PACKAGE G34 Search Results

APA600

Abstract: AA23 APA075 APA1000 APA150 APA300 APA450 APA750
Contextual Info: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP Note For Package Manufacturing and Environmental information, visit the Package Resource center at . v5.8 2-1 ProASICPLUS Flash Family FPGAs

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * * * * * * Package in 12mm tape on 7" diameter reels. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. EIA STD package. I.C. compatible.

Contextual Info: LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * * * * * * Package in 12mm tape on 7" diameter reels. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. EIA STD package. I.C. compatible.

TYAD00AC00BUGK

Abstract: SCR Handbook, rca GBNAND P-FBGA224-1218-0 THGV ACMD18 ACMD42 p-fbga224 Toshiba confidential NAND THGVS1G3D1CXGI1
Contextual Info: TYAD00AC00BUGK TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS TENTATIVE Low Power SDRAM, Nand E2PROM and Giga Byte Nand E2PROM Mixed Multi-Chip Package DESCRIPTION Lead-Free The TYAD00AC00BUGK is a mixed multi-chip package containing a 1,073,741,824-bit 536,870,912-bit x 2devices

AX125

Abstract: FBGA 896 896-Pin
Contextual Info: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at

729-Pin

Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
Contextual Info: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at

Contextual Info: HL-188H181WC1 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features •ESPECIAL FIGURE LAMP LED •LOW POWER CONSUMPTION. •WIDEVIEWING ANGLE. •IDEAL FOR BACKLIGHT AND INDICATOR. •PACKAGE: 1000PCS / BAG. Package Dimensions

Contextual Info: MCD Electronics Inc. MCDL-3014WC MCDL-3014WC ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features φ3 LAMP LED. LOW POWER CONSUMPTION. COMBINED VIEWING ANGLE. IDEAL FOR BACKLIGHT AND INDICATOR. PACKAGE: 500PCS / BAG.

CX28500

Abstract: CX28500EBG iso 3309 DSLAM AM31 conexant dsl Topaz 512 IRS 8342
Contextual Info: CX28500 Multichannel Synchronous Communications Controller Data Sheet 500052D November 2002 Ordering Information Model Number Package Operating Temperature CX28500EBG 35 mm TBGA –40–85 °C Revision History Revision Level Date Description A — July 2001

Contextual Info: CX28500 Multichannel Synchronous Communications Controller Data Sheet 500052C July 2002 Ordering Information Model Number Package Operating Temperature CX28500EBG 35 mm TBGA –40–85 °C Revision History Revision Level Date Description A — July 2001 B

VT2021

Abstract: CX2834x
Contextual Info: CX28500 Multichannel Synchronous Communications Controller Data Sheet 28500-DSH-002-B June 2004 Ordering Information Model Number Package Operating Temperature CX28500EBG 35 mm TBGA –40–85 °C Revision History Revision Level Date Description 500052A —

CX28500G-12

Abstract: DSLAM AM31 rbs 6102 sync mechanism AJ 11P power line communication transitter modem 21694 CX28500 CX28500EBG conexant dsl Topaz 512
Contextual Info: CX28500 Multichannel Synchronous Communications Controller Data Sheet 28500-DSH-002-C Mindspeed Technologies Mindspeed Proprietary and Confidential October 2006 Ordering Information Model Number Package Operating Temperature CX28500EBG 35 mm TBGA –40 – 85 °C

P4488

Abstract: G5832-05 G5832-11 KI80 pbse B1920-01 a7050
Contextual Info: Pyroelectric Detectors Ideally suited for human body sensing and simplified analytical instruments Broad spectral response Operates at room temperature Low cost Thermally-Compensated Types Single Element Including a thermal compensation element in the same package, these

P4488

Abstract: P4488-02 G5832-02 C4159 b617 G3476 a7050 P394 series G5832-05 P3782-12
Contextual Info: Pyroelectric Detectors Ideally suited for human body sensing and simplified analytical instruments Broad spectral response Operates at room temperature Low cost Thermally-Compensated Types Single Element Including a thermal compensation element in the same package, these

LT1962 Series

Abstract: 08 ltpt 100 20 LT1962EMS8 LT1962 LT1962-3 LT1962-5 LTPQ MARKING LTPR
Contextual Info: LT1962 Series 1 LT1962 Series W W W AXI U U ABSOLUTE RATI GS U U W PACKAGE/ORDER I FOR ATIO Note 1 IN Pin Voltage . ±20V OUT Pin Voltage . ±20V Input to Output Differential Voltage (Note 2) . ±20V

Contextual Info: CHA4863-QGG RoHS COMPLIANT 17-24GHz Variable Gain Amplifier GaAs Monolithic Microwave IC in SMD leadless package Description The CHA4863-QGG is a variable gain broadband four stage monolithic amplifier. It is designed for a wide range of applications, typically

AB244A

Abstract: R488A AD9361 AK2177 CMOS-9HD UPD65891 N526A PD65891 tqfp 64 thermal resistance nec PD65881
Contextual Info: Design Manual CMOS Gate Array, Embedded Array Package Ver. 4.0 Target Series CMOS-N5 Series CMOS-9HD Series CMOS-10HD Series EA-9HD Series Document No. A16400EJ4V0DM00 4th edition Date Published December 2004 NS CP(N) NEC Electronics Corporation 2002

SMD MARKING CODE h23

Abstract: marking G33
Contextual Info: Z-Power LED X10490 Technical Data Sheet RoHS Specification SSC-STW8T16C SSC-STW8T16C March 2013 www.seoulsemicon.com : SSC-QP-7-07-12 Rev.01 Z-Power LED X10490 Technical Data Sheet STW8T16C Description This surface-mount LED comes in standard package dimension.

BVces

Abstract: diagram induction AN7254 AN7260 G34N100E2 HGTG34N100E2
Contextual Info: HGTG34N100E2 34A, 1000V N-Channel IGBT April 1995 Features Package • 34A, 1000V JEDEC STYLE TO-247 • Latch Free Operation • Typical Fall Time - 710ns EMITTER COLLECTOR GATE COLLECTOR BOTTOM SIDE METAL • High Input Impedance • Low Conduction Loss

XC2VP40

Abstract: ultra fine pitch BGA XC2VP2-FG256 XC2VP100 XC2VP70 FF1704 pinout AF103 diode t25 4 L9 AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 FF672 XC2VP50
Contextual Info: 299 Virtex-II Pro Platform FPGAs: Pinout Information R DS083-4 v3.1.1 March 9, 2004 This document providnes Virtex-II Pro Device/Package Combinations and Maximum I/Os and Virtex-II Pro Pin Definitions, followed by pinout tables, for these packages: •

460BI2

Abstract: MARKING GI sot23-3 sot23 LTH8 FEW SOT23-3 F11 SOT23-3 marking g31 sot23
Contextual Info: LT1460 Micropower Precision Series Reference Family FEATURES DESCRIPTION n The LT 1460 is a micropower bandgap reference that combines very high accuracy and low drift with low power dissipation and small package size. This series reference uses curvature compensation to obtain low temperature

J112 spice model

Abstract: ag32 agere c8 c1 J111 spice model P1A21
Contextual Info: Hardware Design Guide February 21, 2003 TMXL33625 HypermapperLite 622/155 Mbits/s SONET/SDH x DS3/E3 1 Introduction The documentation package for the TMXL33625 HypermapperLite 622/155 Mbits/s SONET/SDH x DS3/E3 system chip consists of the following documents:

20D17

Contextual Info: TMS416160A, TMS418160A TMS426160A, TMS426160AP, TMS428160A, TMS428160AP 1048576-WORD BY 16-BIT HIGH-SPEED DRAMS SMKS891B - AUGUST 1996 - REVISED MARCH 1997 DGE PACKAGE TOP VIEW This data sheet is applicable to all TMS41x 160As and TMS42x160A/Ps symbolized by Revision ‘E ” and subsequent

AA30

Abstract: AA34 AB30 M21120 NCN30
Contextual Info: M21120 34 x 34 3.2 Gbps Crosspoint Switch with Input Equalization Data Sheet Features - 4 Terminal Descriptions - 5 Specification Tables - 7 Functional Description - 17 Register Information - 21 Package Information - 29 World Wide Sales Companies - 38 21120-DSH-001-B, 3/27/03