PACKAGE DRAWINGS Search Results

PACKAGE DRAWINGS Result Highlights (5)

Part	Manufacturer	Description	Download
54ACT825/QKA	Rochester Electronics LLC	54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP	PDF
TPH1R306PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N)	Datasheet
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)	Datasheet
TPH9R00CQ5	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N)	Datasheet
TPHR8504PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N)	Datasheet

PACKAGE DRAWINGS Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
SO20 Package Abstract: SO8 package BGA and QFP Package 44 pin plcc package drawing fg676 packages pc44 plcc how package PQ304 SOIC package Contextual Info: Package Drawings R Package Drawings Ceramic DIP Package - DD8 0-28 R Package Drawings Plastic DIP Package - PD8 11 0-29 R Package Drawings SOIC and TSOP Packages - SO8, VO8 0-30 R Package Drawings SOIC Package - SO20 11 0-31 R Package Drawings PLCC Packages - PC20, PC28, PC44, PC68, PC84	Original	CS144 CS280 280-BALL CS280) PG475, PG559 CB100 XC3000 CB164 XC3000) SO20 Package SO8 package BGA and QFP Package 44 pin plcc package drawing fg676 packages pc44 plcc how package PQ304 SOIC package	PDF
TO111 package Abstract: TO61 package TO63 package MOSFET F24 S06 rectifier Contextual Info: PACKAGE OUTLINE DRAWINGS TO-18 PACKAGE TO-5 PACKAGE —seâtaao h i m TO-33 PACKAGE 0Ct9 t?s 1 tf— II i-t 4'fiC> ?y H TO-72 PACKAGE TO-3 PACKAGE MODIFIED TO-3 PACKAGE 60mil pins SE* Ft t -L SEATU 'i "01I6 02' °’6 .225 205 JO -66 PACKAGE F-24 PACKAGE	OCR Scan	60mil O-111 LCC-28 nms-11 TO111 package TO61 package TO63 package MOSFET F24 S06 rectifier	PDF
PGA 1027 Abstract: SO20 Package SO8 package BGA and QFP Package bg22 transistor CB228 PG68 PQ304 TQ100 PC44 Contextual Info:  November 13, 1997 Version 1.2 Package Drawings 10* Package Drawings Ceramic DIP Package - DD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Plastic DIP Package - PD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	Original	PG223, PG299 PG411 PG475, PG559 CB100 XC3000 CB164 CB100, CB164, PGA 1027 SO20 Package SO8 package BGA and QFP Package bg22 transistor CB228 PG68 PQ304 TQ100 PC44	PDF
TSOP 1138 Abstract: BG560 CS144 CS48 PC44 PC84 SO20 VQ44 HQ10 CB228 Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8	Original	11-sion CB100, CB164, CB196 XC4000 CB228 FG256 FG456 FG600 FG680 TSOP 1138 BG560 CS144 CS48 PC44 PC84 SO20 VQ44 HQ10 CB228	PDF
CS48 Abstract: package drawings Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Chip Scale Package - CS48 10-22 June 19, 1998 (Version 1.0)	Original		PDF
Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic DIP Package - DD8 10-22 November 13, 1997 (Version 1.2)	Original		PDF
SSOP20 300 mil Abstract: DIP20 SC603 Package Outline philips ic06 Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3	Original	OT27-1 OT38-4 OT146-1 OT101-1 OT222-1 OT117-1 OT96-1 OT108-1 OT355-1 MO-153AD SSOP20 300 mil DIP20 SC603 Package Outline philips ic06	PDF
land pattern for sot109-1 Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products	Original	DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint	PDF
Contextual Info: Digital Attenuator Outline Drawings .625” Gullwing Package SG4 .800” x 1.37” DIP Package (DP5) .990” x 1.99” DIP Package (DP8) - 466 - Digital Attenuator Outline Drawings .775” Sq. DIP Package (DP11) Attenuator SMA Connectorized Housing 1	OCR Scan		PDF
TO8 package Abstract: SM19 TO -8 package Contextual Info: Amplifier Outline Drawings TO-8 Package T4 TO-8B Package (T8) TO-12 Package (T7) TO-39 Package (T10) .500” Fiatpack (FP4) .625”Gullwing (SG4) - 460- Amplifier Outline Drawings .450” Sq. Surface Mount (SM-3) .375” Sq. Surface Mount (SM-11) .188 j— a ( .050 db.015	OCR Scan	SM-11) SM-19) TO8 package SM19 TO -8 package	PDF
package drawings Abstract: 16pin 617 Contextual Info: General Information Package Drawings UNITRODE CORPORATION • 5 FORBES ROAD LEXINGTON. MA 02173 • TEL. 617 861-6540 TWX (710) 326-6509 • TELEX 95-1064 12-27 P R IN T E D IN U .S A General Information Package Drawings 3-Pin TO-220 T Package TO-3 Metal K Package	OCR Scan	O-220 16-Pin DIL-16 24-Pin package drawings 16pin 617	PDF
Contextual Info: Package Drawings Unit = Inch mm Glass DO-35 DO7 DO-15 Glass / Plastic DO-41 D-1 Package Drawings Unit = Inch (mm) DO-201AD A-405 R-1 R-6 D-2 Package Drawings Unit = Inch (mm) HVM without Terminal Ends RA / SRA Mini MELF DL-41 / MELF D-3 Package Drawings	Original	DO-35 DO-15 DO-41 DO-201AD DL-41 O-220AB O-220AC OT-23 DO-214AA DO-214AB	PDF
TO8 package Abstract: Linearizer SQ package SG412 Contextual Info: Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings 5 Pin TO-8 Package T5 .625” Sq. Package (SG4) 12 Pin TO-8B Package (T9) - 468- Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings SMA Connectorized Housing	OCR Scan		PDF
Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings BGA Packages - BG225 10-32 November 13, 1997 (Version 1.2)	Original	BG225	PDF

PG68 Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic PGA Packages - PG68, PG84 10-36 November 13, 1997 (Version 1.2)	Original		PDF
Contextual Info: Case Outlines A letter suffix to the MECL logic function part number is used to specify the package style see drawings below . See appropriate selector guide for specific packaging available for a given device type. 8-Pin Package SO–8 D SUFFIX PLASTIC SOIC PACKAGE	Original	49ANSI	PDF
FG256 Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ball Fine Pitch Packages - FG256 11 February 2, 1999 (Version 1.3) 11-55	Original	FG256 FG256	PDF
XC4000 Abstract: CB100 CB164 Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic Brazed QFP Packages - CB100, CB164, CB196 (XC4000 Version) 10-46 November 13, 1997 (Version 1.2)	Original	CB100, CB164, CB196 XC4000 CB100 CB164	PDF
Contextual Info: PACKAGE DRAWINGS Package Typo Page D u a l-in -L in e , Ceramic, 0 3“ W idth. 8 through 22 p in s .244	OCR Scan		PDF
TO8B Abstract: DIP package Contextual Info: Switch Outline Drawings 5 Pin TO-8 Package T5 12 Pin TO-8B Package (T9) /" -6QQ !2 X .2 5 0 TYP .100 TYP —I / @ © v ’ @, ®\ •A V\ » S2X 0,01 9 / . 0 16 \j^ © © © i .2 0 0 TYP .4 0 0 TYP MAX .498” x .870” DIP Package (DP3) .800” x 1.370” DIP Package (DP5)	OCR Scan		PDF
transistor 13005 Abstract: 13005 2 13005 13006 SO20 Package SO24 package 13005 equivalent SO16 package 13005 a he 13005 Contextual Info: SO–Packages Package SO8–16 5.2 4.8 Dimensions in mm ”L” 3.7 1.4 0.2 1.27 0.4 0.25 0.10 ”X” 3.8 6.15 5.85 Package SO8 SO16 min ”L” 5.00 10.00 ”X” max 4.85 3.81 8.89 9.85 technical drawings according to DIN specifications 13005 1 Package SO20–28	Original	Aug-96 transistor 13005 13005 2 13005 13006 SO20 Package SO24 package 13005 equivalent SO16 package 13005 a he 13005	PDF
dallas 2430A Abstract: BF422 EQUIVALENT DS2430A T equivalent DS2430AP T Contextual Info: DS2430A 256-Bit 1-Wire EEPROM ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package	Original	DS2430A 256-Bit 64-bit 48-bit 56-G0006-001A 56-G0006-003A DS2430AX dallas 2430A BF422 EQUIVALENT DS2430A T equivalent DS2430AP T	PDF
Contextual Info: C în A V w iH W v * Corporatia n * SIGNAL PROCESSING EXCELLENCE PACKAGE DRAWINGS Package Type Page D ual-in-Line, Plastic, 0.3" Width, 8 through 22 p in	OCR Scan		PDF
Contextual Info: Part Number: XZMDH95W-2 PRELIMINARY SPEC PATENT PENDING XZMDH95W-2 Features PLCC-4 PACKAGE. SINGLE COLOR. HIGH LUMINANCE. HIGH POWER,OPERATING CURRENT @ 350MA. SUITABLE FOR ALL SMT ASSEMBLY METHODS. PACKAGE : 300PCS / REEL. RoHS COMPLIANT. Outline Drawings	Original	XZMDH95W-2 350MA. 300PCS XDSA9256 XDSA9256	PDF

PACKAGE DRAWINGS Search Results

PACKAGE DRAWINGS Result Highlights (5)

PACKAGE DRAWINGS Datasheets Context Search

SO20 Package

TO111 package

PGA 1027

TSOP 1138

CS48

SSOP20 300 mil

land pattern for sot109-1

TO8 package

package drawings

TO8 package

PG68

FG256

XC4000

TO8B

transistor 13005

dallas 2430A