PS128 Search Results

Contextual Info: YZÀ 128Kx32 SRAM MODULE PRELIMINARY* • Commercial and Industrial Temperature Ranges ■ TTL Compatible Inputs and C M O S Outputs ■ 5 Volt Pow er Supply FEATURES ■ Access Times of 17nS to 45nS ■ W PS128K32-XPJX 1/VHITE /MICROELECTRONICS Packaging

OL80m

Abstract: DPS128X32BV3 DPS128X32CV3
Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM PS128X32CV3/PS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC

ST7565S-G

Abstract: RE12864WRF-004-HC1
Contextual Info: OKAYA Electric America, Inc. SPECIFICATIONS DRAWING CODE PE-03007-037 SAMPLE CODE PS12864WRF-004-H02 This Code will be changed while mass production MASS PRODUCTION CODE RE12864WRF-004-HC1 Customer Approved Date: Sales Sign QC Confirmed Checked By Designer

Contextual Info: Dense-Pac Microsystems, Inc. ^ O PS128M8 CERAMIC 128K X 8 CMOS SRAM MONOLITHIC DESCRIPTION: The D PS128M 8 is a m o n o lith ic 128K X 8 Static Random Access M em o ry SRAM fabricated using C M O S technology. It is designed fo r use in high density, high speed, lo w po w e r applications. All pins

128depth

Contextual Info: D E N S E -P A C 2 Megabit CMOS SRAM M I C R O S Y S T E M S D PS128X16n3 DESCRIPTION: The PS128X16n3 SRAM "STACK" modules area revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCQ. Available in straight leaded, "J" leaded

Contextual Info: □PM PS128X32V3 Dense-Pac Microsystems, Inc. CERAMIC 128K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS128X32V3 “ VERSA-STACK” m od ule is a r e v o lu tio n a r y n e w m e m o ry su b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless

AL339

Abstract: 50-PIN
Contextual Info: DENSE-PAC MICROSYSTEMS 2 Megabit C M O S SRAM DPS 128X 16n 3 DESCRIPTION: The D PS128X16n3SRAM "ST A C K " modules are a revolutionary new memory subsystem using Dense-PacMicrosystems'ceramicStackable LeadlessChip Carriers SLCC . Available in straight leaded, "J" leaded

Contextual Info: □PM ~ Dense-Pac Microsystems, Inc. PS128X24V3 CERAM IC 128K X 24 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS128X24V 3 "V ER SA -STA C K " module is a re v o lu tio n a ry n e w m em o ry su b syste m using Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit CMOS SRAM D PS128M 8F/D PS128M 8N DESCRIPTION: The PS128M8 is a monolithic 128K X 8 Static Random Access Memory SRAM fabricated using CMOS technology. It is designed for use in high density, high speed, low power applications. All pins

LG CRT

Abstract: 30A03M0
Contextual Info: DENSE-PAC MICROSYSTEMS cor 2ÔE D • ETS^ IS aGQ03fiS 1 « D P C PS128M8A / ^ ■ ■ i àpi HIGH SPEED CERAMIC 128K X 8 CM O S SRAM MONOLITHIC ■ V Ï Dense-Pac Microsystems. Inc. ^ ADVANCED INFORMATION DESCRIPTION: The D PS128M 8A is a high speed monolithic

Contextual Info: □PM D P S Dense-Pac Microsystems. Inc. ^ ADVANCED INFORMATION DESCRIPTION: The D PS128M 8A is a high speed monolithic 128K X 8 Static Random Access Memory SRAM fabricated using CM O S technology. It is designed for use in high density, high speed, low power

Contextual Info: DENSE-PAC 1 Megabit CMOS SRAM M IC R O SY STEM S D P S128M 8F/D PS128M 8N DESCRIPTION: The PS128M8 is a monolithic 128K X 8 Static Random Access Memory SRAM fabricated using CMOS technology. It is designed for use in high density, high speed, low power applications. A ll pins

Contextual Info: 1 Megabit CM OS SRAM D EN SE-PA C M Ï C R O S Y S T D PS128M 8F/D PS128M 8N E M S DESC RIPTIO N : The PS128M8 is a monolithic 128K X 8 Static Random Access Memory SRAM fabricated using CMOS technology. It is designed for use in high density, high speed, low power applications. All pins

Contextual Info: 64KX4 BASED Dense-Pac Microsystems, inc. C M O S SRAM FAM ILY DESCRIPTION: The Dense-Pac 64K X4 Based Fam ily consists of static ra n d o m a c c e s s m e m o rie s S R A M S o rg a n iz e d as described below. T h ese m em ories are ideally suited for use in large

DS51685

Abstract: EJTAG Tiny Tools up 6101 s8 equivalent nomips16 PIC32MS PIC32-gcc p32mx360f512l DS51686A pic32-bin2hex DS51686
Contextual Info: MPLAB C32 C COMPILER USER’S GUIDE 2007 Microchip Technology Inc. DS51686A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.

256kx8 sram 5v

Abstract: 50-PIN
Contextual Info: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS PS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The PS128X16Cn3/PS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .

DPS128X32CV3

Abstract: 2CV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/PS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ

Contextual Info: T T PS128K32XV-XPJX M/HITE /MICROELECTRONICS 128Kx32 SRAM 3.3V MODULE PRELIM INARY* FEATURES • A c c e s s T i m e s o f 1 5 , 1 7 , 20, 25, 3 5 n s G2 P in o u t f o r U p g r a d e Path t o M i l i t a r y G ra d e D e vice ■ P a cka g in g : L o w P o w e r O p e r a tio n

Contextual Info: OKAYA Electric America, Inc. SPECIFICATIONS CUSTOMER : SAMPLE CODE : This Code will be changed while mass production MASS PRODUCTION CODE : RE12864WRF-004-HL3 Customer Approved Date: Sales Sign QC Confirmed Checked By Designer Approval For Specifications Only.

6001.005

Abstract: a724 64KX32 64KX4 DO001
Contextual Info: DENSE-PAC MICROSYSTEMS 07E D | 57Se 41S ODQaiMO O | 64KX4 BASED Dense-Pac Microsystems, Ine. CM O S SRAM FAMILY -7 = *ñ -¿> 3 -/Q y '- DESCRIPTION: The Dense-Pac 64KX4 Based Family consiste of static random acce ss m em ories SRA M S) organized as described below.

Contextual Info: 年月日 D A T E CN NO. 変 更 内 容 DESCRIPTION SJ013740 11 28/MAR/1997 39708 REDRAWN 12 05/DEC/1997 41112 13 25/JUL/2014 008360 図面番号 DRAWING NO. B PART NO. PS-2SD-D4T1-* PS-4SD-D4T1-* PS-6SD-D4T1-*

WPS128K32X-XPJX

Contextual Info: T T PS128K32X-XPJX M/HITE /MICROELECTRONICS 128Kx32 SRAM MODULE PRELIMINARY* FEATURES • A c c ess T im e s of 15, 17, 20, 25, 35ns G2 P in o u t fo r U p g rad e Path to I M ilitary G rade D evice ■ Packaging: 5 V o lt P o w e r S up p ly • 68 Lead, P la stic PLCC, 24.71 mm 0.973 inch sq ua re

PS-128A

Abstract: TVCCD-32MACOL PS-12CCD
Contextual Info: w w w. m o n a c o r. c o m D 1 A CH CCTV-Farbkameramodul mit Mikrofon Verwendungsmöglichkeiten Das Farbkameramodul mit Fixfokus-Objektiv eignet sich für den Einsatz in Überwachungs- und Alarmanlagen. Dank der geringen Abmessungen läßt es sich optimal als Türspion oder versteckte Überwachungskamera verwenden.

car spy

Abstract: tvccd TVCCD-32M 4 pole 3.6 mm jack 4 pole 3.5 mm jack TVCCD-30MP electromagnetic parking sensor parking aid
Contextual Info: TVCCD-30M Best.-Nr. 19.2500 TVCCD-30MP Best.-Nr. 19.2520 TVCCD-32M Best.-Nr. 19.2540 D 1 A CH Schwarzweißkameramodule Verwendungsmöglichkeiten Die Schwarzweißkameramodule in Subminiaturausführung sind speziell für den Einsatz in Überwachungs- und Alarmanlagen konzipiert und lassen sich