCRIPTION PACKAGE DIMENSIONS The QSC11X is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. FEATURES Tight production distribution. Steel lead frames for improved reliability in solder

Contextual Info: EQ PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 PACKAGE DIMENSIONS DESCRIPTION The Q S D 733 is a silicon photodarlington encapsulated in an infrared transparent, black TO -18 package. FEATURES Steel lead fram es for im proved reliability in solder

SM712GF4

Abstract: SM712G4 LynxEM4 SM712G4 BA sm712gx04 SM712GX sm712g DS90C384 LYNXEM4 LynxEM4 Graphic controller SM712GX04LF00
Contextual Info: Silicon Motion, Inc. Mobile Computer Display Controller Preliminary Version 1.2 Last Updated 1/14/03 LynxEM+ DataBook Silicon Motion , Inc. LynxEM+ Databook ® Silicon Motion , Inc. LynxEM+ DataBook Notice Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate and

Contextual Info: PLASTIC SILICON PHOTODARLINGTON OPTOELECTRONICS QSD733 PACKAGE DIMENSIONS DESCRIPTION The QSD733 is a silicon photodarlington encapsulated in an infrared transparent, black TO-18 package. U - .190 4.83 ^1 .178(4.62) V .235 (5.97) .218(5.54) T 0.030(0.76) NOM

Contextual Info: [ « n PLASTIC SILICON PHOTOTRANSISTOR OPTOELECTBOBICS QSD722/723/724 DESCRIPTION The QSD72X is a silicon phototransistor encapsulated in an infrared transparent, black TO-18 package. II FEATURES Tight production distribution. Steel lead frames for improved reliability in solder

BF524

Abstract: ADSP-BF522 ADSP-BF524 ADSP-BF526 CRC32
Contextual Info: Blackfin Embedded Processor a Silicon Anomaly List ADSP-BF522/BF524/BF526 C ABOUT ADSP-BF522/BF524/BF526(C) SILICON ANOMALIES These anomalies represent the currently known differences between revisions of the Blackfin ADSP-BF522/BF524/BF526(C) product(s)

lynx3dm

Contextual Info: Silicon Motion, Inc. Mobile Computer Display Controller Version 1.0 Last Updated 05/24/06 Lynx3DM+ Databook Silicon Motion , Inc. Lynx3DM+ Databook Silicon Motion , Inc. ® Lynx3DM+ DataBook Notice Silicon Motion®, Inc. has made best efforts to ensure that the information contained in this document is accurate and

LYNXEM4 sm712gf4

Abstract: LynxEM4 SM712G4 BA SM712GF4 BA SMI SM712 LynxEM4 Graphic controller LYNXEM4 LYNXEM4+ 27 pin display tft 8k lynxem
Contextual Info: Silicon Motion, Inc. Mobile Computer Display Controller Preliminary Version 1.3 Last Updated 4/23/03 LynxEM+ DataBook Silicon Motion , Inc. LynxEM+ Databook ® Silicon Motion , Inc. LynxEM+ DataBook Notice Silicon Motion, Inc. has made best efforts to ensure that the information contained in this document is accurate and

QED423

Abstract: QSD722 QSD723
Contextual Info: L*0 PLASTIC SILICON PHOTOTRANSISTOR OPTOELECTRONICS QSD722/723/724 PACKAGE DIMENSIONS DESCRIPTION The QSD72X is a silicon phototransistor encapsulated in an infrared transparent, black TO-18 package. FEATURES •Tight production distribution. ■Steel lead frames for improved reliability in solder

electronics sleep inducer circuit diagram

Abstract: schematic diagram cga to vga lcd power board schematic APS 254 LVB V 2.22 power line carrier communication sleep inducer sm731 SCR1F LYNX3DM ZTE MF 180 circuit
Contextual Info: Silicon Motion, Inc. Mobile Computer Display Controller Preliminary Version 1.5 Last Updated 2/6/03 SM731 Databook Silicon Motion , Inc. SM731 DataBook Silicon Motion , Inc. ® SM731 DataBook Notice Silicon Motion®, Inc. has made best efforts to ensure that the information contained in this document is accurate and

QSC113_0040D

Abstract: Infrared Phototransistor QSC112 QSC113 QSC114
Contextual Info: QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor Features Description • Tight production distribution The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package. PACKAGE DIMENSIONS ■ Steel lead frames for improved reliability in solder